Semiconductor Manufacturing Equipmentの製品一覧
- 分類:Semiconductor Manufacturing Equipment
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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools

Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
Industry high-level high-resolution or high-throughput maskless laser direct writing equipment
- Electron beam lithography equipment
- Other surface treatment equipment
【Exhibition Participation!】Ideal for surface modification of BGA substrates and lead frames! Achieves processing effects close to vacuum RIE plasma through the adoption of a unique system!
- Ashing device
High corrosion-resistant and durable rollers suitable for the etching process.
- Etching Equipment
We flexibly respond to everything from software and hardware design to implementation and product assembly. "Yoho's adaptability" to the challenges of various manufacturers.
- EMS
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment

Capable of accommodating large circuit board assembly in 850×500mm size.
Supports large PCB assembly with a size of 850×500mm. [Precision] Chip size: 03015 Lead pitch: 0.3mm Adjacent pitch: 0.1mm [Supported Chips] BGA, CSP, QFN, SOP, QFP, LED, etc. [Supported Sizes] Minimum size: 50mm×50mm Maximum size: 500mm×850mm Board thickness: 0.5mm to 3.0mm
If you are troubled by contamination from waste and foreign substances after cleaning, NCC will provide solutions!
- Other machine tools
- Other production management systems
- Other semiconductor manufacturing equipment
Perovskite solar cell inkjet simple coating machine
- Cells and batteries
- Coater
High-precision spray coater designed for developers for process development of various nano materials such as touch panels and fuel cells!
- Coater
For polishing various substrates and for fine burr removal in punched areas.
- Other machine tools
- Wafer processing/polishing equipment
- Special Processing Machinery

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.
- Wafer processing/polishing equipment

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Exhibiting at JIMTOF! Demonstrating tape grinding of ball screws and worms for electric vehicles! Also unveiling a newly developed outer diameter grinding machine and new technology for clogging preve...
- Wafer processing/polishing equipment
You can achieve the desired surface accuracy with a simple operation to replace the polishing film!
- Wafer processing/polishing equipment
No need for an inversion device to clean the LCD substrate on both sides simultaneously!
- Wafer processing/polishing equipment
- Circuit board processing machine
Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.
- Other processing machines
- Wafer processing/polishing equipment
A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!
- Other processing machines
- Wafer processing/polishing equipment
Achieve precision that is unstable by hand, and definitely improve yield! Easily portable tabletop model.
- Other processing machines
- Wafer processing/polishing equipment
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
- Other processing machines
- Wafer processing/polishing equipment
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
The brush mechanism allows for the removal of burrs and chips generated during cutting.
- Other processing machines
- Wafer processing/polishing equipment
We propose our polishing equipment to address the concerns of automotive parts manufacturers.
- Wafer processing/polishing equipment
- Other abrasives

Inner diameter grinding device renewal
We have renewed the demo model of the film-type inner diameter polishing machine. The maximum size of compatible workpieces has increased in both height and diameter! During test trials before the equipment is finalized, processing under conditions closer to actual operation has become widely possible. If you are having trouble managing roughness with inner diameter honing or similar processes, please consider the film-type inner diameter polishing machine!
Introducing a case study on equipment installation at an automotive parts manufacturer! We are showcasing solutions using ball screw grinding technology tailored to the concerns of automotive parts ma...
- Wafer processing/polishing equipment
- Other abrasives
Solving the concerns of electronic device manufacturers! We propose our polishing equipment.
- Other surface treatment equipment
- Wafer processing/polishing equipment
- Other abrasives
Solving various companies' problems! Introducing it clearly with comparisons to other training programs!
- Wafer processing/polishing equipment
- Other abrasives
- Other surface treatment equipment
Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.
- Other machine tools
- Wafer processing/polishing equipment
Challenge to a new film polishing method using multi-axis robots! You can watch it in the video.
- Other semiconductor manufacturing equipment
- Grinding Machine

We will exhibit at JIMTOF2024.
We will be exhibiting at the 32nd Japan International Machine Tool Fair JIMTOF2024. This time, in addition to our existing outer diameter grinding machines and robotic grinding machines, we will showcase a new internal diameter grinding machine, a new end face grinding machine, and a newly developed belt-type surface grinding machine, along with demonstrations. We will also provide explanations about the machines, discussions on film grinding, and talks aimed at specific machine development at the venue, so please come and visit us. Exhibition Location: East Hall E1039, Sanshin Corporation
Exhibition of actual machines at JIMTOF: Improving roughness and flattening of automotive parts and electrical/electronic components.
- Wafer processing/polishing equipment
- Flat/Shaped/Vertical Cutting Machine
- Processing Contract
Solving issues of labor shortages and technology transfer! An explanation of the purpose and features of Sanshin's equipment.
- Wafer processing/polishing equipment
A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!
- Wafer processing/polishing equipment

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Maximizing the features of the wrapping tape makes the intended polishing easy.
- Wafer processing/polishing equipment

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Recognize the shape of the protrusion and correct the position of the polishing center to ensure accurate protrusion correction.
- Wafer processing/polishing equipment

We will exhibit at JIMTOF 2018, the 29th Japan International Machine Tool Fair.
We will be exhibiting at JIMTOF 2018, the 29th International Machine Tool Fair. Date: November 1, 2018 (Thursday) to November 6, 2018 (Wednesday) 9:00 AM to 5:00 PM Venue: Tokyo Big Sight (Tokyo International Exhibition Center) Booth Number: East Hall 1 E 1073 We look forward to your visit.
Achieves approximately 30% space-saving compared to conventional machines! Precise finishing is possible regardless of experience level! [Patent obtained]
- Wafer processing/polishing equipment
- Engine parts
- lathe
Unlike hand grinding, this grinding unit is not affected by the operator's level of experience!
- Wafer processing/polishing equipment
Can be processed under suitable conditions! Even beginners can operate it easily.
- Other processing machines
- Wafer processing/polishing equipment
A polishing device effective for polishing various substrates and removing fine burrs from punched parts!
- Other processing machines
- Wafer processing/polishing equipment
Needle valves, for automotive small parts! Introducing the burr removal and outer diameter tape wrapping device!
- Other processing machines
- Wafer processing/polishing equipment
We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!
- Wafer processing/polishing equipment
- Other abrasives
We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a co...
- Wafer processing/polishing equipment
- Other abrasives
It can accommodate slight differences in shaft length! A device that achieves surface roughness according to the purpose.
- Other processing machines
- Wafer processing/polishing equipment
Ultra-fast, clean, and low-load. Why not optimize the TBDB (temporary bonding and debonding) process with a photonic debonding device?
- Other semiconductor manufacturing equipment
In addition to viewing information, data analysis is possible!
- Other semiconductor manufacturing equipment
- Other analyses
- Analysis Services
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
We offer a wide variety of options. We provide coating equipment tailored to your needs.
- Coater
Standard type of direct coater! We offer a wide range of options and provide suitable coating equipment.
- Coater
Introducing a three-roll coater with selectable coating methods and a digital clearance display device!
- Coater
We offer a wide range of options and provide suitable coating equipment! Precision type three-roll coater.
- Coater