Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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1～15 item / All 22 items
Test chip with solder bumps
Test chip equipped with solder bumps □Product name ... JTEG Phase1E50/JTEG Phase1E28/JTEG Phase1E15 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.
Test chip with solder bumps
Test chip equipped with solder bumps (narrow pitch area type) □Product name ... JTEG Phase2E200/JTEG Phase2E175/JTEG Phase2E150 ■Main applications Material development, equipment development, substrate development, package development Process startup/development, promotional data acquisition, etc.
Test chip for thermal resistance and stress measurement.
Thermal resistance and stress measurement test chip □Product name... JTEG Phase5/JTEG Phase5GB2 ■Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
Test chip for evaluating LCD driver implementation.
Liquid Crystal Driver Implementation Evaluation Test Chip □ Product Names ... JTEG Phase6_50/JTEG Phase6_35 JTEG Phase6_30/JTEG Phase6_25 JTEG Phase6_15S/JTEG Phase6_20 JTEG Phase6_40/JTEG Phase6_25E JTEG Phase6_60 ■ Main Applications Material development, equipment development, substrate development, process startup/development, promotional data acquisition, etc.
![Test chip [Large general-purpose]](https://image.mono.ipros.com/public/product/image/232/135151026/IPROS_18202600641364791000.gif?w=280&h=280)
Test chip [Large general-purpose]
General-purpose test chip with a larger chip size than JTEG Phase 0 ■ Wafer size ... 8-inch wafer ■ Base chip size ... 3.5mm × 3.5mm ■ Pad pitch ... 120μm ■ Number of pads ... 96 bumps (the inner pads do not have aluminum pads opened) ■ Compatible bump process ... gold stud bump ■ Compatible substrate ... none ■ Options ... bump mounting / dicing processing / back grinding processing ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
![Test chip [for ultra fine pitch WB/FC mounting evaluation]](https://image.mono.ipros.com/public/product/image/e58/135151030/IPROS_16186590904543728000.gif?w=280&h=280)
Test chip for ultra-fine pitch WB/FC mounting evaluation.
Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip ■Wafer Size ... 8-inch wafer ■Base Chip Size ... 6.0mm × 2.3mm ■Pad Pitch ... 300μm ■Number of Pads ... 16 bumps ■Compatible Bump Process ... None ■Compatible Substrate ... None ■Options ... Dicing processing / Back grinding processing ■Main Applications Material development, promotional data acquisition, etc.
![Test chip [for ultra fine pitch WB/FC mounting evaluation]](https://image.mono.ipros.com/public/product/image/54b/135151029/IPROS_15090265310453498000.gif?w=280&h=280)
Test chip for ultra-fine pitch WB/FC mounting evaluation.
Ultra Fine Pitch WB・FC Implementation Evaluation Test Chip □Product Name... JTEG Phase11_80/JTEG Phase11_70/JTEG Phase11_60/JTEG Phase11_50/JTEG Phase11_40 ■Main Applications Package development, process startup/development, promotional data acquisition, etc.
Test Chip 【Multi-Type】
Fine pitch wire bonding, gold-plated bumps, gold stud bumps, and multi-purpose test chip ■ Wafer size: 6-inch wafer ■ Base chip size: 2.11mm × 2.11mm ■ Pad pitch: 45, 50, 60μm from the chip inner peripheral pads ■ Number of pads: 92, 92, 100 pads from the chip inner peripheral pads ■ Compatible bump processes: Gold-plated bumps (select one type from pads with 45, 50, 60μm pitch) / Gold stud bumps ■ Compatible substrates: None ■ Options: Dicing processing / Back grinding processing ■ Main applications Material development, equipment development, substrate development Process startup/development, promotional data acquisition, etc.
Test chip 【Ultra-small chip size 0.55mm】
Ultra-small chip size 0.55mm□ test chip ■ Wafer size ... 6-inch wafer ■ Base chip size ... 0.55mm × 0.55mm□ ■ Pad pitch ... 110μm ■ Number of pads ... 8 pads ■ Compatible bump processes ... Gold-plated bump / Gold stud bump ■ Options ... Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation (excluding gold-plated bump products) ■ Main applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
High-precision position detection is possible! It excels in low interference with other devices and non-invasiveness to the human body.
At Japan G.I.T. Co., Ltd., we are working on the development of proprietary LSI to realize impulse-based UWB with low power consumption and low cost. "Impulse UWB" can be applied not only for high-speed communication but also for high-precision distance measurement and positioning sensors, as well as short-range radar. Due to its low interference with other devices and non-invasive nature to the human body, it is also attracting attention as a technology for medical devices. 【Features】 ■ High-speed data communication ■ Low interference with electronic devices ■ Non-invasive to the human body ■ Low power consumption ■ Low cost *For more details, please refer to the PDF document or feel free to contact us.
Test chip for evaluating Cu bonding with Cu bumps.
Cu bump mounted Cu bonding evaluation test chip ■Wafer size ... 8-inch wafer ■Base chip size ... 5.09mm × 5.09mm ■Pad pitch ... 150μm (staggered pads) ■Number of pads ... 841 bumps ■Compatible bump process ... Cu bump ■Compatible substrate ... None ■Options ... Bump mounting / Dicing processing / Back grinding processing ■Main applications Package development, process startup/development, promotional data acquisition, etc.
Test chip with next-generation solder bumps.
Next-generation test chip with Low-K film used in the interlayer dielectric layer for solder bumps ■Wafer size: 8-inch wafer ■Base chip size: 5.02mm × 5.02mm ■Pad pitch: 200μm (staggered pads) ■Number of pads: 484 bumps ■Compatible bump processes: Eutectic solder / Lead-free solder ■Compatible substrate: JKIT Type 5 ■Options: Bump mounting / Dicing processing / Back grinding processing / Surface polyimide film formation ■Main applications: Package development, process ramp-up / Development, promotional data acquisition, etc.
Glass chip for observing underfill entrapment voids.
Underfill Encapsulation Void Observation Glass Chip ■Wafer Size: 5-inch Wafer ■Base Chip Size: 5.02mm × 5.02mm ■Pad Pitch: 200μm ■Number of Pads: 484 Bumps ■Compatible Bump Processes: Eutectic Solder / Lead-Free Solder ■Compatible Substrates: JKIT Type1 (SIDE A) / JKIT Type5 ■Base Material: Natural Quartz Glass ■Options: Bump Mounting / Dicing Processing ■Main Applications: Material Development, Process Startup/Verification, Promotional Data Acquisition, etc.
Low power consumption and low cost! It has excellent low interference with devices and non-invasive properties for the human body.
"Impulse Radio (IR, Impulse Radio) UWB" can be applied not only for high-speed communication but also for high-precision distance measurement and positioning sensors, as well as short-range radar, due to its characteristics. Additionally, it is attracting attention as a technology for medical devices because of its low interference with other devices and non-invasive nature towards the human body. At Japan G.I.T. Co., Ltd., we are working on the development of proprietary LSI to realize this product with low power consumption and low cost. 【Features】 ■ High-precision position detection ■ High-speed data communication ■ Low interference with electronic devices ■ Non-invasive to the human body ■ Low power consumption ■ Low cost *For more details, please refer to the PDF materials or feel free to contact us.
Test chip for ultra-fine pitch wire bonding evaluation.
Super Fine Pitch Wire Bonding Evaluation Test Chip ■Wafer Size: 8-inch wafer ■Base Chip Size: 3.0mm × 3.0mm ■Pad Pitch: 30, 35, 40, 45, 50, 55, 60μm from the chip inner peripheral pads ■Number of Pads: 120, 136, 144, 152, 152, 160, 160 pads from the chip inner peripheral pads ■Compatible Bump Process: None ■Compatible Substrate: None ■Options: Dicing processing / Back grinding processing ■Main Applications Material development, equipment development, package development Process startup/development, promotional data acquisition, etc.
