We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. グロース Kanagawa//Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  4. 4 プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所 Saitama//Electronic Components and Semiconductors
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors

Substrate Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Handbook for Circuit Board Noise Countermeasures グロース
  2. Understand in 3 minutes! A substrate that dissipates heat faster [Materials available]. プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
  3. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  4. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン
  5. 5 Integrated in-house support for shaping, processing, and firing! Contract processing of ceramics. マルワイ矢野製陶所

Substrate Product List

1756~1770 item / All 1882 items

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Piezoelectric buzzer

Adding pronunciation functions to home appliances! Introducing pronunciation components that incorporate piezoelectric elements into the casing.

We would like to introduce the "Piezoelectric Buzzer" handled by Sansen Electronics Co., Ltd. This is a sound-emitting component that incorporates a piezoelectric element into its housing and has a built-in oscillation circuit, allowing it to generate sound pressure when a DC voltage is applied. It has high sound pressure and can operate in high-temperature environments. Additionally, products are available in sizes ranging from 10mm to 50mm. 【Features】 ■ Lightweight ■ Thin ■ Capable of producing various sounds, including single tones and pulse sounds ■ High sound pressure ■ Can operate in high-temperature environments ■ OEM *You can download the English version of the catalog. *For more details, please feel free to contact us.

  • Piezoelectric Devices
  • Sound Parts

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[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

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[Market Report] Global Market for Ceramic Substrates

Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market

The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.

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OKI Circuit Technology Implementation Services

Combining OKI's technology and skills with your products to realize the development of new products! Please feel free to consult with us.

At OKI, we provide high-quality support for large, high-density substrates and short-term production of a wide variety of small quantities. This is a comprehensive production contract service that leverages the design and production technologies cultivated in the information and communication manufacturing sector. By combining OKI's technology and skills with your products, we realize the development of new products. Please feel free to consult with us. 【Features】 ■ Procurement of materials can be accepted ■ Comprehensive support from development to implementation ■ Low-cost solutions for 0402 chips and manual soldering ■ Comprehensive production contract service utilizing design and production technologies *For more details, please refer to the PDF materials or feel free to contact us.

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Proposal for thermal management of electronic devices and solutions for heat dissipation.

Mass production of copper coin printed circuit boards is possible for high multilayer substrates that require heat dissipation and thermal management. High heat dissipation is achieved with a uniquely developed copper coin structure.

Our company is capable of providing copper coin※ (heat dissipation structure) wiring boards. With the advancement of 5G communication devices, thermal management of high-speed, high-frequency components has become a challenge. Additionally, as devices become more compact, semiconductors and electronic components are mounted on substrates at high density, and a fanless structure that eliminates fans and heat sinks within the device is required for low power consumption. Copper coin printed circuit boards can achieve an advanced "heat dissipation structure" that efficiently dissipates the heat generated by electronic components within a limited area. ※Copper coin: A material shaped into a cylindrical form, significantly improving the thermal conductivity of the substrate compared to thermal vias. 【Features】 <Development> - Realization of embedding copper coins directly beneath heat-generating components on high-layer-count substrates. - Ensuring high reliability by embedding cylindrical copper using a unique method that minimizes load. - Dramatic improvement in the thermal conductivity of the substrate due to the copper coin structure. - Unique development of equipment for embedding copper coins, allowing flexible adaptation to various coin sizes. - Comprehensive support for thermal simulation, prototyping, and mass production. - Capability for fanless housing design to achieve space-saving and high-efficiency heat dissipation. - Significant improvement in heat dissipation when used in conjunction with thermal management components such as heat pipes and thermal conductive sheets.

  • Circuit board design and manufacturing

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【OMRON:C500-IA121】

【Support for Electronic Component Procurement】 We support the urgent procurement of discontinued products (EOL products) and hard-to-obtain electronic components and semiconductors! We have established a thorough inspection system.

Are you looking for this model number product? ■Manufacturer: OMRON ■Model number: C500-IA121 Owen Corporation swiftly procures electronic components that have become difficult to obtain due to production discontinuation or delivery issues from a global network. We will definitely issue a quotation, so you can confirm the details before placing an order, providing peace of mind. A veteran inspector who has monitored market distribution inventory for over 20 years conducts inspections, and only products that pass inspection are shipped. All delivered items include an inspection report. 【Our Inspection System】 ■X-ray Inspection Non-destructive testing to check internal structures and detect counterfeit or inferior products. ■Microscope Carefully checks for lead bending and any discrepancies in printed fonts. ■Digital Caliper Measures dimensions to the hundredth of a millimeter to detect cleverly crafted counterfeits. ■Curve Tracer Displays the voltage and current characteristic waveforms between terminals on the screen to detect defective products. ★Please visit our website from the link below. ★You can view our company brochure from the download button below. ▼For other model numbers you can inquire about, please refer to the lineup below.

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Linkstech YGA Corporation

Manufacturing and sales of printed circuit boards and mold manufacturing.

Yamagishi AIC Co., Ltd. has been engaged in the manufacturing of distinctive printed circuit boards, such as metal base wiring boards, since its establishment in 1956, anticipating the demands of the times and providing products that meet customer needs, thereby advancing its business development. In line with the corporate vision of Hitachi Chemical Co., Ltd., which states, "With the courage and spirit of challenge to step into unknown territories, we create 'new value' ahead of the times, swiftly providing optimal solutions to various challenges faced by our customers and society," we operate under the slogan "Working On Wonders" and will continue to propose attractive new products to our customers. Furthermore, all employees of our company pledge to deeply recognize that the corporation is a member of society and to strive for the realization of a richer society through CSR (Corporate Social Responsibility), harmony with the environment, and proactive social contribution activities.

  • others

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Development status and market outlook of the 2008 next-generation COF (New Etch/Semi-Additive/Low CTE-PI)

Development Status and Market Outlook of 2008 Next-Generation COF (New Etching/Semi-Additive/Low CTE-PI)

LCD panels have grown the market due to high image quality and low prices. There is also a strong demand for these requirements in related components, and naturally, low cost and high functionality are also required for LDI and COF. To address these somewhat conflicting needs, next-generation COF technology is becoming essential.

  • Other semiconductors
  • LCD display
  • Printed Circuit Board

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"Cost reduction with minimal initial investment" capable of handling everything from prototype circuit boards to mass production.

"We want to keep costs down, but we don't want to compromise on the quality of the circuit board." We will respond to such requests! We will help reduce costs with minimal initial investment.

At PC Electronics, we cover the entire process of electronic components, from product development to rapid parts procurement, printed circuit board manufacturing, circuit design, assembly, production, and quality control. Moreover, we can assist in cost reduction with minimal initial investment. Please check as conditions may vary depending on quantity and specifications. Additionally, because we are not only responsible for a part of the process but also have a comprehensive understanding of all stages, we maintain a quality that you can trust. We provide flexible support from any stage while achieving high quality. If you have requests to reduce costs while maintaining the quality of the circuit boards, please feel free to consult with us! *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Plax Inc. Company Profile

We respond to various customer needs with detailed services from development to manufacturing! We can accommodate requests from any stage of the process.

Plax provides consistent support from prototype development to mass production of electronic devices. We respond to various requests, including electronic device development, printed circuit board design, simulation, board manufacturing, component procurement, prototype assembly, and mass production assembly. Please feel free to contact us when you need our services. 【One-Stop Solution for Electronic Device Development】 1. Electronic device development 2. Printed circuit board design and simulation 3. Board manufacturing 4. Component procurement 5. Prototype assembly 6. Mass production assembly *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Prototype Services

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