Electrode growth substrate
Electrode growth substrate
It is a substrate that allows the terminal area on the substrate to grow thicker and taller than other terminals.
- Company：アーセルデザイン
- Price：Other
Substrate Product List and Ranking from 560 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
Substrate Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
- 山下マテリアル Kanagawa//Electronic Components and Semiconductors
- グロース Kanagawa//Electronic Components and Semiconductors
- 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
- アイン 本社工場 Nagano//Electronic Components and Semiconductors
- 5 スクリーンプロセス Kanagawa//others
Substrate Product ranking
Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.
- Handbook for Circuit Board Noise Countermeasures グロース
- <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
- Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン
- Flat Cable Checker "KE8001" 共和電子製作所
- 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
Substrate Product List
1831～1845 item / All 1883 items
Displayed results
Copper inlay substrate
Copper inlay substrate
By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.
- Company：アーセルデザイン
- Price：Other
Aluminum substrate
Aluminum substrate
You can achieve a significant heat dissipation effect. We can provide a quote including manufacturing.
- Company：アーセルデザイン
- Price：Other
Tester board (performance/probe/semiconductor evaluation)
Tester board (performance/probe/semiconductor evaluation)
We have a track record of various custom boards for semiconductor testers.
- Company：アーセルデザイン
- Price：Other
Ultra-low transmission loss substrate (MEGTRON6)
Ultra-Low Transmission Loss Substrate (MEGTRON6)
Design will be conducted using high-frequency substrates and high-speed transmission substrates.
- Company：アーセルデザイン
- Price：Other
Prototyping and implementation achievements of various charger-related printed circuit boards.
We would like to introduce our achievements in the production of various charger-related printed circuit boards. *For waterproof and dustproof measures for mounted boards!
Our company has a wealth of experience in manufacturing handheld processing equipment, charger circuit boards, memory card charger circuit boards, EV charging device control circuit boards, and more. Tojo Manufacturing offers one-stop total support from prototype printed circuit boards to final assembly. Please feel free to consult us if you have any concerns regarding delivery times or quality. 【Manufacturing Achievements】 ■ Handheld processing equipment and charger circuit boards ■ Memory card charger circuit boards ■ EV charging device control circuit boards, etc. *For more details, please refer to the external link page or feel free to contact us.
- Company：東條製作所
- Price：Other
Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements
Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.
We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
![[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.](https://image.mono.ipros.com/public/product/image/2078708/IPROS18117510147851009335.jpg?w=280&h=280)
[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.
We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!
In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster
Explanation of the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling material inside the TH!
In the field of medical devices, there is a simultaneous demand for miniaturization and high performance. In particular, it is necessary to pack many electronic components into a limited space, making the heat dissipation performance of the circuit board crucial. Inadequate heat dissipation can lead to equipment malfunctions and a decrease in lifespan. Our materials on "circuit boards that dissipate heat faster" address these challenges. 【Application Scenarios】 - Miniature medical devices - Portable medical devices - High-density mounted circuit boards 【Effects of Implementation】 - Improved reliability of devices - Extended product lifespan - Achieving miniaturization
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster
We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!
In the home appliance industry, there is a demand for longer product lifespans. In particular, heat is one of the major factors that accelerate the deterioration of electronic components. High heat dissipation performance substrates enhance product reliability and contribute to longevity. Our "faster heat-dissipating substrate" addresses this challenge. 【Usage Scenarios】 * Design of home appliances * Improvement of product reliability * Longevity 【Effects of Implementation】 * Reduced risk of product failure * Improved product durability * Increased customer satisfaction
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
A substrate that dissipates heat faster for industrial robots.
Presentation of thermal via and copper pin thermal conductivity comparison materials! Contributing to high precision.
In the industrial robot industry, thermal management of circuit boards is crucial for achieving high-precision movements. In particular, densely mounted electronic components tend to generate heat, which poses risks of performance degradation and failure due to heat. If thermal management is insufficient, the accuracy of the robot's movements may decline, negatively impacting product quality and production efficiency. Our "faster heat-dissipating circuit board" provides materials explaining the structural comparison of thermal vias and copper pins, as well as the effects of changing TH fillers, supporting the high precision of industrial robots by offering high thermal conductivity circuit boards. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Welding robots needing precise control - Conveying robots requiring high-speed operation 【Benefits of Implementation】 - Solving thermal issues of circuit boards to achieve stable robot operation - Improving product quality and yield - Reducing maintenance costs
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
A substrate that dissipates heat faster for power electronics.
Presentation of thermal via and copper pin thermal conductivity comparison materials! Supporting high output.
In the power electronics industry, increasing output power is essential for improving product performance and miniaturization. However, with higher output power, the heat dissipation performance of the substrate becomes a challenge. Inadequate heat dissipation raises the risk of performance degradation and failure due to temperature rise in the device. Our products provide materials that explain the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material within the thermal vias, supporting the design of substrates with high heat dissipation. This contributes to improved product reliability and longevity. 【Usage Scenarios】 - High-output power devices - High-density mounting substrates - Use in high-temperature environments 【Benefits of Implementation】 - Improved heat dissipation performance - Enhanced product reliability - Increased device longevity
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
【For Wearable Devices】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster
Explaining the comparison of thermal conductivity between thermal vias and copper pins! Materials are being distributed.
In the wearable device industry, miniaturization and lightweight design are important challenges. With the enhancement of device performance, heat dissipation measures for the circuit board are essential, and thermal design significantly affects the reliability and performance of the product. Poor heat dissipation can lead to device malfunctions and reduced lifespan. The materials we provide regarding "circuit boards that dissipate heat faster" explain the structural comparison of thermal vias and copper pins, as well as the effects of changing the filling material in through-holes, contributing to the miniaturization and high performance of wearable devices. 【Usage Scenarios】 - High-density mounted circuit boards - Devices requiring miniaturization - Electronic equipment needing thermal management 【Benefits of Implementation】 - Improved heat dissipation - Enhanced device reliability - Extended product lifespan
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
【For Game Consoles】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster
Explanation of the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material inside the TH!
In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become an important issue. Particularly when performing high-load processing, it is essential to mitigate the risks of performance degradation and failure due to heat. Our "circuit board that dissipates heat faster" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the effects of changing the filling material within through-holes, supporting the realization of high heat-dissipating circuit boards. This material will help understand the key points in circuit board design aimed at enhancing the performance of gaming consoles. 【Usage Scenarios】 - Development of high-performance gaming consoles - Circuit board design requiring heat management 【Benefits of Implementation】 - Reduces the risk of performance degradation due to heat - Improves product reliability - Streamlines circuit board design
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
A substrate that dissipates heat faster for EV chargers.
Presentation of thermal conductivity comparison materials between thermal vias and copper pins! For thermal management of rapid chargers.
In the EV charger industry, heat generation during rapid charging is a significant issue. Particularly during high-power charging, the heat dissipation performance of the substrate becomes a crucial factor that affects charging efficiency and product lifespan. Inadequate heat dissipation can lead to component degradation or failure, potentially compromising the reliability of the charger. Our "faster heat-dissipating substrate" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the differences in thermal conductivity due to variations in TH fillers, supporting thermal management for EV chargers. 【Usage Scenarios】 - Rapid chargers - High-power charging - Electronic devices requiring thermal management 【Benefits of Implementation】 - Improved heat dissipation - Extended product lifespan - Enhanced charging efficiency
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
