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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 松和産業 Mie//Electronic Components and Semiconductors 本社

substrate Product ranking

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

196~210 item / All 673 items

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Copper Pin Embedded Substrate "DPGA-EF"

Embed copper pins directly under the heating components! This can reduce the cost difference based on the number of copper pins.

"DPGA-EF" is a type of substrate that embeds copper pins only in the necessary areas. It can be produced at a lower cost compared to copper bases with bumps. The copper pins are inserted into the holes of the rigid substrate and fixed with resin. Unlike press-fitting, there is no risk of cracks or other issues. Additionally, the copper pins are embedded all at once. Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized. 【Features】 ■ Both sides of components can be mounted ■ Heat-generating components can be cooled precisely ■ There are no concerns about cracks or chemical residue, as it differs from the copper pin press-fitting method ■ It can be produced at a lower cost compared to copper bases with bumps ■ Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Copper base / aluminum base substrate

The thermal conductivity can support up to 10W! Introducing a single-sided, one-layer metal substrate using a high thermal conductivity insulation layer.

We would like to introduce our "Copper Base/Aluminum Base Substrates." The "Copper Base" is a plain substrate without copper bumps. It features a high thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated together, suitable for high heat dissipation of LEDs. The "Aluminum Base Substrate" is compatible with aluminum substrate materials from various manufacturers. You can choose suitable materials from a wide lineup based on thickness, thermal conductivity, and more. 【Features】 <Copper Base> - No copper bumps - High thermal conductivity copper material with a 4-10W insulation layer and copper foil laminated - Suitable for high heat dissipation of LEDs <Aluminum Base Substrate> - Compatible with aluminum substrate materials from various manufacturers - A wide selection of suitable materials available *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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High current compatible thick copper substrate

We introduce a thick copper substrate that incorporates a 400μ copper plate bonded to the core material, accommodating multilayer configurations.

The "High Current Compatible Thick Copper Substrate" is a substrate that consists of a core material bonded with a copper plate as the outer layer. The thickness of the outer layer copper can be up to 400μ. It is designed to accommodate high current applications. Additionally, it can also support multilayer boards where copper plates are bonded to the inner layers, with only the outer layer being thick copper. Thick copper can be used for both outer layer circuits and inner layer circuits. 【Features】 ■ A 4-layer board combining 35μ inner layer with 300μ outer layer ■ Compatible with the step of thick copper through silk printing with inkjet *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory

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Long-distance transmission board!

Long-distance transmission technology that connects physical space and cyberspace!!

A transmission technology that enables real-time operation and display of PCs used in the office, connecting the office and the field. By allowing high-speed signals to be exchanged bidirectionally, it is possible to use it not only as a monitor but also as an operation terminal equipped with a touch panel.

  • Other network tools

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Single-sided build-up metal base printed circuit board

We can accommodate even small quantities! Introducing single-sided build-up metal base printed circuit boards.

We would like to introduce the "Single-Sided Build-Up Metal Base Printed Circuit Board" handled by our technology research institute. We offer a lineup that includes the "Single-Sided 2-Layer Aluminum Base Printed Circuit Board" for power modules and the "Single-Sided 3-Layer Aluminum Base Printed Circuit Board," which can accommodate various layer configurations. Our company is equipped with an in-house VIA plating line, allowing us to handle even small quantities. 【Features】 ■ Capable of handling small quantities ■ In-house VIA plating line fully equipped ■ For power modules (Single-Sided 2-Layer Aluminum Base Printed Circuit Board) ■ Capable of accommodating various layer configurations (Single-Sided 3-Layer Aluminum Base Printed Circuit Board) *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials

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Substrate "Flat Copper PWB"

Directly mount LEDs onto a copper-based surface!! If you seek heat dissipation, choose 'Flat Copper PWB'.

"Flat Copper PWB" achieves high heat dissipation effectiveness by directly mounting the LED heat dissipation section onto a copper base surface. 【Features】 ■ Direct mounting of the LED heat dissipation section onto the copper base surface ■ High heat dissipation effectiveness (thermal conductivity: 398W/m·k)

  • Printed Circuit Board
  • Other electronic parts
  • LED Module

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Flip chip LED mounting compatible board [Full flat specification without steps!]

The substrate surface features a fully flat design without any steps! It is a substrate compatible with flip chip LED mounting!

The "FLIP CHIP LED PWB" is a product of Shirato Print Wiring Manufacturing Co., Ltd., which engages in the manufacturing of various printed circuit boards, circuit design of printed circuit boards, and assembly of electronic components. The surface of the substrate is designed to be fully flat without any steps, and it supports copper foil thicknesses starting from 105μm. The heat dissipation material can be selected from aluminum or copper. 【Features】 ■ Weather-resistant white ink with a reflectance of over 95% (in the visible light range) ■ Copper foil thickness supports from 105μm ■ Conductors are designed with half-etching specifications for heat dissipation and high current handling ■ Insulation layer thermal conductivity supports over 5W ■ Heat dissipation material can be selected from aluminum or copper *For more details, please request documents or view the PDF data available for download.

  • Printed Circuit Board
  • Other electronic parts

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High Thermal Conductivity Metal Printed Circuit Board Catalog

Our printed circuit boards are widely used in fields such as construction and machinery, as well as in medical devices!

The "High Heat Dissipation Metal Printed Circuit Board Catalog" features a wide variety of printed circuit boards that are actively used in LED lighting, flip chip LEDs, deep ultraviolet LEDs, COB LEDs, and more. Products utilized in fields such as construction and machinery, medical devices, elevators, vehicles and motorcycles, telecommunications, and lighting are presented along with photos and tables. 【Featured Products】 ■ 3D LED PWB ■ Flip Chip LED PWB ■ DEEP UV-LED PWB ■ Flat Copper PWB ■ High Power LED PWB ■ Thick Copper Substrate ■ High Frequency Compatible Substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts

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A rich lineup for communication modules and LEDs! Printed circuit boards.

Filters, capacitors, various devices, lineup for communication modules and LEDs.

We would like to introduce the "Printed Circuit Boards" handled by Shinkou Seisakusho. We offer a lineup including "double-sided printed circuit boards" suitable for filters, capacitors, various devices, and communication modules, as well as "double-sided multi-layer LED circuit boards" and "thin high-density printed circuit boards." Additionally, we also provide "multi-layer printed circuit boards" and "thin high-density printed circuit boards" for LEDs, as well as "cavity printed circuit boards." 【Lineup (excerpt)】 <Applications: Filters, capacitors, various devices, communication modules, etc.> ■ Double-sided printed circuit boards ■ Multi-layer printed circuit boards ■ Double-sided multi-layer LED circuit boards ■ Thin high-density printed circuit boards *For more details, please refer to the PDF materials or feel free to contact us.

  • Wiring materials

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"MSAP method" printed circuit board that realizes miniaturization of products.

Miniaturization of products through fine wire technology! Reducing environmental impact by adopting selective plating methods.

We would like to introduce 'MSAP', which is handled by Shinko Seisakusho Co., Ltd. The product is miniaturized through fine wiring, and environmental impact is reduced by adopting selective plating methods. The applications include module substrates and high-frequency compatible substrates. The PDF document below provides detailed information about 'MSAP', so please download it and take a look. 【Features】 ■ Miniaturization of products through fine wiring ■ Adoption of selective plating methods ■ Reduction of environmental impact ■ Applications include module substrates and high-frequency compatible substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Zero One Temperature and Humidity / Pressure Sensor Expansion Board 'ADRSZBM'

Simultaneously measure three environmental parameters: temperature, humidity, and atmospheric pressure! Expansion board Zero One series.

The "ADRSZBM" is a temperature, humidity, and pressure sensor expansion board specifically for the Raspberry Pi Zero. It features a sensor module equipped with Bosch's BME280, which can simultaneously measure three environmental parameters: temperature, humidity, and pressure. Additionally, it is possible to connect the BME280 away from the heat source, the Raspberry Pi itself, using the included jumper wires. 【Features】 ■ Compact "pHAT" size ■ Equipped with Bosch's BME280 ■ Connector compatible with the Grove system (I2C) *The Grove system is a registered trademark of Seeed Technology Limited. *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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Zero One Servo Motor Expansion Board 'ADRSZSB'

Two servo motors can be controlled independently! Equipped with external power terminals to accommodate various usage forms.

"ADRSZSB" is a servo motor expansion board dedicated to the Raspberry Pi Zero. By switching the jumper, you can choose to power it from the GPIO/external power terminal. It supports various usage forms. Additionally, it allows independent control of two servo motors from a single Zero. It is also possible to control a two-axis camera platform. 【Features】 ■ Compact "pHAT" size ■ Equipped with an external power terminal that can be used from 5V to a maximum of 12V ■ Independent control of two servo motors ■ Equipped with LEDs that indicate the motor's operating status ■ High-resolution 16-bit PWM *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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Zero One Solenoid Expansion Board 'ADRSZSN'

The LED makes it easy to check the operating status! It is useful during experiments and maintenance!

The "ADRSZSN" is a solenoid expansion board specifically designed for the Raspberry Pi Zero. In addition to supplying 5V power from the Raspberry Pi Zero itself, it also supports external power supply up to 12V 2A (switchable via pin headers). The LED makes it easy to check the operating status. This is useful during experiments and maintenance. 【Features】 ■ Compact "pHAT" size ■ Selectable solenoid power supply ■ Equipped with LEDs to indicate the operating status of the solenoid *For more details, please refer to the PDF materials or feel free to contact us.

  • Sensors
  • Other electronic parts
  • Printed Circuit Board

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