List of 基板 products
8956~9000 item / All 15116 items
Power semiconductor applications, appearance inspection of ceramic substrates detected with rule-based + AI technology! Confirmation process also improves efficiency with AI technology!
- Visual Inspection Equipment
A new flagship model that significantly enhances the performance of tabletop robots.
- Other industrial robots
CPCI E/X Series Extension Board for CompactPCI Bus
- Other industrial robots
Side fill enables products to be strengthened at low cost!
- Other electronic parts
- Memory
- Memory
This is a testing machine that conducts bending tests on FFC (Flexible Flat Cable), FPC (Flexible Printed Circuit Board), etc., to evaluate durability.
- Testing Equipment and Devices
- Strength Testing Equipment
Conformal coating is an acrylic coating applied to the substrate layer of a PCB. This protective layer prevents oxidation, dust, and other harmful substances.
- Memory
High-precision back drill function using our company's high-precision height detection sensor (DSFi sensor)!
- Drill press
Quantification of Si-H and N-H in SiN films using infrared absorption method.
- Contract Analysis
[Research and Development Transport Robot/AGV] Capable of carrying approximately 120 kg, it employs a direct drive motor to achieve further noise reduction.
- Other industrial robots
- Trolley
- Transport and handling robots
Comprehensively qualitatively analyzes the rosin, thixotropic agents, surfactants, and other components in cream solder.
- Contract Analysis
Connecting socket (2 rows) compatible with square pins of 0.55 to 0.65 mm and round pins of 0.65 to 0.85 mm in diameter.
- Other Connectors
[Research and Development Transport Robot / AGV] Four-wheel independent steering drive type. Achieves a transportable weight of approximately 120 kg while maintaining high quietness and controllabilit...
- Other industrial robots
- Trolley
- Other conveying machines
Production and prototyping available from one piece! Active in a wide range from printed circuit boards to medical and food sectors! We accommodate your desired size, shape, and functionality! Samples...
- Other polymer materials
- mat
- Other filters
An interface expansion set equipped with two measurement ports capable of measuring RS-232C (V.24) and TTL/C-MOS signal levels.
- Testing Equipment and Devices
- Image Processing Equipment
- Other measurement, recording and measuring instruments
Tracking evaluation of phase transitions and crystallinity changes during the heating process.
- Contract Analysis
Connection socket compatible with square pins of 0.55 to 0.65 mm and round pins of 0.65 to 0.85 mm in diameter.
- Other Connectors
Visualizing the in-plane distribution of impurities such as atmospheric components with a field equivalent to SEM.
- Contract Analysis
Detailed information about the valence band, conduction band, and gap states of the material can be obtained.
- Contract Analysis

Technical Information: Publication of one case on band structure evaluation using X-ray absorption and emission spectroscopy.
We have published the following analysis case on the MST website: - Band structure evaluation using X-ray absorption and luminescence spectroscopy. For more details, please visit the MST website. http://www.mst.or.jp/
This is a spacer-type terminal that is mounted on the substrate by soldering.
- Other terminal blocks
This is a RoHS-compliant, PBT-made LED mounting spacer that can be used both vertically and horizontally.
- Other core systems
It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.
- Other polymer materials
- Printed Circuit Board
- Other electronic parts

[New Product] 300℃ High Heat Resistant Resin TE-2107
TE-2107 is a heat-curable acrylic resin with high heat resistance. Product page: https://www.ipros.jp/product/detail/2000731003 【Features】 ■ High peel strength ■ High solder heat resistance (over 300°C) ■ High toughness resin ■ Non-silicone, non-fluorine based 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.
Example of processing copper-clad laminates for military applications!
- Drill press
TEM-EELS enables elemental identification and chemical state analysis in micro-regions.
- Contract Analysis
Structural analysis of amorphous silicon dioxide (SiO2) using Raman scattering spectroscopy.
- Contract Analysis
Small aluminum heat sink measuring W15.3 x H8 x L15.3mm.
- Other semiconductors
Small aluminum heat sink measuring W19 x H4.8 x L7mm.
- Other semiconductors
Small aluminum heat sink measuring W19 x H4.8 x L5mm.
- Other semiconductors
Small aluminum heat sink measuring W30 x H7.5 x L7mm.
- Other semiconductors
Connecting socket (light angle) compatible with 0.55 to 0.65 mm square pins and 0.65 to 0.85 mm diameter round pins.
- Other Connectors
Top share of the "Capacitance Measurement Method" model for printed circuit board inspection equipment.
- Circuit Board Inspection Equipment
- Other inspection equipment and devices
Composition analysis of 30nm size is possible without processing.
- Contract Analysis
High-viscosity material high-speed drawing and dispensing Air dispenser comparison 3 to 8 times tact UP!
- Assembly Machine
Connecting socket pins suitable for square pins of 0.55 to 0.65 mm and round pins of 0.65 to 0.85 mm, 2 rows.
- Other Connectors
Connecting socket compatible with 0.55 to 0.65mm square pins and 0.65 to 0.85mm round pins + long pin with a length of 13.08mm.
- Other Connectors
You can investigate the changes in degassing intensity while maintaining the temperature.
- Contract Analysis
- Memory
Even with a structure that has uneven surfaces, depth distribution evaluation is possible through flattening processing.
- Contract Analysis
It is possible to confirm the recovery of crystallinity due to irradiation defects and annealing.
- Contract Analysis
Estimation of film thickness using the average free path of photoelectrons.
- Contract Analysis
It is possible to evaluate the surface-adsorbed gas on the thin film and the desorbed gas from within the film.
- Contract Analysis
Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.
- Other semiconductor manufacturing equipment
We develop, manufacture, and construct control devices that meet customer needs and expectations with high quality, utilizing advanced technology and knowledge in electronics and electrical engineerin...
- others
We will quantify the siloxanes in the exhaust gas at the ng level.
- Contract Analysis