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package Product List and Ranking from 362 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

package Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. パナソニック アドバンストテクノロジー Osaka//IT/Telecommunications
  2. null/null
  3. フィルネクスト 本社 Kyoto//Resin/Plastic
  4. 4 株式会社ハイブリッチ／ビス Tokyo//IT/Telecommunications
  5. 5 新東工業 Aichi//Industrial Machinery
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package Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. Autonomous Mobile Robot Software Package '@mobi' パナソニック アドバンストテクノロジー
  2. Efforts for environmental measures! Sustainable packaging that considers nature.
  3. Microwave-compatible retort package "Retort Microwave Bag" フィルネクスト 本社
  4. 4 Autonomous Mobile Package Software @mobi 2.6 パナソニック アドバンストテクノロジー
  5. 5 Embedded AI package "Device Brain" for Mitsubishi Electric sequencers. たけびし

package Product List

361～375 item / All 654 items

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[Data] WTI Blog November 2020

[Data] WTI Blog November 2020

Evaluation and analysis methods for BGA packages and BGA substrate design are published!

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" aimed at solving the shortage of engineers, from November 2, 2020, to November 27, 2020. It introduces topics such as "Recommendation for Automatic Measurement - Basics of Instrument Control" from November 2, 2020, "Evaluation and Analysis Methods for BGA Packages" from November 10, 2020, and "What is the Required Ground Area for Each LTE Band?" from November 11, 2020. Additionally, it includes a wealth of useful information related to products and industries. We encourage you to take a look. [Contents] ■ November 2, 2020: Recommendation for Automatic Measurement - Basics of Instrument Control ■ November 5, 2020: Required Functions for Power Conditioners (Part 1) ■ November 6, 2020: Trying Illumination Control with Arduino Part 1 ■ November 10, 2020: Evaluation and Analysis Methods for BGA Packages ■ November 11, 2020: What is the Required Ground Area for Each LTE Band? (Radiation Efficiency of Monopole Antennas) *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Embedded system design service
  • Circuit board design and manufacturing

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[Data] WTI Blog January 2022

[Data] WTI Blog January 2022

Introduction of necessary items for semiconductor package assembly and examples of inquiries from substrate manufacturers.

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is engaged in the "Development Design Promotion Business" to solve the shortage of engineers, from January 11, 2022, to January 25, 2022. It introduces topics such as "What is needed for assembling semiconductor packages" from January 11, 2022, "Inquiry case studies from substrate manufacturers" from January 18, 2022, and "The birth of WTI's navigation character 'Namirin's' Air POP balloon!" from January 25, 2021. In addition, we have published a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ January 11, 2022 "What is needed for assembling semiconductor packages" ~ Printed Circuit Board Design Edition ~ ■ January 18, 2022 Inquiry case studies from substrate manufacturers ~ Substrate design also requires adjustments that align with the manufacturing processes of substrate manufacturers ~ ■ January 25, 2021 The birth of WTI's navigation character "Namirin's" Air POP balloon! *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductors
  • Printed Circuit Board
  • Other electronic parts

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[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

[Data] Shirutoku Report No. 24 # Evaluation and Analysis Methods of BGA Packages

A structure in which electrodes are provided on the substrate, solder balls are formed on top, and are joined to the electrodes on the package side!

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will discuss the analysis methods for "BGA packages." "BGA" stands for "Ball Grid Array," which is a type of package for integrated circuits (ICs). In simple terms, it is a surface mount package that has electrodes (lands) on the substrate, with solder balls formed on top to connect to the electrodes on the package side. For more details, please take a look. [Contents] ■ About BGA Packages ■ Dyeing Analysis ■ Cross-Section Polishing *For more information, please refer to the PDF document or feel free to contact us.*

  • Contract Analysis
  • Contract Analysis
  • Other analyses

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Embedded Linux Package BRICK eLinux

Embedded Linux Package BRICK eLinux

Make Linux easier for everyone!

Embedded Linux has the advantage of an advanced development environment with high development efficiency, the availability of a wealth of open-source software at no cost, and the ability to customize according to product needs. However, there are challenges involved in getting it to operate as embedded Linux on the customer's product. Implementing embedded Linux on a customer-designed board means that porting the Linux OS is necessary, and even if Linux is operational, those without experience may not know how to configure the network or storage. Compared to other commercial operating systems, there are overwhelmingly fewer engineers skilled in embedded Linux, and the lack of documentation and training may prevent the establishment of a development team altogether. Therefore, Osaka NDS offers embedded Linux development services as a semi-custom package. Please make use of BRICK eLinux, which is packed with know-how cultivated through extensive experience.

  • Embedded OS
  • Embedded system design service
  • Software (middle, driver, security, etc.)

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Fast, inexpensive, and resilient production management "TPiCS-X"

Fast, inexpensive, and resilient production management "TPiCS-X"

It is a production management package designed to achieve fast, low-cost, resilient production against demand fluctuations, and stable production.

Quickly, cheaply, and with a good response to demand fluctuations. This is a production management package aimed at achieving stable production. It is also called aggressive production management and is a system for manufacturing that is not bound by traditional methods. It can flexibly accommodate a wide range of custom settings and additional features.

  • Production Management System
  • Other information systems

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7.1KW Engine Silent Power Package

7.1KW Engine Silent Power Package

Our company designs and manufactures hydraulic units with various specifications. Please feel free to contact us.

It is a portable engine hydraulic unit. Noise level: approximately 82 dB (A).

  • Hydraulic Equipment

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Factory-ONE Cyber Factory MF

Factory-ONE Cyber Factory MF

A production management package with a wealth of implementation experience. We will seriously consider with our customers not only the provision of the box but also how to operate the system.

The only open system for production management packages allows customers to connect to the database, extract necessary data, and perform data analysis. It also has high scalability that works in conjunction with numerous packages, enabling a phased implementation of the system. *Denno Factory is developed and sold by EX Corporation. The copyright for the product catalog data published belongs to EX Corporation.*

  • Production Management System

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ISO26262 Business Support Package

ISO26262 Business Support Package

The ISO26262 business support package supports the implementation of Part 5 based on Parts 3 and 4.

- Are you still using Excel for functional safety tasks? - Are you spending an enormous amount of time calculating failure rates and referencing FMEDA? - Are you manually creating FT diagrams from scratch? ========= Isn't it time to try using tools? ========= 【Benefits of Using Tools】 1. Standardize the workflow for functional safety tasks and eliminate issues related to individual reliance. 2. Ensure traceability by transferring IDs between safety requirements, FMEDA, and FTA. 3. Import/export standard formats for FMEA/FMEDA. 4. Enable bulk conversion from FMEA/FMEDA to FT diagrams. 5. Standardize evaluation points for FTA results (cut set analysis results). 6. Effectively utilize the rich information obtained from cut sets: - Q [failure rate after exposure time] - Q/T [failure rate per unit time] - Importance, risk increase (decrease) value - Information on dependent failures and common cause failures - β model - Validity of model representation - Comparison with FMEDA 【Others】 Integration with external tools such as Doors and electronic CAD is also possible.

  • Software (middle, driver, security, etc.)

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Ecal manufactured plant package

Ecal manufactured plant package

The beautiful appearance of the aluminum base color! On-site installation can be completed in one day, and it is also compatible with connected types.

The "Ekar-made plant package" is a product designed for easy installation by bolting it onto pre-constructed foundation concrete. The package that uses aluminum composite corrugated panels features the beautiful appearance of the aluminum's natural color, and since aluminum itself is a highly recyclable metal, it has received high praise as an environmentally friendly product. 【Features】 ■ Beautiful appearance of the aluminum's natural color ■ Numerous delivery records in salt damage areas ■ Uses aluminum alloy corrugated panels for the exterior walls ■ Easily installable by bolting onto foundation concrete (If it's a unified type, on-site installation can be completed in one day, and it can also accommodate connected types) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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High Implementation Reliability Package [Patented Technology]

High Implementation Reliability Package [Patented Technology]

High implementation reliability! Effective for miniaturization and low-profile packaging for automotive applications!

Our company offers a non-lead package with high mounting reliability that utilizes patented technology to improve durability against mechanical stress such as substrate warping and twisting, thanks to a stress-relief material between the leads and the sealing resin. The high mounting strength allows for an alternative to the gull-wing type package, making it effective for miniaturization and low-profile design in automotive applications. 【Features】 ■ Patented technology: Patent No. 2015-139062 (Application date: July 10, 2015) ■ Push strength improved by 57% compared to gull-wing type packages ■ Substrate bending resistance improved by 66% due to the stress-relief material between the leads and sealing resin ■ High mounting reliability *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts

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Semiconductor and Sensor Packaging

Semiconductor and Sensor Packaging

Providing packaging tailored to the applications and characteristics of semiconductors and sensors!

"Electronic Component Bulk Storage Services" provides packaging suitable for various semiconductors and sensors based on their applications and characteristics. We offer a wide range of products tailored to specific needs, including "Partial Exposure Packages" that allow parts of devices or components to be exposed, as well as "Hollow Packages" and "Connection Type Packages." [Product Lineup] ■ Partial Exposure Package ■ Hollow Package ■ Connection Type Package ■ Transparent Resin Sealing Package ■ Noise Reduction Package *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Other contract services
  • Contract manufacturing

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Ultra Low Profile Package

Ultra Low Profile Package

New structure ultra-low profile package! Development and provision planned using proprietary technology.

The "Ultra Low Profile Package" is a product that achieves ultra low profile and low resistance wiring through a structure that does not use conventional Cu frames or interposers such as PCBs. We plan to develop and provide the ultra low profile package with a new package structure using our unique technology. 【Features】 ■ Development and provision of ultra low profile packages using unique technology ■ Structure that does not use conventional Cu frames or interposers such as PCBs ■ Ultra low profile and low resistance wiring package ■ Dimple processing at the terminal area *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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Cu frame type "Package with Beer Hall"

Cu frame type "Package with Beer Hall"

Package using patented technology! Formation of solder fillet through special processing.

The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Circuit board design and manufacturing
  • Contract manufacturing

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