Last Updated： Aggregation Period:Aug 20, 2025～Sep 16, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 20, 2025～Sep 16, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 20, 2025～Sep 16, 2025
This ranking is based on the number of page views on our site.
31～45 item / All 257 items
Larger sizes are easier to achieve than ceramics, and by impregnating with metal, the fracture toughness is increased, making it less prone to cracking.
It is a composite material in which aluminum is impregnated into a SiC ceramic porous body.
-
This is a composite material containing 30-40 vol% SiC ceramic particles in aluminum alloy. It is manufactured using sand casting and die casting methods. By adjusting the SiC content, we can provide materials that meet specific needs. In recent years, there has been a rapid adoption of this material due to the increasing size and speed of equipment. It is being adopted in various fields, including liquid crystal manufacturing equipment, semiconductor manufacturing equipment, and various inspection devices. We are also capable of developing other composite materials, so we kindly ask you to contact us for this opportunity.
![[Example of Use] Enclosure/Casing Metal Ceramic Composite Material](https://image.mono.ipros.com/public/product/image/ef1/2000173018/IPROS85339592105482327303.png?w=280&h=280)
It is a composite material containing SiC ceramic particles in aluminum alloy.
Metal-ceramic composite materials with the rigidity exceeding that of cast iron due to the lightweight of aluminum. Their excellent specific rigidity, high thermal conductivity, and low thermal expansion make them suitable for enclosures. We can meet diverse needs through die casting, gravity casting, and low-pressure casting. We are also capable of developing other composite materials, so please feel free to contact us regarding this opportunity.
φ450 (18 inches) jig, equivalent specific gravity and Young's modulus to Si wafers! Low price!
We have prepared a φ450mm (18-inch) fixture for semiconductor equipment compatible with φ450mm (18-inch) wafers. Since standard Si wafers are still quite expensive and carry a risk of damage, those who are having difficulty using them freely are encouraged to contact us. Please try our composite materials as fixtures for transport tests and adhesion tests.
![[Video] Please take a look at the excellent vibration damping properties of composite materials MMC.](https://image.mono.ipros.com/public/product/image/908/2000265744/IPROS40336182750283680394.jpeg?w=280&h=280)
Lightweight and high-rigidity MMC excels in vibration damping, enabling high precision and high speed in devices.
●Features of MMC - Lightweight: The lightness of aluminum - High rigidity: Higher rigidity than cast iron and stainless steel - Low thermal expansion: Less than 1/2 that of aluminum - High thermal conductivity: Better than aluminum - Vibration damping: Better than stainless steel, cast iron, and aluminum ⇒ Please watch the video. The left side of the screen shows MMC (SA301).
Metal-ceramic composite materials that achieve rigidity equivalent to steel at about one-third the weight also have good vibration damping properties, making them ideal for movable parts in devices. The performance of the device will change.
Composite materials 'MMC (Metal Matrix Composites)' have achieved better physical properties by combining base metals and ceramic-based reinforcement materials. These materials can meet various customer demands, such as wanting to increase rigidity without changing shape or weight, wanting to reduce weight while maintaining rigidity, or needing materials with excellent heat dissipation. 【Features】 ■ Equivalent to aluminum, about 1/3 the weight of iron ■ Has rigidity comparable to iron and steel, and is resistant to bending ■ Good vibration damping properties ☞ Please refer to the video ■ Excellent thermal conductivity and heat dissipation ■ Minimal expansion and contraction due to temperature changes *For more details, please request materials or view the PDF data from the download.
![[Video] What is Composite Material "MMC" - Comprehensive Catalog Available](https://image.mono.ipros.com/public/product/image/c54/2000407492/IPROS35186288277160385665.jpeg?w=280&h=280)
As light as aluminum and as strong as steel! For more details on the composite material "MMC," please refer to the video or catalog.
Metal ceramic composite material 'MMC' that combines the "lightness of aluminum" and the "rigidity of steel." It has high thermal conductivity, low thermal expansion, and the ability to absorb vibrations, making it suitable for complex shapes and large items! We are currently offering a comprehensive catalog of the composite material 'MMC' suitable for replacement of aluminum and steel! For features and application examples of MMC, please refer to the animation video. 【Features】 ■ Equivalent to aluminum, about 1/3 the weight of steel ■ Has rigidity comparable to iron and steel, resistant to bending ■ High thermal conductivity and heat dissipation ■ Minimal thermal shrinkage *For more details, please download the catalog or contact us.
The lightness of aluminum combined with the rigidity of steel. It moves quickly and stops precisely without bending. The MMC, created by JFC's unique composite technology, transforms device performance.
Our unique composite technology produces Metal Matrix Composites, which are composite materials with a carefully optimized blend of metal and ceramics. Using MMC, which is lightweight like aluminum yet does not deform like iron, as moving parts in equipment can dramatically change the performance of the device. The excellent thermal properties of low thermal expansion and high thermal conductivity will solve thermal issues in the equipment. Please consider adopting MMC.
![[Applicable Case] Semiconductor Manufacturing Equipment Metal Ceramic Composite Material 'MMC'](https://image.mono.ipros.com/public/product/image/7f9/2001480096/IPROS26171273225758000467.jpeg?w=280&h=280)
The joining technology of composite materials MMC has made it possible to expand into new applications.
The manufacturing of hollow structures has become possible by joining MMCs together. It is possible to flow refrigerants or gases through the internal channels formed by the joining technology. MMCs, characterized by high thermal conductivity and low thermal expansion, experience minimal thermal deformation due to temperature changes, preventing adverse effects on the components they are integrated with. <Applications for Cooling Jackets> Prevention of arcing due to reduced thermal expansion differences with alumina ESC, improved etching rates due to high thermal conductivity and low thermal expansion. <Applications for Wafer Chucks> Stable measurements and expanded test temperature ranges due to high rigidity, high thermal conductivity, and low thermal expansion. 【Features of MMC】 ■ Weight comparable to aluminum, about 1/3 that of iron ■ Rigidity equivalent to that of iron and steel, resistant to bending ■ High thermal conductivity and heat dissipation ■ Minimal thermal shrinkage 【Joining Methods】 ● Brazing: Joining using a filler material with a lower melting point than the base material. ● Diffusion bonding: Joining by closely adhering materials and diffusing the atoms at the bonding interface. *Joining of dissimilar materials is also possible (consultation for joinable materials is available). *There is also a track record of joining multiple sheets. For more details, please download the catalog or contact us.
Active in automotive parts such as separators for fuel cells. Excellent heat resistance. Supports small lot production.
"GPS" is a composite material that has been uniformly coated with phenolic resin on graphite using a special method. Various shapes with excellent uniformity can be obtained through thermal compression molding. It has conductivity and electromagnetic wave shielding effects, making it suitable for battery applications. Additionally, it is widely used in mechanical seals, electrodes, brushes, bearings, and more. Our company can accommodate orders from small lots to large lots. [Features] - Excellent storage stability, wear resistance, heat resistance, and oxidation resistance - Good fluidity and dispersibility, making it easy to mix with various raw materials - Good electrical and thermal conductivity - Low thermal expansion and strong against thermal shock *For more details, please refer to the materials. *We provide samples free of charge up to 1kg. Please feel free to contact us.
Introducing a composite paper made by uniformly dispersing CNT and CeNF! *Scheduled to be exhibited at the New Functional Materials Exhibition 2020 and nano tech 2020!
"Carbon Nanotube / Cellulose Nanofiber Composite" is a composite paper made by uniformly dispersing carbon nanotubes (CNT) and cellulose nanofibers (CeNF). 【Features】 ■ Standard CNT (length 0.1–10μm) 50% added paper Thickness 15μm, surface resistance 50–60Ω/□ (volume resistance ~0.08Ωcm) ■ Long CNT (length 150–200μm) 50% added paper Thickness 15μm, surface resistance 5–6Ω/□ (volume resistance ~0.008Ωcm) *For more details, please refer to the PDF document or feel free to contact us.
Composite materials can be made using nitrile rubber and natural rubber latex!
We would like to introduce our "Elastomer Composite Material." This product can be applied to materials that form a latex-like emulsion. Composites can be produced using latex from nitrile rubber or natural rubber. 【Features】 ■ Applicable to materials that form a latex-like emulsion ■ Composites can be produced using latex from nitrile rubber or natural rubber *For more details, please refer to the external link page or feel free to contact us.
Molding is possible through casting or coating! Achieving high conductivity of less than 0.1Ωcm with various materials!
We would like to introduce our "Carbon Nanotube Composite Material." The composite material is formed from CNT aqueous dispersion and water-based emulsions, achieving high conductivity of less than 0.1Ωcm with various materials such as nitrile rubber, natural rubber, urethane, and silicone. It can be applied to conductive sheets, flexible electrodes, planar heaters, electromagnetic wave shielding materials, keyboard contact materials, humidity-responsive materials, and more. 【Features】 ■ Composite material formed from CNT aqueous dispersion and water-based emulsions ■ Achieves high conductivity of less than 0.1Ωcm with various materials ■ Molding possible by casting or coating ■ Applicable to conductive sheets, flexible electrodes, planar heaters, electromagnetic wave shielding materials, keyboard contact materials, humidity-responsive materials, and more *For more details, please refer to the PDF document or feel free to contact us.
By using CNT, the amount of conductive additives can be reduced, and the content of active materials can be improved!
The "Carbon Nanotube/Polyvinylidene Fluoride Composite for Batteries" is a powder that contains dispersed CNT added to PVDF. By using CNT, the amount of conductive additives can be reduced, and the content of active materials can be improved. It is also suitable for dry process electrodes. 【Features】 ■ Powder with dispersed CNT added to PVDF ■ Reduces the amount of conductive additives and improves the content of active materials by using CNT ■ Suitable for dry process electrodes *For more details, please refer to the PDF document or feel free to contact us.
Can be used for components of electronic devices that are becoming smaller and thinner. Achieves both magnetism and flexibility with binderless composites.
"Curved Ferrite" is a material that directly combines ferrite with substrates such as copper foil and polyimide. Developed in collaboration with the National Institute of Advanced Industrial Science and Technology using the aerosol deposition method. It achieves suppression of magnetic property degradation without the use of non-magnetic adhesives. The composition of the ferrite layer, the type of substrate, and the thickness of each layer can be widely selected. It also offers high freedom of shape, accommodating miniaturization of devices, and is expected to be applied in various uses such as electromagnetic wave shielding materials. 【Features】 ■ Binder-free, balancing the properties of the substrate and the magnetism of the ferrite ■ Wide selection of thicknesses for the substrate and ferrite ■ Contributes to the miniaturization of integrated circuits and electronic devices ■ Utilizes the aerosol deposition method that takes advantage of room temperature shock curing phenomena *For more details, please refer to the materials. Feel free to contact us with any inquiries.
