List of 基板 products

8956~9000 item / All 15116 items

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Power semiconductor applications, appearance inspection of ceramic substrates detected with rule-based + AI technology! Confirmation process also improves efficiency with AI technology!

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  • Visual Inspection Equipment

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A new flagship model that significantly enhances the performance of tabletop robots.

  • Other industrial robots

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CPCI E/X Series Extension Board for CompactPCI Bus

  • Other industrial robots

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Side fill enables products to be strengthened at low cost!

  • Other electronic parts
  • Memory
  • Memory

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This is a testing machine that conducts bending tests on FFC (Flexible Flat Cable), FPC (Flexible Printed Circuit Board), etc., to evaluate durability.

  • Testing Equipment and Devices
  • Strength Testing Equipment

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Conformal coating is an acrylic coating applied to the substrate layer of a PCB. This protective layer prevents oxidation, dust, and other harmful substances.

  • Memory

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High-precision back drill function using our company's high-precision height detection sensor (DSFi sensor)!

  • Drill press

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Quantification of Si-H and N-H in SiN films using infrared absorption method.

  • Contract Analysis

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[Research and Development Transport Robot/AGV] Capable of carrying approximately 120 kg, it employs a direct drive motor to achieve further noise reduction.

  • Other industrial robots
  • Trolley
  • Transport and handling robots

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Comprehensively qualitatively analyzes the rosin, thixotropic agents, surfactants, and other components in cream solder.

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  • Contract Analysis

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Connecting socket (2 rows) compatible with square pins of 0.55 to 0.65 mm and round pins of 0.65 to 0.85 mm in diameter.

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  • Other Connectors

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[Research and Development Transport Robot / AGV] Four-wheel independent steering drive type. Achieves a transportable weight of approximately 120 kg while maintaining high quietness and controllabilit...

  • Other industrial robots
  • Trolley
  • Other conveying machines

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Production and prototyping available from one piece! Active in a wide range from printed circuit boards to medical and food sectors! We accommodate your desired size, shape, and functionality! Samples...

  • Other polymer materials
  • mat
  • Other filters

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An interface expansion set equipped with two measurement ports capable of measuring RS-232C (V.24) and TTL/C-MOS signal levels.

  • Testing Equipment and Devices
  • Image Processing Equipment
  • Other measurement, recording and measuring instruments

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Tracking evaluation of phase transitions and crystallinity changes during the heating process.

  • Contract Analysis

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Connection socket compatible with square pins of 0.55 to 0.65 mm and round pins of 0.65 to 0.85 mm in diameter.

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  • Other Connectors

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Visualizing the in-plane distribution of impurities such as atmospheric components with a field equivalent to SEM.

  • Contract Analysis

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Detailed information about the valence band, conduction band, and gap states of the material can be obtained.

  • Contract Analysis

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Technical Information: Publication of one case on band structure evaluation using X-ray absorption and emission spectroscopy.

We have published the following analysis case on the MST website: - Band structure evaluation using X-ray absorption and luminescence spectroscopy. For more details, please visit the MST website. http://www.mst.or.jp/

This is a spacer-type terminal that is mounted on the substrate by soldering.

  • Other terminal blocks

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This is a RoHS-compliant, PBT-made LED mounting spacer that can be used both vertically and horizontally.

  • Other core systems

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It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.

  • Other polymer materials
  • Printed Circuit Board
  • Other electronic parts

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[New Product] 300℃ High Heat Resistant Resin TE-2107

TE-2107 is a heat-curable acrylic resin with high heat resistance. Product page: https://www.ipros.jp/product/detail/2000731003 【Features】 ■ High peel strength ■ High solder heat resistance (over 300°C) ■ High toughness resin ■ Non-silicone, non-fluorine based 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

Example of processing copper-clad laminates for military applications!

  • Drill press

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TEM-EELS enables elemental identification and chemical state analysis in micro-regions.

  • Contract Analysis

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Structural analysis of amorphous silicon dioxide (SiO2) using Raman scattering spectroscopy.

  • Contract Analysis

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Small aluminum heat sink measuring W15.3 x H8 x L15.3mm.

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  • Other semiconductors

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Small aluminum heat sink measuring W19 x H4.8 x L7mm.

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  • Other semiconductors

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Small aluminum heat sink measuring W19 x H4.8 x L5mm.

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  • Other semiconductors

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Small aluminum heat sink measuring W30 x H7.5 x L7mm.

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  • Other semiconductors

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Connecting socket (light angle) compatible with 0.55 to 0.65 mm square pins and 0.65 to 0.85 mm diameter round pins.

  • bl7.eps.jpg
  • bl72.jpg
  • Other Connectors

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Top share of the "Capacitance Measurement Method" model for printed circuit board inspection equipment.

  • Circuit Board Inspection Equipment
  • Other inspection equipment and devices

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Composition analysis of 30nm size is possible without processing.

  • Contract Analysis

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High-viscosity material high-speed drawing and dispensing Air dispenser comparison 3 to 8 times tact UP!

  • Assembly Machine

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Connecting socket pins suitable for square pins of 0.55 to 0.65 mm and round pins of 0.65 to 0.85 mm, 2 rows.

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  • Other Connectors

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Connecting socket compatible with 0.55 to 0.65mm square pins and 0.65 to 0.85mm round pins + long pin with a length of 13.08mm.

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  • Other Connectors

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You can investigate the changes in degassing intensity while maintaining the temperature.

  • Contract Analysis
  • Memory

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Even with a structure that has uneven surfaces, depth distribution evaluation is possible through flattening processing.

  • Contract Analysis

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It is possible to confirm the recovery of crystallinity due to irradiation defects and annealing.

  • Contract Analysis

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Estimation of film thickness using the average free path of photoelectrons.

  • Contract Analysis

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It is possible to evaluate the surface-adsorbed gas on the thin film and the desorbed gas from within the film.

  • Contract Analysis

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Demonstrates excellent high-precision mounting accuracy in mass production and prototype development. *Technical materials related to bonding are currently being distributed.

  • Other semiconductor manufacturing equipment

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We develop, manufacture, and construct control devices that meet customer needs and expectations with high quality, utilizing advanced technology and knowledge in electronics and electrical engineerin...

  • others

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We will quantify the siloxanes in the exhaust gas at the ng level.

  • Contract Analysis

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