Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.
106～108 item / All 108 items
Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.
Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.
High-speed Die Bonder compatible with micro and thin chips.
The bonder "AB-1000" is complete. Achieved mounting accuracy (XY: ±5 [μm], θ: ±1 [deg] (±3σ)). Compatible with small and thin chips.
The FINEPLACER lambda 2 is a new standard model for high-precision die bonders and flip chip bonders.
Lambda2 is a new standard model of a high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact tabletop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies such as thermal eutectic, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact tabletop size, it is very easy to introduce into operations, and considering future scalability through a modular system, it is a highly cost-effective model. Lambda2 is a new standard model from Finetech, a German manufacturer specializing in die bonders, which has poured its unique know-how into this product. Its ultra-high precision and usability, realized through its unique design philosophy, leave no room for competitors to catch up. For more details, please refer to the PDF materials or feel free to contact us.
