CMP process development, prototyping, and contract processing! With reliable technical skills and experience, we meet our customers' needs.
We would like to introduce our CMP/Dicing business, "MAT Division."
We offer services such as "flattening," "smoothing," and "thinning (thin film)," not only in the semiconductor field but also for SiC power devices, SOI, micro-machines (MEMS), optical devices, LED sapphire, organic EL, and more.
With our reliable technical expertise and experience, we respond to our customers' needs in advanced technologies such as "grinding," "lapping," "polishing," "CMP," and "cleaning."
【Features】
■ CMP process development, prototyping, and contract processing
■ "Flattening," "smoothing," "thinning (thin film)"
■ Not limited to the semiconductor field
■ Responding to customer needs with reliable technical expertise and experience
*For more details, please refer to the related link page or feel free to contact us.