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Analysis Product List and Ranking from 376 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

Analysis Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. アイテス Shiga//Electronic Components and Semiconductors
  2. ヒューリンクス Tokyo//software
  3. 中電シーティーアイ 本社 Aichi//Service Industry
  4. 4 一般財団法人材料科学技術振興財団 MST Tokyo//Testing, Analysis and Measurement
  5. 5 null/null

Analysis Product ranking

Last Updated: Aggregation Period:Jan 14, 2026~Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. Graph Creation and Data Analysis for Researchers: KaleidaGraph ヒューリンクス
  2. DAXON Reaction Tank Impact Analysis Service *Introduction Materials Available 中電シーティーアイ 本社
  3. Specification verification and failure analysis through reliability testing. アイテス
  4. 4 Dad's factory DX solution promoting manufacturing.
  5. 5 Food-grade twin-screw extruder 'TEX-F'

Analysis Product List

91~120 item / All 1052 items

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Mobile Boundary: Analysis of Airflow Inside a Sirocco Fan

The purpose is to investigate the airflow characteristics inside the blower fan.

Moving Boundary: The internal airflow analysis of the Sirocco fan aims to investigate the airflow characteristics within the Sirocco fan by modeling the basic shape of the fan and applying moving boundary conditions to the blades. The Sirocco fan is a centrifugal multi-blade fan with forward-curved blades, and its characteristics involve many factors such as the shape of the blades, the number of blades, and the shape of the casing. For more details, please download the catalog.

  • Other analyses
  • Analysis

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Moving Boundary: Analysis of Airflow Around Cooling Towers During Fan Operation

Adopting a general cooling analysis model to clarify airflow characteristics inside and outside the cooling tower.

Moving Boundary: The analysis of airflow around cooling towers during fan rotation aims to clarify the characteristics of airflow both inside and outside the cooling tower by adopting a general cooling analysis model. Cooling towers are one of the air conditioning systems commonly installed in large commercial facilities, factories, and government offices, and they are devices used to cool circulating water. By spraying water in droplets from above and blowing air with a fan to contact it with outside air, the temperature is lowered to create cooling water. For more details, please download the catalog.

  • Other analyses
  • Analysis

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SuperCartesian: Engine Cylinder Airflow Analysis

We conducted airflow analysis within the engine cylinder from the intake manifold to the inside of the cylinder.

SuperCartesian: In the analysis of airflow within the engine cylinder, we accurately represented the intake manifold and valve shapes, and conducted airflow analysis from the intake manifold to inside the engine cylinder. When predicting the performance of an internal combustion engine, it is crucial to understand the airflow characteristics of the mixture being delivered into the cylinder. These airflow characteristics are significantly influenced by the shapes of the intake manifold and valves, which in turn affect combustion efficiency. For more details, please download the catalog.

  • Other analyses
  • Analysis

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Airflow analysis within the power supply unit

The purpose is to clarify the characteristics of airflow within the power supply unit.

The airflow analysis within the power supply unit aims to clarify the characteristics of airflow within a typical power supply unit used as an analysis model. The power supply unit plays a crucial role in providing stable power to computers, including PCs, and since it contains many high-temperature heat-generating components, how efficiently it can dissipate heat is a significant point. For more details, please download the catalog.

  • Other analyses
  • Contract Analysis
  • Analysis

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Close-up Tsunami Load Simulation

Started research with the aim of re-evaluating the tsunami load specifications that should be incorporated into the design of evacuation buildings.

The close-up tsunami load simulation research began with the aim of re-evaluating the tsunami load specifications that evacuation buildings should have, by gaining a detailed understanding of the behavior of loads on buildings caused by tsunamis resulting from frequent trench-type earthquakes. However, in light of the unprecedented damage caused by the Great East Japan Earthquake and the resulting large tsunami, the need for simulations that were not included in previous settings has arisen. Specifically, tsunami load evaluations for wave heights of 10 to 20 meters and assessments of tsunami loads on groups of buildings are now considered essential and urgent for the design of not only evacuation buildings but also facilities constructed along the coast and urban planning. For more details, please download the catalog.

  • Other analyses
  • Contract Analysis
  • Analysis

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Fluororesin Injection Molding Technology | Preventing Troubles with Resin Flow Analysis

Cost reduction through pre-verification in the product design stage! We simulate injection molding of fluororesin materials such as PFA and engineering plastics.

In flow analysis, you can visually confirm the flow and filling of resin inside the mold, which cannot be seen in reality, in 3D. Through resin flow analysis, it is possible to predict flow patterns, resin pressure distribution, resin temperature distribution, and the occurrence position of weld lines. By conducting 3D simulations, you can anticipate issues before manufacturing the mold, allowing for effective countermeasures to be implemented in a short period and at low cost. 【Features】 ★ It can prevent issues before mold creation. ★ It can reduce the number of prototypes and keep costs down. ★ It can contribute to quality improvement. 【Types of Analysis】 - Filling analysis - Holding pressure cooling analysis - Fiber orientation analysis - Warpage deformation analysis - Insert analysis, etc. * To perform insert analysis, the results of the above filling analysis, holding pressure cooling analysis, (fiber orientation analysis), and warpage deformation analysis are required.

  • Analysis Services
  • Analysis

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Pursuing fluororesin - Meiko Industry | Resin flow analysis before mold production

By conducting an analysis before manufacturing the mold, it is possible to predict the occurrence of defects in advance and consider countermeasures!

In flow analysis, you can visually confirm the flow and filling of resin inside the mold, which cannot be seen in reality, in 3D. Through resin flow analysis, it is possible to predict flow patterns, resin pressure distribution, resin temperature distribution, and the occurrence position of weld lines. By conducting 3D simulations, you can predict issues before manufacturing the mold and implement effective measures in a short time and at low cost. 【Features】 ★ Prediction of issues and quality improvement through resin flow analysis ★ Reduction of modification man-hours ★ Decrease in the number of prototypes ★ Quick setup at low cost For those struggling with mold design and molding troubles, please leave the proposal for pre-validation and optimal design using resin flow analysis to Meiko Industry.

  • plastic
  • Engineering Plastics
  • Analysis

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Power Dock: Service for Identifying Issues Related to Board Power Supply

This is a service that investigates the causes of power supply issues in electronic circuit boards experiencing malfunctions and proposes countermeasures.

Due to issues with power supply design, there has been an increase in failures where devices do not operate during mass production and prototype evaluation. However, identifying the root cause of these failures requires technical know-how related to power supplies and circuit boards. Our company has been supporting analog products for many years and has investigated and addressed many causes of failures. This service leverages that expertise, with veteran engineers analyzing your circuit boards to provide the causes of failures and countermeasures.

  • power supply
  • Circuit board design and manufacturing
  • Other contract services
  • Analysis

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Ultra-small extruder "Micro Treader" [Minimum discharge 10g/h]

Ideal for research and development! Ultra-compact extruder achieving a low discharge rate of 10g/h.

RANDCASTLE's "Micro Treader" is a compact vertical micro-extruder that achieves low discharge extrusion (from 10g/hour). Its unique vertical design significantly outperforms horizontal small extruders in terms of screw strength, feed efficiency, and installation space. It is ideal for research and development that uses valuable samples. 【Features】 ◆ Minimum discharge of 10g/h! Capable of stable and small-volume extrusion ◆ High mixing comparable to a twin-screw extruder with a single screw ◆ Compact design allows for research in various locations ◆ Vertical orientation enhances resin feed efficiency 【For more details, please download the catalog or feel free to contact us】

  • Extrusion Machine
  • Analysis

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Analysis of Powder and Bulk Material Behavior

Consideration of the behavior and flow of the mechanism! Performance improvement of construction machinery and heavy equipment systems is possible.

Through the collaboration of our various solvers, we enable high-precision analysis of "powder and bulk material behavior." It is possible to explore performance improvements for construction machinery and heavy equipment systems. We can also consider the interactions between mechanisms, powder, structural deformation, and system control. Additionally, by using various Altair solvers, we can accurately analyze powder processes that include thermal fluid phenomena (such as transportation by air, particle cooling by wind, and drying processes). 【Performance Improvement of Construction Machinery and Heavy Equipment Systems】 ■ Mechanisms ■ Powder Motion ■ Consideration of Deformation and Stress ■ Integration of System Control Mechanisms ■ Interaction between EDEM soil models and elastic deformation tire models *For more details, please download the PDF or feel free to contact us.

  • Other information systems
  • Analysis

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Three-dimensional dynamic nonlinear analysis

Three-dimensional dynamic nonlinear analysis

Responding to customer requests, we have been renewed! Introducing 3D dynamic nonlinear analysis from Forum 8. ■□■Features■□■ ■ Eigenvalue analysis considering geometric stiffness ■ Added vertical and horizontal division options to the mesh division method for fiber element cross-sections ■ With the addition of important features related to analysis functions, it is now possible to analyze structures that were previously postponed for the application of UC-win/FRAME(3D) For other features and details, please download the catalog or contact us.

  • Image analysis software
  • Analysis

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Thermal Fluid Analysis SOLIDWORKS Flow Simulation

Achieving seamless design and analysis! Add-in thermal fluid analysis software equipped with a variety of result evaluation features.

"SOLIDWORKS Flow Simulation" is a thermal fluid analysis software developed for all designers working with SOLIDWORKS. With complete integration into SOLIDWORKS, it achieves seamless design and analysis. Thanks to its diverse result evaluation features, it visualizes the flow paths of fluids with lines and arrows, and results can also be saved as animations. 【Features】 ■ Complete integration with SOLIDWORKS ■ Diverse result evaluation features - Streamlines: Visualize the flow paths of fluids with lines and arrows - Contours, Probes: Display calculation results on arbitrary sections or surfaces - XY Plot: Output calculation results on arbitrary sketches - Acoustic Evaluation: Generate graphs of frequency and sound pressure levels for arbitrary times and coordinates *For more details, please refer to the PDF materials or feel free to contact us.

  • simulator
  • Thermo-fluid analysis
  • Structural Analysis
  • Analysis

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Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

  • Contract Analysis
  • Other semiconductors
  • Other contract services
  • Analysis

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Analysis of the assembly joints of the implemented components

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

  • Contract Analysis
  • Other contract services
  • Contract measurement
  • Analysis

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EL/PL Imaging Device PVX1000+POPLI-Octa

The wafers in the solar cell manufacturing process can be evaluated using photoluminescence.

The PVX1000+POPLI-Octa can evaluate wafers during the solar cell manufacturing process using photoluminescence. It is capable of assessing the passivation effects of the PN junction layer after thermal diffusion, the AR layer deposition, surface contamination, as well as the protective effects of the rear insulation layer and the evaluation of Local-BSF. Additionally, by using a DC power supply for EL observation of the module, it is possible to pinpoint the locations of defects. By applying reverse bias to the module and observing LEAK points, defects that have caused PID can be easily identified.

  • Image Processing Equipment
  • Analysis

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Microscopic EL/PL imaging device PVX1000+POPLI-μ

Microscopic PL observation of the fine structure of wafers in the solar cell manufacturing process.

The PVX1000+POPLI-μ allows for photoluminescence observation of the fine structure of wafers during the solar cell manufacturing process using a microscope. In the case of PERC, it is possible to evaluate individual Local-BSFs based on PL intensity and assess the damage to the passivation layer around the laser contact holes. Additionally, defect location identification is possible through EL observation of the module using a DC power supply.

  • Image Processing Equipment
  • Defect Inspection Equipment
  • Contract measurement
  • Analysis

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EBSD analysis

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials with a crystalline structure, such as metals and ceramics, are thought to be composed of numerous crystal lattices like cubic ones, and this analytical method examines the orientation of these lattices (crystal orientation). Various maps are used, including IQ maps (Image Quality Maps), IPF maps, GROD maps, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

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  • Analytical Equipment and Devices
  • Analysis Services
  • Analysis

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IC failure analysis

By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.

We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for various defect modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, including "Light Emission Analysis/OBIRCH Analysis," which allows layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Light Emission Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Microprobe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.

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  • Other analyses
  • Contract Analysis
  • Analysis Services
  • Analysis

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OBIRCH analysis of SiC devices using short-wavelength lasers.

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of pseudo-leaks. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Analysis Services
  • Contract Analysis
  • Analysis

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Failure analysis of an orange LED damaged by electrostatic discharge.

We will introduce a comparison of brightness and characteristics between good products and ESD-damaged products, along with examples of luminescence analysis using EMS microscopy!

We conduct failure analysis of orange LEDs that have been damaged by electrostatic discharge (ESD). LEDs that have been destroyed in ESD testing and show a decrease in luminous intensity can be analyzed using emission luminescence and the IR-OBIRCH method, allowing us to clarify the failure phenomena. We have examples such as "Comparison of brightness and characteristics between good products and ESD-damaged products" and "Luminescence analysis using emission microscopy." [Analysis Examples] ■ Comparison of brightness and characteristics between good products and ESD-damaged products - By polishing the lens part of a bullet-type LED to flatten it, dark areas were observed during brightness comparison. ■ Luminescence analysis using emission microscopy - In ESD-damaged products, dark areas were observed under forward bias, while only the damaged areas emitted light under reverse bias. ■ IR-OBIRCH and SEI analysis - Detailed damage locations were identified through IR-OBIRCH analysis of ESD-damaged products. *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis
  • Analysis

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Analysis of good LCD panels

Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!

At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCDs. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Content (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Tests - Lighting Inspections ■ Analytical Methods - Oven Drive Tests - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Contract Analysis
  • Analysis

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Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis
  • Semiconductor inspection/test equipment
  • Analysis

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Defective analysis of liquid crystal panels

We will narrow down the defective areas through lighting confirmation, panel disassembly, and optical microscope observation!

We provide a defect diagnosis menu for LCD panels, from confirming defects to identifying causes and conducting detailed failure analysis. In the initial analysis, we perform a status check (lighting test), panel disassembly, and optical microscope observation, tailored to the defect symptoms. In the detailed analysis, based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis. It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects. 【Analysis Content】 ■ Initial Analysis - Status check (lighting test), panel disassembly, optical microscope observation, conducted according to defect symptoms - Narrowing down from general areas such as cell panels and peripheral circuits to finer details ■ Detailed Analysis (additional analysis fees apply) - Based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis - It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis
  • Analysis

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Research Institute of Chemical Reaction Mechanisms, Material Degradation Analysis (Decomposition and Deterioration of PET)

We will suggest appropriate analysis methods based on the condition of polymer materials and samples!

At AITES Co., Ltd., we conduct material degradation analysis. We propose appropriate analytical methods based on the condition of polymer materials and samples. By analyzing the degradation process that the material has undergone and optimizing the polymer materials and usage environment, it is possible to extend the product's lifespan. *For more details, please refer to the PDF document or feel free to contact us.

  • Contract Analysis
  • Analysis Services
  • Contract Analysis
  • Analysis

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Panel Polarizer Degradation Analysis

Examples of degradation analysis of panel polarizers are published! We conducted degradation analysis through reliability testing and outgassing analysis using HS-GCMS.

The polarizers used in LCD panels are made of multilayer films laminated with materials such as triacetyl cellulose, polyvinyl alcohol, and polyethylene terephthalate. This document presents a case study of the degradation analysis of panel polarizers after reliability testing, conducted through HS-GCMS analysis and thermal desorption GCMS analysis. Even invisible degradation might be detected with this analysis?! Please take a moment to read it. [Contents] ■ Reliability Testing ■ Outgassing Analysis via HS-GCMS ■ Low Boiling Point Component Analysis via Thermal Desorption GCMS *For more details, please refer to the PDF document or feel free to contact us.

  • Contract Analysis
  • Other contract services
  • Analysis

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Analysis of film property changes due to UV irradiation.

Investigating how the light transmittance of blue light cut film changes using a spectrophotometer!

Blue light cut film has the effect of suppressing the transmission of visible light, particularly light with a wavelength of 500nm or less, compared to regular PET film. Using a spectrophotometer, we examined how the light transmission of the blue light cut film changes under UV irradiation. The transmission of light in the wavelength range of 350 to 400nm decreased further due to UV irradiation. Additionally, we conducted an analysis of the reactions occurring within the film using GC-MS. [Analysis Content] ■ Light transmission characteristics of regular PET film and blue light cut film ■ UV irradiation on blue light cut film ■ GC-MS analysis of components within the film *For more details, please refer to the PDF document or feel free to contact us.

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  • Ultraviolet irradiation equipment
  • Analysis

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Analysis of good quality overseas manufactured LCD displays

If any issues arise, detailed analysis will also be provided! A simplified analysis for customers considering the introduction of overseas LCDs.

We will introduce the analysis of good products for liquid crystal displays by Aites Co., Ltd. First, we conduct optical microscope observations focusing on the FPC, FOG, COG, and sealing materials in the state of the cell panel as part of the appearance observation. Next, we dismantle the cell panel to check the sealing materials, PI film, and TFT shape. If any defects are found during the good product analysis, we will propose additional analyses such as cross-sectional observation of wiring and foreign matter analysis to investigate the cause. Please feel free to consult us when needed. [Contents of Appearance Observation] ■ Are there any corrosion or foreign matter on the FPC wiring? ■ Is there any issue with the FOG bonding? ■ Is there any issue with the COG bonding? ■ Are there any breaks or defects in the sealing material? *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis Services
  • Analysis

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Specification verification and failure analysis through reliability testing.

Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.

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  • Other Testing Contract
  • Contract Analysis
  • Analysis

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