We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
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Substrate Product List and Ranking from 554 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors

Substrate Product ranking

Last Updated: Aggregation Period:Nov 05, 2025~Dec 02, 2025
This ranking is based on the number of page views on our site.

  1. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  2. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  3. Notice of Participation in "Nepcon Japan" 共立エレックス
  4. Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 4 Low thermal expansion zero alloy material LEX ZERO. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室

Substrate Product List

1846~1859 item / All 1859 items

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[Research Material] Global Market for Semi-Insulating SiC Substrates

World Market for Semi-Insulating SiC Substrates: 2-inch and 3-inch SiC Substrates, 4-inch SiC Substrates, 6-inch SiC Substrates, IT & Consumer, LE ...

This research report (Global Semi-insulating SiC Substrates Market) investigates and analyzes the current status and outlook for the global market of semi-insulating SiC substrates over the next five years. It includes information on the overview of the global semi-insulating SiC substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semi-insulating SiC substrate market focus on 2-inch and 3-inch SiC substrates, 4-inch SiC substrates, and 6-inch SiC substrates, while the segments by application target IT & consumer, LED lighting, automotive, and industrial sectors. The regional segments calculate the market size of semi-insulating SiC substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the semi-insulating SiC substrate market, product and business overviews, and sales performance.

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[Research Material] Global Market for PCBs (Printed Circuit Boards)

World Market for PCBs (Printed Circuit Boards): Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Electronics Industry, Intelligent Control Devices

This research report (Global PCB (Printed Circuit Board) Market) investigates and analyzes the current state of the global PCB (Printed Circuit Board) market and its outlook for the next five years. It includes information on the overview of the global PCB market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the PCB market by type include single-sided boards, double-sided boards, and multi-layer boards, while the segments by application focus on the electronics industry and intelligent control devices. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of PCBs. It also includes the market share of major companies in the PCB market, product and business overviews, and sales performance.

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[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates

World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...

This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.

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[Research Material] Global Market for Sapphire Composite Substrates

World Market for Sapphire Composite Substrates: C-Plane Sapphire Substrates, R/M-Plane Sapphire Substrates, Patterned Sapphire Substrates ...

This research report (Global Sapphire Compound Substrate Market) investigates and analyzes the current state and outlook for the global sapphire compound substrate market over the next five years. It includes information on the overview of the global sapphire compound substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the sapphire compound substrate market include C-Plane sapphire substrates, R/M-Plane sapphire substrates, and patterned sapphire substrates, while the segments by application include LED, RFIC, laser diodes, silicon-on-sapphire (SoS) ICs, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of sapphire compound substrates. It also includes the market share of major companies in the sapphire compound substrate market, product and business overviews, and sales performance.

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[Research Material] Global Market for SERS Substrates

World Market for SERS Substrates: Gold, Silver, Others, Biotechnology/Pharmaceuticals, Chemical Industry, Food Industry, Others

This research report (Global SERS Substrate Market) investigates and analyzes the current state and outlook for the global SERS substrate market over the next five years. It includes information on the overview of the global SERS substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the SERS substrate market focus on gold, silver, and others, while the segments by application cover biology & pharmaceuticals, chemical industry, food industry, and others. The regional segments calculate the market size of SERS substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the SERS substrate market, product and business overviews, and sales performance.

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[Research Material] Global Market for Semiconductor and IC Packaging Materials

Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Automotive Industry ...

This research report (Global Semiconductor & IC Packaging Materials Mark) investigates and analyzes the current state and future outlook of the global semiconductor and IC packaging materials market over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, and ceramic packages, while the segments by application cover the automotive industry, electronics industry, telecommunications, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of semiconductor and IC packaging materials. It also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.

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[Research Material] World Market for Single-Sided Printed Circuit Boards

World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others

This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.

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5G base station antenna compatible printed circuit board (PCB)

We would like to propose a printed circuit board for 5G base station antennas!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Do you have any concerns such as "I would like to consider next-generation high-frequency application substrates"? We will support you in solving challenges for product commercialization. We will provide proposals tailored to your needs, such as the adoption of new high-frequency materials and joint evaluations. 【Solving the following concerns】 ■ I would like to consider high-frequency application substrates for next-generation 5G communication ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to reduce the cost of high-speed, high-frequency compatible substrates Our article has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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400Gbps switch-compatible printed circuit board (PCB)

We would like to propose a printed circuit board compatible with 400Gbps switches!

Our company will realize products that support transmission from 25Gbps to 400Gbps. Currently, as ultra-high-speed network environments are in demand, do you have any concerns such as wanting to consider high-frequency application substrates for 400G switches? We will support you in solving issues towards product commercialization. We will provide proposals tailored to your needs, including the adoption of new high-frequency materials and joint evaluations. [We solve the following issues] ■ I want to consider high-frequency application substrates for next-generation switches. ■ I want to consider high-frequency application substrates for 5G communication. ■ I want to reduce transmission loss and delay time. ■ I want to accurately match the characteristic impedance. ■ I want to reduce the cost of high-speed, high-frequency compatible substrates. Our article has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory to reduce cumulative hours by 480 over three years] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High-speed transmission printed circuit board

We provide high-precision simulations compatible with various low-loss substrates both domestically and internationally!

We provide printed circuit boards that support high-speed transmission, such as 5G infrastructure and high-frequency device test boards. We accommodate various low-loss materials both domestically and internationally, with high-precision impedance control for multilayer boards. We offer high-precision simulations based on the back data of our manufactured boards. 【Features】 ■ Manufacturing Process - High-precision impedance control - Back drill processing accuracy ■ Board Design - Support for various simulations *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Toho Electric Industrial Co., Ltd.

"Quality is our guarantee" is our motto, supporting everything from electronic circuit design to assembly.

Toa Electric Co., Ltd. is a company that provides consistent support from electronic circuit design to assembly. It handles a wide range of products, including wire harnesses, panel modules for construction machinery, in-vehicle control controllers, and various printed circuit boards. With bases in China and Vietnam, it leverages its overseas production system to maintain cost competitiveness and accommodate diverse, small-lot production. Utilizing technology in machinery, electrical, electronic circuits, and software design, it prioritizes quality in its product offerings.

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DX Simple Diagnosis Service

By presenting appropriate measures, we achieve an increase in the success rate of DX and maximize its effectiveness!

The "DX Simple Diagnosis Service" is a service where professionals in digital transformation quickly diagnose highly specialized and often unclear challenges and risks. Based on inputs such as DX project proposals and hearing results, analysis is conducted from the perspectives of "management," "operations," and "administration," and the DX diagnosis results are presented. This service objectively evaluates your company's DX strategy and policies from multiple perspectives, identifying areas that require further consideration. Additionally, it quickly scores individual DX themes and assesses promising themes with high priority. [Diagnosis Goals] ■ Formulating strategies and actions that lead to results ■ Identifying improvement points for generating outcomes ■ Understanding project status and identifying challenges and risks *For more details, please download the PDF or feel free to contact us.

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