Electroplated tin
Gold-tin alloy shows a eutectic point at an Au/Sn composition of 80/20 (wt%), with a melting point of 280°C. This alloy is non-oxidizing, has good solderability, low resistivity, and improved creep characteristics, lubrication, and wear resistance, making it suitable as a high-temperature joining material for high-frequency devices such as mobile phones, optoelectronic packages, mounted components, optical communication components, as well as for protective element materials, sliding parts, and decorative items. Many gold-tin alloy materials are produced in the form of ribbons or pellets metallurgically, but issues have arisen that make them difficult to apply to narrow pitches associated with high-density mounting. This plating bath allows for barrel plating of micro parts, enabling the production of a uniform eutectic composition plating film.