List of 基板 products
8911～8955 item / All 15116 items
Are you not assembling radial parts and axial parts by hand?
- Inserter
- Contract manufacturing
- Prototype Services
We provide various functions such as product transport, buffering, accumulation, and routing. We also propose combinations with conveyors!
- Other conveying machines
- Substrate transport device (loader/unloader)
We would like to introduce a case where we successfully reduced costs through a VA proposal for our customer. Case: 1
- others
Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.
- Sputtering Equipment
Changed the manufacturing method from blow molding (blow products) to press molding (press products), resulting in a significant increase in the softening point to 670°C. Improved dimensional accuracy...
- Other core systems
５G関連の誘電基板のフィラーとして日本向けに採用実績がございます。
- Fine Ceramics
- Printed Circuit Board
- LCD display
It is a large-capacity energy storage device compatible with modules (EDLC/LIC).
- Capacitor
2.54mm pitch, stacking pin header with a spacing of 7.1mm between boards.
- Other Connectors
Wide-ranging processing of clothing wires, cab tire, copper wires, aluminum wires, and more.
- others
We will introduce an example of how to actually solve the technical challenges associated with 5G!
- Technical and Reference Books
Explaining why cleaning is necessary for sintering bonding! Introducing cleaning know-how.
- Technical and Reference Books
We respond to the detailed demands and needs of the market with our unique production technology.
- Touch Panel
Solderable heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
![[Analysis Case] Impurity Evaluation...](https://image.mono.ipros.com/public/product/image/c80/2000243752/IPROS12087956358559100365.jpg?w=280&h=280){kind=small}
Trace analysis of metallic elements and atmospheric component elements.
- Contract Analysis
Worldwide wide input voltage range (DC 88-370V continuous input available) Optimal wide input voltage range for communication (DC 36 - 72V)
- power supply
Ideal as a substitute for halogen-based cleaning agents! It has low BOD and COD values during drainage, which can reduce the burden of wastewater treatment. It does not contain LAS in its ingredients.
- Cleaning agents
Introduced in the PCB design guidelines of Germany's largest semiconductor manufacturer.
- Other semiconductors
A structure that minimizes play when installed! Introducing our cushion spacer.
- Other machine elements
Material: Free-cutting brass (C3604BD), Treatment: Gold-plated cable terminal.
- Other electronic parts
- PCB terminal blocks
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Utilization methods and case studies of light sensors
- Sensors
- Circuit board design and manufacturing
- EMS
SSDP： Substrate Side Depth Profile
- Contract Analysis
- Contract measurement
This is waterproof grinding paper with alumina abrasives for sample grinding machines. It is a safe grinding paper that does not fall under the Labor Safety and Health Act.
- Hand polishing and filing
- Steel
- Optical microscope
This is a LIC module designed for high-energy applications that require high voltage and high current.
- Capacitor
Direct parts marking (engraved barcode) compatible. A globally proven industrial wireless barcode reader with environmental resistance.
- Handheld barcode reader
- 2D Code Reader
We have grades suitable for low reflection and low dielectric applications. They can be provided in a dispersion solution using the sol-gel method. Various solvents are also available for selection.
- Fine Ceramics
- Glass
- plastic
Solderable heat sink for surface mount devices measuring W6.3mm x H4.8mm x L13mm.
- Other semiconductors
Effective measures against solder cracks.
- Composite Materials
Yaw Pitot used for motorsport, wind tunnel experiments, and development.
- Electrical Instruments/Electrometers
We undertake contract processing and manufacturing of cross-sections of various parts and materials.
- Analytical Equipment and Devices
- Analysis Services
Cryogenic ion milling cross-section processing example (rubber products)
We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.
Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.
- Other semiconductors
Solderable heat sink for surface mount devices, W8mm x H6mm x L21mm.
- Other semiconductors
Dip speed, ultra-low speed of 1 nano m/sec, achieving 3D control!! Currently being introduced in a video on our website.
- Coater
- Surface treatment contract service
- Other processing machines
Difficult to peel off! For those struggling with adhesion prevention. This is the comprehensive catalog of release agents from Toyo Aluminum, useful for the manufacturing of electronic components, fil...
- aluminum
We will report rapid analysis results using various sampling techniques regarding foreign substances that significantly impact the yield of electronics products.
- Contract Analysis
- Analytical Equipment and Devices
- Other contract services
Chemical Analysis Concierge Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analysis device can measure different targets, it is necessary to choose a method that fits the purpose based on the information available.
The FINEPLACER femto2 is a high-precision, high-performance fully automatic flip chip bonder/die bonder designed for cutting-edge applications.
- Other semiconductor manufacturing equipment
High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.
- Printed Circuit Board
CPCI E/X Series Extension Board for CompactPCI Bus
- Other industrial robots