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Polishing Machine Product List and Ranking from 211 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 25, 2026~Mar 24, 2026
This ranking is based on the number of page views on our site.

Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 25, 2026~Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. 田中インポートグループ Osaka//others
  3. アイエムティー Wakayama//Testing, Analysis and Measurement
  4. 4 null/null
  5. 5 チップトン Aichi//Manufacturing and processing contract

Polishing Machine Product ranking

Last Updated: Aggregation Period:Feb 25, 2026~Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. "Improved drill sharpness" Comprehensive catalog of automatic drill sharpening machines available. 田中インポートグループ
  3. Manual Sample Grinder "IM-P2" [Made in Japan] アイエムティー
  4. 4 Portable and lightweight side belt sander "SBD-4S" 松田精機
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing Machine Product List

151~180 item / All 690 items

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Compound semiconductor wafer polishing device, tape-type polishing device for small wafers.

[Made in Japan] Precision Grinding Tape Used

This is a space-saving, low-cost tape-type precision grinding device specialized for bevel grinding and oil-free grinding.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Electrician Emergency Response

Your company's electrician.

Is there a person in charge of the electrical control department at your company? Our engineering department will handle it on your behalf.

  • Calibration and repair
  • Polishing Machine

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You can find the optimal polishing conditions! [Free guide for selecting sample polishing recipes available now]

Perfect for creating high-precision samples! We are currently giving away a technical book that reveals the best polishing conditions, leading to process reduction and improved accuracy!!

We offer a variety of polishing machines, including the automatic sample polishing machine "KIRIME." By optimizing the polishing conditions for samples, we achieve process reduction and improved accuracy. In terms of process reduction, there are cases where the conventional working time has been halved. Additionally, the improvement in polishing accuracy has resulted in better inspection results. This time, we are pleased to offer our customers the highly praised "Technical Book for Sample Polishing Recipe Selection Guidelines" as a special gift. <Reasons Why IMT's Polishing Machines Are Chosen> ■ All products are domestically produced. Maintenance and after-sales support are available on the same day. ■ We have various demonstration machines in Tokyo, Nagoya, and Osaka, making demonstrations possible. ■ Based on our track record in the semiconductor, LCD, electronics, and machinery industries, we can customize (special fixtures) and propose solutions according to customer requests. ■ We can also propose optimal polishing conditions. *Currently, we are also offering the "Technical Book Sample Polishing Recipe Selection Guidelines" for free, which can be viewed from the "Download" section.

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  • Wafer processing/polishing equipment
  • Polishing Machine

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Manual Sample Grinder "IM-P2" [Made in Japan]

Powerful torque and reliable Japanese-made hand grinder. Automation is also possible with three types of attachable attachments!

The 『IM-P2』 is a tabletop polishing device specifically designed for hand polishing. It features an easily interchangeable disc and a table height that facilitates hand polishing. It is equipped with a motor that delivers strong torque even at high speeds and low speeds. The essential components of the polishing machine, the motor and inverter, are reliably made in Japan. It can also be transformed into an automatic rotating machine with an additional attachment! We can propose three types of automation attachments tailored to your company's needs. If you're interested, please check the pages for [SP-L1]/[SP-As]/[M-05]. 【Features】 ○ Polishing table height that is easy for hand polishing ○ Strong torque in both low and high-speed ranges (50–400rpm stepless speed change) ○ Easy disc replacement ○ Drip-proof ring is standard equipment  Custom sizes and shapes can be made according to safety specifications (for a fee) ○ Rust-resistant resin cover ○ Design allows for easy replacement of consumable parts such as water supply taps and drainage hoses ○ A storage platform for consumables can also be attached * There is also a manual polishing machine 【IM-P3】 that can use Φ300mm discs. For more details, please contact us or download the catalog.

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  • Other physicochemical equipment
  • Polishing Machine

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Sample Grinding Machine - Overall Load Type Grinder 'Rana-30' [Made in Japan]

Equipped with a safe W start button function! A powerful tabletop grinder with an overall load system.

The "Rana-30" is a powerful automatic polishing machine equipped with a safe dual start button feature. It utilizes a 750W servo motor for the polishing section and a 120W brushless motor for the sample rotation section, achieving high torque, a maximum disk rotation speed of 400 rpm, and a maximum pressing force of 400N. It also includes a memory function for 16 polishing conditions and ABC settings (allowing operation during polishing to be set in three stages) for efficient work. 【Features】 ○ A powerful tabletop polishing machine with an overall load system ○ Capable of accommodating polishing discs with a maximum diameter of φ310mm ○ Designed with safety in mind, featuring a dual start button function ○ Optional parts that can be selected according to the sample For more details, please contact us or download the catalog.

  • Other physicochemical equipment
  • Polishing Machine

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Automatic polishing machine "KIRIME300" with 2 styles in 1 unit [Made in Japan]

A dual-wielding machine in the sample grinding world! An automatic grinder that can create auto-change recipes.

"KIRIME" is an automatic polishing machine that handles both overall load/individual load with two polishing styles in one unit. You can create an auto-change recipe by selecting and combining up to six memory conditions. It features easy operation with a large button touch panel. It is capable of communication and connection with an automatic abrasive drip device. 【Features】 ○ Two selectable polishing styles → Overall load method with high polishing power → Individual load method: pressurized legs for individual loads ○ Polishing disk cooling function included ○ Automation with automatic abrasive drip For more details, please contact us or download the catalog.

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  • Other physicochemical equipment
  • Polishing Machine

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Sample Grinder (with Grinding Value Setting Function) 'Q-roy' [Made in Japan]

A sample polishing machine that allows setting grinding values for each of the three samples! Automatic polishing is also possible in time mode.

The "Q-roy" is a sample polishing machine that allows for the setting of grinding values in the Z-axis (height) direction for each of the three samples. It can set grinding values in units of 1μm and will automatically stop when the grinding value is reached. Automatic polishing is also possible in time mode. The operation is easy with a large button touch panel and convenient analog buttons. 【Features】 ○ Grinding value setting possible for each of the three samples ○ Polishing possible through time management ○ Automation with auto-drip polishing agent ○ Correction of grinding value errors is possible For more details, please contact us or download the catalog.

  • Other physicochemical equipment
  • Polishing Machine

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Fully Automatic Grinding Machine "Cyrex" [Made in Japan]

Adopting PLC control with high design flexibility! A polishing machine that achieves high throughput.

"Cyrex" is a fully automatic polishing machine equipped with a 1-stage grinding stone plus polishing, 4 stages of lapping, an automatic dressing mechanism for the grinding stone, and a grinding amount adjustment mechanism as standard features. It achieves high throughput through simultaneous polishing at each stage. Each stage is equipped with a cleaning tank and drying tank as standard, preventing the transfer of foreign substances from previous processes. It can flexibly accommodate various customizations. 【Features】 ○ High design flexibility with PLC control ○ Significantly increased productivity ○ Large 6-station polishing machine ○ Capable of stocking a large number of sample holders For more details, please contact us or download the catalog.

  • Other physicochemical equipment
  • Polishing Machine

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Sample Grinding Machine Individual Load Type 'Rana-5' [Made in Japan]

High-Spec Dedicated Load Grinding Device

"Rana-5" is an individual load type automatic polishing machine equipped with a standard automatic water supply function. The polishing section and sample rotation section are common specifications with "Rana-3," but the head mechanism is robust with LM guides, making it less prone to lateral shaking during polishing and providing high rigidity. The waterproof model comes with a touch panel and an emergency stop button, and the digital version allows for automatic stop via a timer. It can store 16 polishing conditions and allows for two-step operation settings during polishing. 【Specifications】 ■ Power supply: Single-phase 100V / Single-phase 220V ■ Dimensions/Weight: W450×D640 (to the back)×H520mm (610mm when head is raised) / 94kg ■ Water supply and drainage: Standard automatic water supply function included *For more details, please refer to the PDF document or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Polishing Machine

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Sample Grinder "KIRIME 250" [Made in Japan]

Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.

The "KIRIME 250" is an automatic polishing machine that can perform two polishing styles with one unit. It features a Φ250mm disc and offers a lineup of various polishing discs including polishing discs (with pressure rings), lapping discs, and magnetic surface discs, which can be exchanged according to the application. The rotation speed is adjustable, with the disc operating at 50–500 rpm and the holder at 50–200 rpm (reversible). 【Disc Lineup】 ■ Polishing disc (with pressure ring) ■ Lapping disc ■ Magnetic surface disc *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Other abrasives
  • Polishing Machine

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Fully Automatic Sample Grinding Machine "Cyrex-8" [Made in Japan]

Two-stage variable grinding conditions are possible! The grinding head can be adjusted left and right by ±50mm!

The "Cyrex-8" is a fully automatic polishing machine that can make two types of changes during a single polishing process. It is possible to set the machine to gradually increase pressure for a few seconds right after the polishing starts (e.g., 15 seconds) and then gradually decrease pressure for a few seconds before finishing (e.g., 10 seconds). We also accept requests for the production of holders with hole shapes tailored to the samples, such as leveling machines and sample holders, so please feel free to consult with us. 【Polishing Unit Specifications】 ■ Holder Size: MAX. φ200mm ■ Disc Size: φ250, 300, 310mm ■ Primary Side Air: Requires an air source of 0.5MPa or more ■ Power Supply: Three-phase 200-220V 50/60Hz ■ Dimensions/Weight: W830×D855×H1730mm / Approximately 450kg *For more details, please refer to the PDF document or feel free to contact us.

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  • Other physicochemical equipment
  • Polishing Machine

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[Introduction] Sample Lab Center

We will make proposals centered around polishing machines, polishing devices, and sample polishing machines, utilizing the know-how of all precision polishing technologies.

【Overview】 - Dedicated polishing staff available - Providing satisfactory polished surfaces based on accumulated polishing experience data - Proposing jigs as design and production are conducted in-house - Offering detailed polishing reports to clarify the polishing process 【Demo Process】 1. Preliminary meeting 2. Sample collection 3. Setting conditions 4. Demo (on-site or online)

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  • Wafer processing/polishing equipment
  • Polishing Machine

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Special shapes such as porous types and irregular types are also possible! Information on custom holder production.

Production of holders that meet your requests! We can create holders that respond to customer needs based on in-house design, and we are also capable of producing special shapes such as porous types and irregular types.

At IMT Corporation, we accept custom holder production. Based on our extensive data from past polishing achievements, we not only create but also deliver precise and reliable polishing. If you are a customer who wants to polish large samples, or if you want to polish many small samples, or if you have reasons that prevent embedding, please consult with us. 【Examples of polishers we can produce】 ■ Semiconductor wafer polishing machine ■ Surface polishing equipment for LCD panels ■ Shaft polishing equipment ■ Robot polishing machine *For more details, please refer to the related links or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Polishing Machine

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Reasons for choosing IMT

Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.

Here are the reasons why our company is chosen. We primarily use domestic parts, which makes maintenance easy due to Japanese standards. It is also possible to dispatch dedicated technical staff on-site. Our meticulous work, characteristic of Japanese manufacturers, is complemented by prompt responses from sales staff who understand the technology. We thoroughly resolve customer dissatisfaction through close communication between sales and technical teams. 【Features】 ■ Detailed follow-up visits by sales representatives even after installation ■ Design and manufacturing at our headquarters in Wakayama Prefecture ■ Use of carefully selected domestic parts ■ Possibility of dispatching dedicated technical staff on-site ■ Prompt responses from sales staff knowledgeable in technology *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wafer processing/polishing equipment
  • Polishing Machine

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Chemical substance management regulations and countermeasures based on the Labor Safety and Health Act for SIC grinding paper.

Guidance on wearing protective gear is necessary. We are accepting consultations for initiatives.

According to a notification from the Ministry of Health, Labour and Welfare, it is mandated that individuals engaged in work involving carcinogenic substances must retain work records and other documentation for a period of 30 years, effective from April 1, 2023. Workers engaged in the manufacture or handling of substances that are clearly hazardous to health must be instructed to wear the following protective equipment: (1) Dust mask (2) Safety goggles (3) Protective gloves Please adhere to the laws and regulations of your local municipality regarding wastewater. Disposal will be classified as industrial waste. ■ Measures to reduce exposure levels must be minimized. As part of future initiatives with IMT, we will consider the following: (1) Examination of alternative products (2) Proposals for overall ventilation systems and local exhaust systems (3) Improvement of work methods We welcome inquiries regarding initiatives like those mentioned above, so please feel free to consult with us. *For more details, please do not hesitate to contact us.*

  • others
  • Polishing Machine

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Grinding device "Low-Speed Sander 76"

Recommended polishing equipment by polishing professionals!

The "Low-Speed Sander 76" enables a wide range of processing when combined with our kits, such as "Polishing + Hairline" and "Deburring." It can be used both horizontally and vertically, making it suitable for various polishing tasks, and we offer a rich lineup including "Polishing PRO Set 1" and "Polishing PRO Set 2," which addresses various burrs. 【Kit Lineup】 ■ Polishing PRO Set 1: Polishing + Hairline ■ Polishing PRO Set 2: Deburring ■ Polishing PRO Set 3: Mirror Finish ■ Polishing PRO Set 4: Gloss Finish Specialist *For more details, please download the PDF or feel free to contact us.

  • Other abrasives
  • Other surface treatment equipment
  • Polishing Machine

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Grinding device "Makenki"

A compact polishing device suitable for deburring and chamfering of machined parts!

The "Grinding Machine" is a polishing device that allows for angle adjustments of the disc surface by raising the stand. It is mainly suitable for applications such as deburring, chamfering, light grinding, and general polishing finishes of processed parts. We recommend the "Saving Series" discs, which allow for one-touch attachment and detachment for easy disc replacement. 【Specifications】 ■ Power Consumption: 150W (AC100V) ■ Spindle Speed - 3,275 min(-1) (50Hz) - 3,930 min(-1) (60Hz) ■ Main Unit Weight: 9.2 Kg *For more details, please download the PDF or feel free to contact us.

  • Other abrasives
  • Other surface treatment equipment
  • Polishing Machine

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Introduction to Processing Technology: Double-Sided Polishing and Lapping Processing

We are performing high-precision polishing of micron plates using a double-sided polishing machine!

We perform high-precision polishing of micron plates using a double-sided polishing machine. We also handle mass production polishing and lapping of difficult-to-cut materials such as iron and Kovar, as well as non-magnetic materials like copper, aluminum, SUS, titanium, and resin. Please contact us for more details.

  • Processing Contract
  • Polishing Machine

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Surface grinding processing using a horizontal axis rotary grinding machine

Active in the automotive and semiconductor industries! Surface grinding processing using a horizontal axis rotary grinding machine.

The 'Surface Grinding Process Using a Horizontal Axis Rotary Grinding Machine' involves grinding the reference surfaces, specifically the end faces and both end surfaces, as the first step when high-precision machining of flanged round objects is required. The reference end face, when processed using a magnetic chuck, is a crucial point to ensure that no deformation occurs during cylindrical grinding and internal grinding due to clamping with chucks and other fixtures. Additionally, the NC horizontal axis rotary grinding machine is suitable for high-precision machining of round objects and can also perform grinding with a taper of a few microns to facilitate easy assembly of the items. Recently, it has shown particular effectiveness in machining titanium materials, contributing to reduced processing time and improved precision for this difficult-to-cut material. [Features] - Materials: S45C, SUS304, A7075, SKD11, Titanium 64, etc. - Industries: Automotive parts prototyping, machine tool parts, semiconductor manufacturing equipment parts, etc. - Processing Machine: NC horizontal axis rotary grinding machine - Processing Accuracy: Flatness and parallelism of 0.001 to 0.005 - Work Size: Φ500×200L *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other machine elements
  • Wafer processing/polishing equipment
  • Polishing Machine

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Syringe grinding device

Are you having trouble with thin needles or finishing precision?

Our needle polishing machine may be able to meet your needs. We will customize the basic unit to your specifications. The standard machine accommodates needle sizes from 33G to 14G. Please feel free to consult us regarding other specifications or special needles.

  • Other processing machines
  • Polishing Machine

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grinder

A device that can sharpen any needle! Developed and manufactured with the aim of creating a product that anyone can handle with the ease of an automatic machine.

We would like to introduce our "Grinding Machine" that we manufacture. To accommodate the grinding of a wide variety of injection needles, it can handle single-point (single-edged needles) and double-point (double-edged needles) options, and it is capable of grinding any blade shape with a bevel angle ranging from 9 to 40 degrees. Additionally, we offer a lineup of equipment configurations that allow for side hole processing to be performed inline, including punch processing and EMG processing. 【Specifications (Partial)】 ■ General: Fully automatic control of grinding conditions ■ Grinding Chuck: 480mm long ■ Compatible Gauge: 13G (φ2.2) to 32G (φ0.23) ■ Needle Length: 12.5mm to 120.0mm (80-120mm is optional) ■ Grinding Angle: 9-40 degrees *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines
  • Mechanical Design
  • Polishing Machine

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Color Filter Full Surface Polishing Device [Correction of Protrusions & Improvement of RGB Surface Flatness]

A color filter full polishing device aimed at correcting protrusions and improving the flatness of the RGB surface!

We aim to correct the protrusions of various color filters and improve the flatness of the RGB surface. This method can absorb the warping of the glass substrate from the polishing tape side, achieving a uniform film thickness. Additionally, it is used to ensure the flatness of ribs in plasma displays and similar applications. Since it can be performed dry, cleaning is easy. Moreover, it is a device designed with inline considerations. 【Features】 ■ The surface roughness can be freely changed by replacing the tape. ■ The contact roller can closely adhere to the warping of the workpiece and perform polishing. ■ Since polishing is done from the high points of the workpiece, flatness is improved. *For more details, please request materials or view the PDF data available for download.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Tape-type centerless ultra-finish grinding machine CLP-300

Optimal for multiple varieties and small lots! A new proposed device after centerless grinding of grinding stones.

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Stamping Back Surface Polishing Device

Can be processed under suitable conditions! Even beginners can operate it easily.

The "Stamping Back Surface Polishing Device" can polish the back surface of a stamper using a wrapping film. The clamping (fixing) and unclamping (removal) of the workpiece is performed by the operator, while roll polishing, pad polishing, brush cleaning, and air blowing are done automatically. Various surface roughness requirements from different companies can be accommodated by selecting the appropriate wrapping tape and adjusting the parameters of the device to enable processing under optimal conditions. 【Features】 ■ It is possible to randomize the circumference of roll polishing with pad polishing. ■ Once the conditions are set, even beginners can operate it easily. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing Machine

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Spherical Polishing Device

Roughness control below Ra0.1μm is possible! Achieving high efficiency and low-cost processing.

This product is a device designed to improve the surface roughness of spherical parts using a tape polishing machine. The supply to the in-machine jig is performed by the operator, and the processing is done automatically via a start switch, making it a semi-automatic machine from which the operator retrieves the finished product. Additionally, the width of the polishing film can be selected based on the workpiece, enabling high efficiency and low-cost processing. 【Features】 ■ Capable of controlling roughness below Ra0.1μm ■ The width of the polishing film can be selected based on the workpiece ■ Achieves high efficiency and low-cost processing ■ Partial R polishing is also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing Machine

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Camwrap device

A composite device for tape polishing and brushing that maintains shape without distortion due to the tracking mechanism!

The "Cam Wrap Device" can perform deburring of the cam outer peripheral edge of the camshaft and finish the cam section with tape wrapping. The supply to the in-machine jig is done by the operator, and processing is automatically carried out by the activation switch, with discharge through a chute, making it a semi-automatic machine from which the operator retrieves the finished product. The backup roller of the tape unit follows the shape of the cam through a mechanism driven by a servo motor, ensuring that the shape is not distorted. 【Features】 ■ Equipped with a mechanism that follows the shape using a servo motor, preventing distortion ■ Capable of adjusting parameters such as tape, processing time, and pressure ■ A combined device for tape polishing and brushing, offered at a reasonable price *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing Machine

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基板平面研磨装置『FCMP-IIシリーズ』

装置の管理も簡単!ウエット・ドライの両用で使用可能です!

『FCMP-IIシリーズ』は、ラッピングテープの特徴を最大限に生かし、 目的とする研磨が容易に得られ、装置の管理も簡単な基板平面研磨装置です。 ウエット・ドライの両用で使用可能。 一度セットアップすると誰でも簡単に使用出来ます。 メッキ/ラミネート/レジスト塗布の前処理研磨などにご使用いただけます。 【特長】 ■テープ番手の選択にて、粗さの管理が容易 ■ウエット・ドライの両用で使用可能 ■一度セットアップすると誰でも簡単に使用出来る ※詳しくはPDF資料をご覧いただくか、お気軽にお問い合わせ下さい。

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing Machine

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Full Surface Grinding (Z-axis Control)

A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.

This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Wafer processing/polishing equipment
  • Polishing Machine

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[Presenting Case Studies for Problem Solving] Examples of Installation of Outer Diameter Grinding Equipment

We will introduce a case study of the installation of an outer diameter polishing device at a medical device manufacturer! We solve problems such as dirt on equipment that cannot use cleaning agents!

We would like to introduce a case study proposed by Sanshin Corporation that addresses on-site issues. A certain medical device manufacturer had the concern that "the outer diameter of the pipes used in medical devices has dirt on it after the final process. Since it is for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed." In response, we proposed our "outer diameter polishing device," which allows for the polishing of the workpiece's outer diameter. As a result, by changing the buff polishing process to film polishing, we were able to reduce the cleaning process. This improved the appearance of the finish and contributed to quality enhancement. 【Case Study】 ■ Issues - The outer diameter of the pipes used in medical devices has dirt on it after the final process. - Due to being for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed. ■ Proposal - Introduced the "outer diameter polishing device" that allows for the polishing of the workpiece's outer diameter. - Conducted sample tests, and modifications to specifications according to customer requests are also possible. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other abrasives
  • Polishing Machine

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[Information] Basic Knowledge of Film Polishing - Introductory Edition

Automation of hand polishing, time reduction, and stabilization of quality are possible! Introducing the basic knowledge of film polishing.

"Film polishing" is a polishing method that uses a film-like sheet surface called wrapping film, to which fine abrasive particles are adhered. This document serves as an introductory guide to the basic knowledge of film polishing, covering topics such as "What is film polishing?", the "Differences between film polishing and buff polishing," and the "Differences between film polishing and lap grinding." Please take a moment to read through it. [Contents] ■ What is film polishing? ■ What is Sanshin's Super Finisher? ■ Differences between film polishing and buff polishing ■ Differences between film polishing and lap grinding ■ Next time (internal diameter polishing, ball screw polishing, spherical polishing) *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine tools
  • Wafer processing/polishing equipment
  • Polishing Machine

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