From chiplets and CoWoS to optoelectronic integration. A systematic explanation of semiconductor packaging technology from the basics to the latest trends.
Title: "Fundamentals of Semiconductor Packaging Technology
~ From the Evolution of Package Types to Manufacturing Processes, Equipment and Materials Used, and Latest Trends ~"
This is an introductory seminar where you can systematically learn about semiconductor packaging technology from the basics to advanced techniques. It provides a clear explanation of the role of packaging technology that supports the high performance of semiconductors, its evolutionary background, manufacturing processes, and materials and equipment technologies. In addition to the characteristics of various package types such as DIP, QFP, BGA, and WLCSP, it also details major manufacturing technologies such as back grinding, dicing, die bonding, wire bonding, and molding. Furthermore, you will learn about the trends and future prospects of the latest technologies such as SiP, FOWLP, CoWoS, EMIB, chiplets, and optoelectronic integration packaging. This content is ideal for semiconductor engineers as well as sales and marketing personnel who want to understand packaging technology from the ground up.
