Semiconductors and ICsの製品一覧
- 分類：Semiconductors and ICs
1～45 件を表示 ／ 全 4606 件
We provide manufacturing technology for neutralization, esterification, sulfonation, phosphorylation, polycondensation reactions, powder mixing, emulsification, and dispersion, etc. *We can also handl...
- Contract manufacturing
Do you have any concerns about contract manufacturing of various chemical products?
We would like to introduce the contract manufacturing services provided by Riten Chemical Co., Ltd. We are a chemical manufacturer based in Kyoto with 70 years of experience. Since our establishment, we have been developing, manufacturing, and selling various surfactants used in the textile and paper industries. Based on the technology and development capabilities we have cultivated over the years, we accept contract manufacturing of various chemical products, so please feel free to contact us. 【Contract Manufacturing Achievements】 ■ Construction waterproofing agents ■ Plant growth promoters ■ Construction waterproofing materials ■ Greening-related agents ■ Chemicals for the electronics industry ■ Wastewater treatment agents ■ Industrial preservatives ■ Special surfactants... We provide more detailed information through related products and catalogs.
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
Environmentally friendly alternative technology! Capable of producing persulfate (electrolytic sulfate).
- Other semiconductors
- Other cleaning equipment
- Other surface treatment equipment
Achieve high current while minimizing losses during implementation with Power PKG (HSOP8)!
- Transistor
Liquid hazardous materials can also be safely transported with all-fiber solutions.
- Wafer
- Resist Device
- Photomask
For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.
- Other semiconductors
Not constrained by fixed catalog sizes. You can specify the ideal length in millimeters to match thermal design and enclosure space. Additional processing can also be handled in bulk!
- Other semiconductors
Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!
- diode
Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.
- Other semiconductors
Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.
- Other semiconductors
We provide suitable solutions that meet the advanced needs of power semiconductor manufacturing!
- Other semiconductors
- Other Auto Parts
- Ceramics
Achieve automation of IC packaging with space-saving design! Inspection equipment capable of high-precision 2D and 3D dimensional measurement.
- Microcomputer
New CVS analysis device "894 Professional CVS" for measuring organic additives in copper sulfate plating baths and tin/lead baths.
- Analytical Equipment and Devices
- Plating Equipment
- Wafer
"894 Professional CVS Analyzer" capable of multi-sample continuous automatic analysis by combining a sample changer and an electric burette.
- Analytical Equipment and Devices
- Plating Equipment
- Wafer
Custom formulations for important applications
- Other semiconductors
- Other medical supplies and cosmetic manufacturing materials
FFKM solutions designed for harsh operating conditions.
- Other semiconductors
For heat dissipation of surface mount packages such as DPAK, D2PAK, and SO-8. Our compact design reliably solves thermal issues in power converters and power supply boards.
- Other semiconductors
We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!
- Other semiconductors
A page on "Cleaning evaluation of organic residue remaining after sintering" has been added.
In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.
Introduction of a high-quality and high-performance DC/DC IC and module manufacturer.
- power supply
- Other power sources
- Other semiconductors
High-performance and cost-competitive GaN devices provided by the world's largest class GaN-focused IDM.
- Transistor
- Other semiconductors
- Other electronic parts
GaN 48V motor drive solution achieving high efficiency, low heat generation, and miniaturization.
- Transistor
- Other semiconductors
- Other electronic parts