List of Materials products
- classification：Materials
5806～5850 item / All 38141 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
By combining parts, it is possible to produce large pallets of 2m x 4m size. Even if damaged, partial replacement is possible, making it economical. *Available from a single piece.
- palette
"Tested the toughness of the new 'Tough 1000 V1 Resin' hinge model from Formlabs by bending it!" | System Create
- 3D Printer
- Material Evaluation Test
- plastic
It is possible to compound with plastic resins that have a high melting point and to mold them! The chemical stability and resistance to acids and alkalis have improved.
- Composite Materials
Significantly improve the weaknesses of organic pigments! Protect pigments with high-density, low-porosity silica.
- Composite Materials
[Steel, Catalysts, etc., Industrial Applications] Tellurium (Te)
- Steel
- Non-ferrous metals
- Other metal materials
We will strengthen your rolls with the technology developed at our steelworks.
- Processing Contract
- roller
- alloy
The maximum possible dimensions for combustion are W1000×D1000×H480! Introducing ceramic products.
- Ceramics
Clean air environment in sports facilities with photocatalytic technology.
- Other polymer materials
Contributing to water quality purification in aquaculture! Oxidative decomposition ability and super hydrophilicity.
- Other polymer materials
Suppressing diseases with photocatalytic ability! Supporting healthy crop growth.
- Other polymer materials
Contributes to maintaining food freshness! Exhibits oxidation decomposition ability and super hydrophilicity.
- Other polymer materials
Supporting disinfection measures in medical settings with the power of photocatalysts.
- Other polymer materials
Recycle waste wood and make effective use of it as a heat source! Achieve uniform chip size!
- Wood products
- Wood processing machinery
- Other environmental equipment
Using waste wood as raw material! A crushing and sorting plant that achieves uniform chip size.
- Wood products
- Wood processing machinery
- Other environmental equipment
Use waste wood as subgrade material! Effectively utilize resources and reduce costs!
- Wood products
- Wood processing machinery
- Other environmental equipment
Recycle waste wood to contribute to cost reduction in board manufacturing and reduce environmental impact!
- Wood products
- Wood processing machinery
- Other environmental equipment
Contributing to the creation of a comfortable environment for livestock! Recycling waste wood as bedding!
- Wood products
- Wood processing machinery
- Other environmental equipment
Turning unused materials into resources! A crushing and sorting plant that achieves uniform chip size.
- Wood products
- Wood processing machinery
- Other environmental equipment
Composting waste wood! Effectively utilizing resources and contributing to soil improvement!
- Wood products
- Wood processing machinery
- Other environmental equipment
Recycle waste wood into insulation material! Achieve uniform chip size!
- Wood products
- Wood processing machinery
- Other environmental equipment
Recycle waste wood and produce mulching material! Achieve uniform chip size!
- Wood products
- Wood processing machinery
- Other environmental equipment
Turning waste wood into chips! The HMP series realizes effective resource utilization.
- Wood products
- Wood processing machinery
- Other environmental equipment
Fuel from waste wood! A crushing and sorting plant that achieves uniform chip size.
- Wood products
- Wood processing machinery
- Other environmental equipment
Contributing to cost reduction and quality improvement in pulp manufacturing!
- Wood products
- Wood processing machinery
- Other environmental equipment
Thermal adhesive film with a proven track record for semiconductor applications. Features include high insulating properties and heat resistance, making it suitable for ensuring insulation around IC c...
- Other semiconductors
- Other polymer materials
Achieves both high thermal conductivity and ease of use. Contributes to the performance improvement of industrial robots.
- Other polymer materials
- Other consumables
High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.
- Other polymer materials
- Other consumables
Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.
- Other polymer materials
- Other consumables
Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.
- Other polymer materials
- Other consumables
It enhances heat dissipation and contributes to the efficiency of power electronics.
- Other polymer materials
- Other consumables
Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.
- Other polymer materials
- Other consumables
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
- Other polymer materials
- Other consumables
It is possible to control the porous structure with a spiny morphology like that of a porcupine!
- Chemicals
It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.
- Other polymer materials
Added heat dissipation grease "TIG1500" to AD-Chemi.
SILCOOLTIG1500 is a high-performance thermal grease developed based on the silicone material technology that Momentive has cultivated over many years, with a thermal conductivity of 1.5 W/m·K. As electronic devices become more compact and high-powered, thermal materials are required to simultaneously provide "long-term stability," "reduced thermal resistance," "workability," and "reliability." TIG1500 is a highly versatile thermal compound that meets these demands in a well-balanced manner and is adopted across a wide range of industrial fields. The product is a white paste that is easy to handle and supports various application methods such as dispensing, screen printing, and stamping. Official documentation states, "This product maintains its grease properties for a long time even under severe temperature conditions, minimizing weight loss during heating." In practice, the weight loss after heating at 150°C for 24 hours is only 0.08 wt%, which is extremely low, making it suitable for thermal management in electronic devices that require long-term reliability. For more details, please visit our website.
This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.
- Rubber
- Other polymer materials
Added heat dissipation grease "TIG1500" to AD-Chemi.
SILCOOLTIG1500 is a high-performance thermal grease developed based on the silicone material technology that Momentive has cultivated over many years, with a thermal conductivity of 1.5 W/m·K. As electronic devices become more compact and high-powered, thermal materials are required to simultaneously provide "long-term stability," "reduced thermal resistance," "workability," and "reliability." TIG1500 is a highly versatile thermal compound that meets these demands in a well-balanced manner and is adopted across a wide range of industrial fields. The product is a white paste that is easy to handle and supports various application methods such as dispensing, screen printing, and stamping. Official documentation states, "This product maintains its grease properties for a long time even under severe temperature conditions, minimizing weight loss during heating." In practice, the weight loss after heating at 150°C for 24 hours is only 0.08 wt%, which is extremely low, making it suitable for thermal management in electronic devices that require long-term reliability. For more details, please visit our website.
We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.
- Rubber
- Other polymer materials
Added heat dissipation grease "TIG400BX" to AD-Chemi.
With the advancement of electronic devices, heat dissipation materials are required to have "long-term reliability," "stable thermal conductivity," and "low outgassing and low ionic impurities." SILCOOL TIG400BX is a high thermal conductivity silicone oil compound developed by Momentive, and its significant feature is the design that greatly reduces oil separation (oil bleed), which tends to be a problem with conventional oil-based greases. As stated in the TDS, "compared to conventional oil compounds, oil separation is very low, ensuring high reliability," highlighting its stability in long-term usage environments. The thermal conductivity is high at 4.0 W/mk, and it maintains performance over a wide temperature range of -40 to 150°C, making it suitable for high thermal load applications such as industrial equipment, communication devices, and automotive electronic components. The ionic impurities (Na⁺, K⁺, Cl⁻) are also extremely low, making it suitable for designs that aim to reduce the risk of corrosion in electronic components.
Controlling the bubbles changes the quality.
- Other polymer materials
Added silicone adhesive and sealant "TSE382" to AD-Chemi.
Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.
Supports wafer manufacturing process! 300℃ heat-resistant RoHS compliant silicone rubber sheet.
- Rubber
Heat management for electronic devices! Silicone rubber sheet with a heat resistance of up to 300℃.
- Rubber
We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).
- Engineering Plastics
- Other polymer materials
- plastic
Exhibited at the 40th NePCON Japan from January 21 to January 23 (Tokyo Big Sight).
Nepcon Japan is an electronics development and assembly exhibition that showcases electronic components and materials, as well as manufacturing, assembly, and inspection equipment that support the multifunctionality and high performance of electronic devices.
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials