List of Other polymer materials products
- classification：Other polymer materials
406～450 item / All 4553 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Clean air environment in sports facilities with photocatalytic technology.
- Other polymer materials
Contributing to water quality purification in aquaculture! Oxidative decomposition ability and super hydrophilicity.
- Other polymer materials
Suppressing diseases with photocatalytic ability! Supporting healthy crop growth.
- Other polymer materials
Contributes to maintaining food freshness! Exhibits oxidation decomposition ability and super hydrophilicity.
- Other polymer materials
Supporting disinfection measures in medical settings with the power of photocatalysts.
- Other polymer materials
Quantification of diethylene glycol, isophthalic acid, intrinsic viscosity, and acid value in PET resin, a type of polyester, using near-infrared spectroscopy.
- plastic
- Other polymer materials
- Spectroscopic Analysis Equipment
Thermal adhesive film with a proven track record for semiconductor applications. Features include high insulating properties and heat resistance, making it suitable for ensuring insulation around IC c...
- Other semiconductors
- Other polymer materials
Achieves both high thermal conductivity and ease of use. Contributes to the performance improvement of industrial robots.
- Other polymer materials
- Other consumables
High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.
- Other polymer materials
- Other consumables
Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.
- Other polymer materials
- Other consumables
Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.
- Other polymer materials
- Other consumables
It enhances heat dissipation and contributes to the efficiency of power electronics.
- Other polymer materials
- Other consumables
Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.
- Other polymer materials
- Other consumables
Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.
- Other polymer materials
- Other consumables
It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.
- Other polymer materials
Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.
This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.
- Rubber
- Other polymer materials
Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.
We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.
- Rubber
- Other polymer materials
Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.
Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.
Controlling the bubbles changes the quality.
- Other polymer materials
Added silicone adhesive and sealant "TSE3925" to AD-Chemi.
Momentive's "TSE3925" is a one-component, moisture-curing, low-volatility silicone adhesive. It cures at room temperature by reacting with moisture in the air, forming a silicone rubber that combines flexibility and elasticity. The product has a non-flowing paste-like consistency, making it resistant to dripping after application. It ensures minimal displacement during application on vertical surfaces, inclined surfaces, and uneven areas, providing stable workability. The tack-free time is approximately 5 minutes at 23°C, demonstrating excellent fast-curing properties that contribute to shortening processes in manufacturing lines and on-site work. In terms of adhesion performance, it exhibits excellent adhesion to a wide range of substrates, including metals, various plastics, glass, and ceramics, without the need for a primer. Additionally, the content of low molecular weight siloxanes is extremely low (0.028 wt%), making it safe for use in sensitive electronic components and sensor areas where siloxane gas may cause contact failure or contamination. For more details, please check our website.
We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).
- Engineering Plastics
- Other polymer materials
- plastic
Exhibited at the 40th NePCON Japan from January 21 to January 23 (Tokyo Big Sight).
Nepcon Japan is an electronics development and assembly exhibition that showcases electronic components and materials, as well as manufacturing, assembly, and inspection equipment that support the multifunctionality and high performance of electronic devices.
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials
Stretchable conductive material with conductivity imparted to acrylic elastomer.
- Other polymer materials
For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.
- Other polymer materials
- Other consumables
For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.
- Other polymer materials
- Other consumables
Easily measure the amount of isocyanate in polyurethane products in 30 seconds with a near-infrared analyzer!
- plastic
- Other polymer materials
- Spectroscopic Analysis Equipment
It is a flexible acrylic polymer with a low Tg.
- Other polymer materials
Near-infrared spectrometer technical data 13: Easily measure the amount of isocyanate in polyurethane products in just 30 seconds with a near-infrared spectrometer!
- Other polymer materials
- plastic
- Spectroscopic Analysis Equipment
An application that simultaneously measures multiple parameters of epoxy resin using near-infrared analysis!
- plastic
- Other polymer materials
- Spectroscopic Analysis Equipment
Introducing tips for developing calibration curve models for quality control using near-infrared spectrometers in the manufacturing processes of gasoline, oil, diesel oil, lubricants, and more!
- Other polymer materials
- plastic
- Spectroscopic Analysis Equipment
Quantification of diethylene glycol, isophthalic acid, intrinsic viscosity, and acid value in PET resin, a type of polyester, using near-infrared spectroscopy.
- plastic
- Other polymer materials
- Spectroscopic Analysis Equipment
Simultaneous measurement of acid value, hydroxyl value, and moisture content in polyols, which are the raw materials for polyurethane, using near-infrared analysis.
- plastic
- Spectroscopic Analysis Equipment
- Other polymer materials
Flame retardant, high thermal conductivity, and flexible epoxy resin.
- Other consumables
- Other polymer materials