List of Electronic Components and Modules products

  • classification:Electronic Components and Modules

7966~8010 item / All 61127 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!

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  • Other machine tools

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We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!

Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)

Contributing to the visualization of the office environment and improving comfort!

  • Other electronic parts

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We monitor the air quality in schools to maintain a comfortable environment.

  • Other electronic parts

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https://cmcre.com/archives/140874/

  • Technical and Reference Books
  • Lithium-ion battery
  • Secondary Cells/Batteries

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July 22 Lithium-ion Battery Remaining Charge and Degradation Estimation Webinar

■Title "Explanation of Remaining Capacity and Degradation Estimation Techniques for Optimal Management of Lithium-Ion Batteries … Focusing on Operating Principles, Modeling, and Control Methods, with Perspectives by Battery Type and Application for EVs, HEVs, and PHEVs" This seminar provides a systematic learning experience on optimal management techniques for lithium-ion batteries widely used in EVs, HEVs, and PHEVs, covering everything from battery operating principles to modeling, remaining capacity estimation, and degradation diagnosis. It will explain the construction of equivalent circuit models, high-precision remaining capacity estimation using Kalman filters, and degradation diagnosis methods using Recursive Least Squares (RLS), all based on an understanding of the fundamentals of Battery Management Systems (BMS). Additionally, the latest trends in simulation and implementation methods using MATLAB, as well as lifespan prediction technologies, will be introduced. This content is ideal for engineers involved in battery development, BMS design, and EV-related technologies. ■Event Details Date and Time: July 22, 2026 (Wednesday) 10:30 AM – 4:30 PM Instructor: Masahiro Fukui (Professor, Department of Electronic Information Engineering, Ritsumeikan University) Participation Fee: 55,000 yen (tax included) *Price for our newsletter subscribers (registration is free): 49,500 yen (tax included) Delivery Format: Live streaming via Zoom

The latest version summarizing changes in domestic and international laws, regulations, and standards from 2023 to 2025, divided into chapters!

  • Lithium-ion battery
  • Technical and Reference Books
  • Secondary Cells/Batteries

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20260722リチウムイオン蓄電池最適管理のための残量・劣化推定技術解説.png

July 22 Lithium-ion Battery Remaining Charge and Degradation Estimation Webinar

■Title "Explanation of Remaining Capacity and Degradation Estimation Techniques for Optimal Management of Lithium-Ion Batteries … Focusing on Operating Principles, Modeling, and Control Methods, with Perspectives by Battery Type and Application for EVs, HEVs, and PHEVs" This seminar provides a systematic learning experience on optimal management techniques for lithium-ion batteries widely used in EVs, HEVs, and PHEVs, covering everything from battery operating principles to modeling, remaining capacity estimation, and degradation diagnosis. It will explain the construction of equivalent circuit models, high-precision remaining capacity estimation using Kalman filters, and degradation diagnosis methods using Recursive Least Squares (RLS), all based on an understanding of the fundamentals of Battery Management Systems (BMS). Additionally, the latest trends in simulation and implementation methods using MATLAB, as well as lifespan prediction technologies, will be introduced. This content is ideal for engineers involved in battery development, BMS design, and EV-related technologies. ■Event Details Date and Time: July 22, 2026 (Wednesday) 10:30 AM – 4:30 PM Instructor: Masahiro Fukui (Professor, Department of Electronic Information Engineering, Ritsumeikan University) Participation Fee: 55,000 yen (tax included) *Price for our newsletter subscribers (registration is free): 49,500 yen (tax included) Delivery Format: Live streaming via Zoom

For environmental monitoring in clean rooms. Simultaneous measurement of CO2, temperature, humidity, and differential pressure.

  • Other electronic parts

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Multifunctional sensor module supporting quality control in food processing.

  • Other electronic parts

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Optimize the data center environment! Contributing to energy savings and stable operation.

  • Other electronic parts

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A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

  • Technical and Reference Books
  • Other semiconductors

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8/5 Webinar: Semiconductor Packaging Technology Course

■Title "Changes in Joint Structures and Packaging Responses Due to the Evolution of Semiconductors ~ Response of Resin Sealing Technology to the Increase in the Number of Joints and Narrow Pitching ~" In semiconductor packages, which are advancing in high integration, high density, and three-dimensionality, addressing the increase in joints (bumps) and narrowing of pitches has become an important challenge. In this seminar, experienced instructors will organize the changes in joint structures accompanying the evolution of semiconductor packages and explain the latest trends, challenges, and countermeasures in resin sealing technology and mounting technology. 【Knowledge Gained from the Seminar】 - Development history and latest trends of semiconductor packaging - Changes in joint structures and packaging technology - Evaluation methods for resin sealing materials and sealing technology - Sealing technology for narrow pitch bumps and reliability improvement - Challenges and countermeasures in advanced packaging 【Target Audience】 Engineers, researchers, and sales representatives from semiconductor-related companies, as well as those involved in semiconductor manufacturing, mounting, sealing materials, and packaging technology.

Adoption of NDIR method! Monitoring air quality in medical settings.

  • Other electronic parts

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Adopts NDIR method! Ideal CO2/temperature and humidity/differential pressure sensor for agricultural environmental control.

  • Other electronic parts

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Adopts NDIR method! Ideal CO2/temperature and humidity/differential pressure sensor for agricultural environmental control.

  • Other electronic parts

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NDIR method adopted! Ideal digital sensor module for ventilation control and air conditioning management.

  • Other electronic parts

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Super low dielectric with a dielectric constant of 2.2! Using lower-cost materials compared to current low dielectric materials.

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  • Other films and sheets
  • Other consumables
  • Other cable related products

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The adhesion strength of the copper foil is Max. > 20N/cm! Due to excellent workability, process costs can be reduced.

  • Other films and sheets
  • Other consumables
  • Other cable related products

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Supporting the transport of precision electronic components with Japan's manufacturing wisdom and China's abundant supply capabilities.

  • Other semiconductors
  • Conveyor
  • Conveyor

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Control of IO-Link master via RS485 communication.

  • Converters and Transducers
  • Other process controls
  • Other FA equipment

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Low water absorption (<0.1%)! Applicable for use as cable insulation and transparent antenna substrates.

  • Other films and sheets
  • Other consumables
  • Other cable related products

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High-frequency characteristics of fluororesin level! Usable as both an adhesive and a substrate for FFC.

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  • Other films and sheets
  • Other consumables
  • Other cable related products

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Good transparency and weather resistance! No discoloration or deterioration of low dielectric properties due to UV exposure.

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  • Other films and sheets
  • antenna

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This is a tape with a plastic core designed for use in clean rooms.

  • Wafer
  • Adhesive tape

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We have developed optical fibers that can be used in ultra-high temperature environments (up to 1,000°C).

  • Sensors

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Robust and versatile terminal block rated for up to 1000V and 76A.

  • Connector Terminal Block
  • PCB terminal blocks
  • Other terminal blocks

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Same Sky expands its lineup of terminal blocks (terminal blocks) / TB series, including pin headers.

The Same Sky terminal block lineup has been expanded with 77 models across four series, including 5mm pitch pin headers. We offer a diverse range of options, including screw types and screwless (push-button, lever, spring cage types), plugs (wire side) & receptacles (board side), DIN rail types, and various types of pin headers, all with a wide variety of pole counts and color options. Pitch: 2.54 / 3.5 / 3.81 / 5.0 / 5.08 / 7.5 / 7.62 / 10 / 15mm Opening direction: Horizontal, vertical, 45° UL rating: 150V ~ 600V, 2A ~ 66A IEC rating: 76V ~ 1,000V, 5A ~ 76A Pole count: 1 to 24 Mounting type: Through-hole, SMT Product introduction page >> https://samesky.co.jp/SS-Products-connector-TerminalBlock.html

We offer a range of 3W to 300W DC/DC converters for railway use.

  • Other power sources
  • Switching Power Supply

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Are you looking for highly portable medical connectors?

  • connector
  • Rectangular Connector

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Size 50x50x19mm, infinite rotation, maximum 720°/s, self-locking when power is off.

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  • Actuator
  • Other industrial robots
  • encoder

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For positioning samples in a microscope. High precision, space-saving, self-locking.

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  • Linear motor
  • Piezoelectric Devices
  • Actuator

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Compact linear stage suitable for micromanipulation.

  • Linear motor
  • Actuator
  • Piezoelectric Devices

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Affordable professional-grade! A companion for RISC-V development for beginners to veteran developers.

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  • Development support tools (ICE, emulators, debuggers, etc.)
  • Software (middle, driver, security, etc.)
  • Microcomputer

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Leave the processing of communication cables and terminal products to us!

  • cable
  • Harness
  • cable

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High precision and high reliability required in the defense and space sectors! We handle sizes from small to pancake-shaped and hole-shaped.

  • Sensors

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Quantification of anions in high-concentration sodium hydroxide solution for semiconductor manufacturing using ion chromatography.

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  • Wafer
  • Analytical Equipment and Devices
  • Semiconductor inspection/test equipment

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Evaluation of Organic Coatings on Metals Using Electrochemical Measurement Devices Based on ISO 17463 - Paints and Varnishes

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  • Etching Equipment
  • Wafer
  • Other surface treatment equipment

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Attention safety managers and designers of factories and facilities! Eliminate blind spots and improve collision prevention and awareness! This will help create a safe and comfortable working environm...

  • mirror

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[Case Study Collection] This is a collection of case studies useful for safety management and design in factories, warehouses, offices, and facilities, aimed at preventing collisions and accidents.

Curved mirrors that help prevent collisions and accidents. While orange is common for outdoor curved mirrors, for indoor use, they should be lightweight, bright, and easy to install. If it's sufficient to know that something is approaching, a mirror that shows a wide area will be fine. I hope this can serve as a reference for the places and situations you want to check. *For more details, please download the PDF document or contact us.*

Debugging and tracing module to streamline the operation verification of industrial robots.

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  • Development support tools (ICE, emulators, debuggers, etc.)
  • Software (middle, driver, security, etc.)
  • Microcomputer

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Equipment maintenance is a common challenge in manufacturing sites. We are moving from reactive maintenance to scheduled maintenance, and in the future, towards predictive/preemptive maintenance. Let'...

  • Sensors
  • Other Sensors

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It is a real-time distributed processing network that enables simultaneous effective "memory sharing (data sharing)" and "I/O control" with reduced wiring and ultra-high speed.

  • Dedicated IC
  • Other network tools

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A network is constructed to control remote I/O at ultra-high speed using "1 master IC" and "up to 63 slave ICs."

  • Dedicated IC
  • Other network tools

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This is a slave IC for DI/O control compatible with HLS. It is equipped with 16-bit input terminals and 16-bit output terminals.

  • Dedicated IC
  • Other network tools

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This is a DI/O station IC compatible with CUnet. It is equipped with 32-bit input/output terminals and allows switching of input and output in 4-bit units.

  • Dedicated IC
  • Other network tools

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This is a master and slave IC compatible with CUnet. It can be connected to the CPU using an 8 or 16-bit bus for your use.

  • Dedicated IC
  • Other network tools

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Using high-speed sampling technology, it is possible to save the waveforms of the standard/master coil and the DUT (Device Under Test) in the measuring instrument. Partial discharge testing is possibl...

  • Testing Equipment and Devices
  • transformer
  • Electrical equipment parts

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Intelligent core that completes high-precision voice recognition at the edge with Toshiba Digital Solutions RECAIUS, specialized in voice recognition.

  • Circuit board design and manufacturing
  • EMS

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IDIoT will take on the challenge! Realizing IoT systems powered up by AI (artificial intelligence)!!

  • Sensors
  • Other Sensors

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From embedded OS porting to AI implementation and ODM production. Providing one-stop support for reducing design and development man-hours. Bringing automotive-grade reliability to industrial equipmen...

  • Other electronic parts

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This is a master and slave IC compatible with CUnet. It can be connected to the CPU using Quad-SPI or SPI for use.

  • Dedicated IC
  • Other network tools

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