List of Other polymer materials products

  • classification:Other polymer materials

631~675 item / All 4606 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

  • Other Pumps

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Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!

We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"

Suppressing diseases with photocatalytic ability! Supporting healthy crop growth.

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  • Other polymer materials

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Contributes to maintaining food freshness! Exhibits oxidation decomposition ability and super hydrophilicity.

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  • Other polymer materials

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Supporting disinfection measures in medical settings with the power of photocatalysts.

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  • Other polymer materials

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Thermal adhesive film with a proven track record for semiconductor applications. Features include high insulating properties and heat resistance, making it suitable for ensuring insulation around IC c...

  • Other semiconductors
  • Other polymer materials

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Achieves both high thermal conductivity and ease of use. Contributes to the performance improvement of industrial robots.

  • Other polymer materials
  • Other consumables

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High thermal conductivity epoxy resin contributing to the improvement of automotive cooling performance.

  • Other polymer materials
  • Other consumables

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Achieving both high thermal conductivity and ease of use. We solve the heat dissipation challenges of semiconductors.

  • Other polymer materials
  • Other consumables

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Low-viscosity epoxy resin that solves the heat dissipation problem of high-output robots.

  • Other polymer materials
  • Other consumables

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It enhances heat dissipation and contributes to the efficiency of power electronics.

  • Other polymer materials
  • Other consumables

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Low viscosity, high thermal conductivity epoxy resin that contributes to improving the cooling performance of automobiles.

  • Other polymer materials
  • Other consumables

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Epoxy resin that enhances heat dissipation and improves the reliability of semiconductor devices.

  • Other polymer materials
  • Other consumables

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It is an adhesive that is expected to have strong adhesion to materials such as silicone rubber and foam.

  • Other polymer materials

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Added heat dissipation grease "TIG1500" to AD-Chemi.

SILCOOLTIG1500 is a high-performance thermal grease developed based on the silicone material technology that Momentive has cultivated over many years, with a thermal conductivity of 1.5 W/m·K. As electronic devices become more compact and high-powered, thermal materials are required to simultaneously provide "long-term stability," "reduced thermal resistance," "workability," and "reliability." TIG1500 is a highly versatile thermal compound that meets these demands in a well-balanced manner and is adopted across a wide range of industrial fields. The product is a white paste that is easy to handle and supports various application methods such as dispensing, screen printing, and stamping. Official documentation states, "This product maintains its grease properties for a long time even under severe temperature conditions, minimizing weight loss during heating." In practice, the weight loss after heating at 150°C for 24 hours is only 0.08 wt%, which is extremely low, making it suitable for thermal management in electronic devices that require long-term reliability. For more details, please visit our website.

This is a thin film coating agent designed to protect electronic printed circuit boards (PCBs). It protects substrates and components from mechanical and environmental corrosion.

  • Rubber
  • Other polymer materials

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Added heat dissipation grease "TIG1500" to AD-Chemi.

SILCOOLTIG1500 is a high-performance thermal grease developed based on the silicone material technology that Momentive has cultivated over many years, with a thermal conductivity of 1.5 W/m·K. As electronic devices become more compact and high-powered, thermal materials are required to simultaneously provide "long-term stability," "reduced thermal resistance," "workability," and "reliability." TIG1500 is a highly versatile thermal compound that meets these demands in a well-balanced manner and is adopted across a wide range of industrial fields. The product is a white paste that is easy to handle and supports various application methods such as dispensing, screen printing, and stamping. Official documentation states, "This product maintains its grease properties for a long time even under severe temperature conditions, minimizing weight loss during heating." In practice, the weight loss after heating at 150°C for 24 hours is only 0.08 wt%, which is extremely low, making it suitable for thermal management in electronic devices that require long-term reliability. For more details, please visit our website.

We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.

  • Rubber
  • Other polymer materials

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Added heat dissipation grease "TIG400BX" to AD-Chemi.

With the advancement of electronic devices, heat dissipation materials are required to have "long-term reliability," "stable thermal conductivity," and "low outgassing and low ionic impurities." SILCOOL TIG400BX is a high thermal conductivity silicone oil compound developed by Momentive, and its significant feature is the design that greatly reduces oil separation (oil bleed), which tends to be a problem with conventional oil-based greases. As stated in the TDS, "compared to conventional oil compounds, oil separation is very low, ensuring high reliability," highlighting its stability in long-term usage environments. The thermal conductivity is high at 4.0 W/mk, and it maintains performance over a wide temperature range of -40 to 150°C, making it suitable for high thermal load applications such as industrial equipment, communication devices, and automotive electronic components. The ionic impurities (Na⁺, K⁺, Cl⁻) are also extremely low, making it suitable for designs that aim to reduce the risk of corrosion in electronic components.

Controlling the bubbles changes the quality.

  • Other polymer materials

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Added silicone adhesive and sealant "TSE382" to AD-Chemi.

Momentive's "TSE382" is a one-component, oxime-based condensation RTV (Room Temperature Vulcanizing) silicone that reacts with moisture in the air to promote crosslinking reactions. In its uncured state, it is a low-viscosity paste, and after curing, it becomes an elastic rubber that forms a highly crosslinked siloxane network structure. Since it employs an oxime-based condensation reaction, it is a "neutral curing type" that does not release corrosive by-products such as acetic acid during the curing process. It exhibits high adhesion strength to aluminum, stainless steel, zinc die-cast, and various engineering plastics (such as ABS, PC, PBT, epoxy, etc.) without the need for surface treatment. In particular, due to the flexibility of the siloxane chains and their low surface energy, it spreads and wets the fine irregularities of the substrate surface, demonstrating a cohesive failure type of adhesion mode with high interfacial adhesion. For more details, please visit our website.

We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).

  • Engineering Plastics
  • Other polymer materials
  • plastic

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Exhibited at the 40th NePCON Japan from January 21 to January 23 (Tokyo Big Sight).

Nepcon Japan is an electronics development and assembly exhibition that showcases electronic components and materials, as well as manufacturing, assembly, and inspection equipment that support the multifunctionality and high performance of electronic devices.

Stretchable conductive material with conductivity imparted to acrylic elastomer.

  • Other polymer materials

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Stretchable conductive material with conductivity imparted to acrylic elastomer.

  • Other polymer materials

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For automotive cooling systems. This epoxy resin is ideal for heat dissipation and insulation sealing.

  • Other polymer materials
  • Other consumables

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For heat dissipation and insulation sealing of semiconductor devices. Excellent workability with quick curing and low viscosity.

  • Other polymer materials
  • Other consumables

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It is a flexible acrylic polymer with a low Tg.

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  • Other polymer materials

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Flame retardant, high thermal conductivity, and flexible epoxy resin.

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  • Other consumables
  • Other polymer materials

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It is a spherical phenolic resin with good fluidity and high filling capability.

  • Other polymer materials
  • plastic

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It is a solid resol-type phenolic resin with ultra-low odor.

  • Other polymer materials

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It can be widely used from general silica sand to special sand.

  • Other polymer materials

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Free sample provision available! Controllable particle size! It is also possible to obtain spherical carbides from a high fixed carbon content!

  • Other polymer materials
  • plastic

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Particle size control is possible from 5μm to 500μm! It is also possible to obtain spherical carbides from a high fixed carbon content!

  • Other polymer materials
  • plastic

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Maintaining the properties of phenolic resin! Achieving carbon neutrality through natural resources.

  • Other polymer materials

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High moisture absorption suppression, anti-agglomeration, and anti-blocking properties! Introducing a resin that reduces ammonia generation by about 1/20.

  • 2.PNG
  • 3.PNG
  • Other polymer materials

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No hardener required for heat curing! It has low moisture absorption and excellent anti-blocking properties.

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  • Other polymer materials

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Tacky fire with excellent compatibility with rubber and metal adhesion. Suitable for automotive tires, footwear, and insulation tubes for electric wires.

  • Other polymer materials

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Case studies of powder resol for electrical insulation materials: It is heat and chemical resistant, and once cured, it does not deform, making it suitable for precision insulation boards and molded p...

  • Other polymer materials

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For hot melt adhesives! Achieve high initial tack and heat resistance with rosin-modified xylene resin 'Lignol R-70/R-140'.

  • Other polymer materials

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