substrate - メーカー・企業560社の業務用製品ランキング

Low-rebound, high-speed transmission flexible substrate

Approximately one-third the rebound force compared to conventional structures! Low-rebound FPC for communication devices that combines noise reduction and high-speed transmission.

The low-rebound, high-speed transmission FPC adopts a stripline structure and is an excellent flexible substrate for noise countermeasures using shielding materials. Compared to conventional 3-layer FPCs, it is approximately 200μm thinner and reduces rebound force to about one-third, while keeping transmission loss at the same level or lower. This innovative FPC, developed for communication devices, is expected to improve assembly workability and be used in movable parts. 【Four Features】 1. Reduces transmission loss to the same level or lower compared to conventional 3-layer FPCs and decreases rebound force to about one-third. 2. Improves assembly workability and allows for use in movable parts. 3. Enhances noise countermeasures through the adoption of stripline structure and shielding materials. 4. Supports compact device design due to its thin profile. For more details, please refer to the PDF materials or feel free to contact us.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

Wiring materials
substrate

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High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

企業：山下マテリアル
価格：500,000 yen-1 million yen

Harness
substrate

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Heat-resistant printed circuit board

It has excellent heat resistance and can be used in high-temperature environments where it is difficult to adopt in standard printed circuit boards!

We provide high heat-resistant printed circuit boards using Okitsumo's high heat-resistant solder resist ink "TAINEX Series" and FR-4 high heat-resistant grade materials. These boards have excellent heat resistance and can be used in high-temperature environments where standard printed circuit boards are difficult to employ. They are made from halogen-free materials and comply with various environmental regulations. Please feel free to contact us when you need assistance. 【Features】 ■ Continuous heating: 150℃ / 1000h - No swelling or peeling ■ Continuous heating: 175℃ / 1000h - No swelling or peeling ■ Temperature cycle (-65℃ ⇔ 150℃) × 3000 cycles achieved - No swelling or peeling ■ Made from halogen-free materials and compliant with various environmental regulations *For more details, please refer to the PDF document or feel free to contact us.

企業：山下マテリアル
価格：Other

Printed Circuit Board
substrate

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Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

企業：山下マテリアル
価格：Other

Wiring materials
substrate

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Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

High frequency/microwave parts
substrate

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Button-plated flexible printed circuit board (FPC)

Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.

Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.

企業：山下マテリアル
価格：500,000 yen-1 million yen

Printed Circuit Board
Circuit board design and manufacturing
substrate

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BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - Customize flexible high-current wiring at a reasonable price.

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

企業：山下マテリアル
価格：100,000 yen-500,000 yen

Printed Circuit Board
substrate

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All LCP Flexible Printed Circuit Board (FPC)

Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!

All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.

企業：山下マテリアル
価格：Other

Printed Circuit Board
substrate

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Industrial "Cable Automatic Soldering Robot System"

This is a robotic system that not only accurately holds cables and automatically applies flux and solders, but also enables product inspection through image processing.

It is an automatic soldering robot system for industrial cables.

企業：HCI
価格：Other

Articulated Robot
substrate

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[Case Study] Rigid Substrate Product Delivery Performance

Introducing a case study on the introduction of rigid substrates by Murakami Electronics Co., Ltd.!

Murakami Electronics Co., Ltd. is a manufacturer specializing in the prototyping and mass production of double-sided and multilayer printed circuit boards. We will introduce examples of rigid boards, including the "6-layer through-hole board," "10-layer through resin-filled board," and "single-layer build-up board." 【Case Studies】 ■6-layer through-hole board 　・Thickness: 1.6 mm, Electroless gold *For more details, please refer to the PDF document or feel free to contact us.

企業：村上電子工学
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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[Case Study] Delivery Record of High Multi-Layer Rigid Boards

Introducing a case study on the introduction of high-multilayer rigid substrates by Murakami Electronics Co., Ltd.!

Murakami Electronics Co., Ltd. is a manufacturer specializing in the prototyping and mass production of double-sided and multilayer printed circuit boards. We would like to introduce a case study of the "High Multilayer Rigid Board" using FR-5 material. 【Case Study】 ■ High Multilayer Rigid Board 　・0.5mm Pitch BGA 　・0.5mm Pitch Through-hole TH Type PWB (Surface Pad on Via) *For more details, please refer to the PDF document or feel free to contact us.

企業：村上電子工学
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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[Development and Manufacturing Contract] Membrane Display for Medical Devices

The display and operation sections are integrated into a membrane unit. This is also effective in reducing replacement costs due to the elimination of 7-segment displays.

At Jesco Co., Ltd., we undertake the development and manufacturing of "membrane displays" for medical devices. We have integrated the display and operation sections into a membrane unit, which is also effective in reducing replacement costs by eliminating the need for 7-segment displays. Additionally, unlike companies that specialize solely in contract manufacturing, we offer consistent support from design through to mass production, which is one of our distinguishing features. **Features of Jesco:** - Comprehensive support from development to mass production - Development system and products compliant with medical standards - Small lot production - Customization - Development focused on long-term supply *For more details, please refer to the related links or feel free to contact us.*

企業：ジェスコ
価格：Other

LCD display
substrate

製品を詳しく見る

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Low Concentration Ozone Generation Substrate "OZ-S"

It has been discovered that low-concentration ozone gas has the effect of reducing the risk of infection from the novel coronavirus!!

The "OZ-S" is an ozone generation substrate that produces low-concentration ozone using a high-voltage power supply. It is expected to have sterilization and deodorization effects!! Successful digital control with a microcontroller! Management operation via communication is also possible!! 【Challenges / Results】 ■ I want to control the amount of ozone generated. → Control of output voltage through voltage feedback and time division control using a microcontroller. ■ I want to control the amount of ozone generated. → Compatible with a wide variety of power supplies, including mobile batteries and automotive power sources. ■ I want to improve reliability and reduce size. → Achieved improved reliability and miniaturization of the substrate through urethane potting. ■ I want it to operate when no one is around. → It is also possible to operate when no one is present by coordinating with sensors. *For more details, please refer to the PDF document or feel free to contact us.

企業：カイロスキ本社
価格：Other

Circuit board design and manufacturing
Ozone Generator
substrate

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Wireless power supply board

Wireless power transmission board capable of delivering 30W of medium power.

【Issues / Results】 ■ The mainstream Qi standard cannot achieve more than 5W 　→ Independently developed a 30W type aimed at medium capacity. ■ A transmission distance of 20mm is desired 　→ Tuned the resonant capacitor and frequency to accommodate a 20mm gap. ■ It takes 5 seconds to start with other manufacturers' products 　→ Achieved a startup time of 0.3 seconds. ■ I want it to stop automatically 　→ Safely stops power transmission during abnormal conditions or when the receiving coil is not found. Reduces reactive power and minimizes the risk of magnetic interference. *For more details, please refer to the PDF document or feel free to contact us.

企業：カイロスキ本社
価格：Other

Circuit board design and manufacturing
substrate

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Reverse Engineering of Printed Circuit Boards Restoration and Reproduction [Rivaen]

Achieve high reproducibility! (Track record: approximately 80% or more) Leave the optimization of verification, components, and functions to prototype verification to us. *CPU is subject to consultation.

We will fully support the [restoration and reproduction] of various issues such as [absence of developers], [lack of drawings due to old development products], and [concerns about supply due to overseas procurement]. [Kaeroski's Achievements] With over 250 circuit development (board development) projects in the past 7 years, we have identified issues and proposed countermeasures through noise, heat, and EOL measures, as well as verification against Kaeroski standards. Based on this knowledge, we will assist with reverse engineering of boards without drawings, in the absence of developers, and outsourced boards. If you fall into any of the following categories, we believe we can help: - Developed in-house several decades ago, but renewal is necessary for performance improvement/EOL measures. There are no remaining documents and we would like support from a knowledgeable company. - We want to analyze an (in-house) board without a developer, create drawings, leave design evidence, and conduct verification and improvement discussions regarding functionality and reliability. - We want to develop a board that has been procured overseas in-house. - Due to company growth, we are lacking development resources. We would like our engineers to lead the development (reverse engineering) support. And so on.

企業：カイロスキ本社
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Thick film printed circuit board

RoHS and Pb-free compliant! Thick film printed circuit boards with selective layouts based on conductor characteristics are available.

The "thick film printed circuit boards" we handle utilize various technologies based on the properties of alumina ceramics, providing "heat resistance" and "high reliability" to meet customer needs. We comply with RoHS and lead-free standards, and can perform through-hole filling printing from Φ0.15mm. Additionally, we can achieve selective layouts based on conductor characteristics, focusing on bonding properties or migration resistance. 【Features】 ■ Capable of printing conductors made of silver-palladium, silver-platinum, silver, and copper, which excel in heat resistance. ■ Gold plating is available for terminal electrode solder joints, offering excellent migration resistance (high migration-resistant material). ■ Compliant with RoHS and lead-free standards. ■ Various resistors can be formed through printing methods. *For more details, please refer to the PDF document or feel free to contact us.

企業：双信電機東京本社
価格：Other

Printed Circuit Board
substrate

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Meter switch sensor control, information acquisition, and analysis system case study.

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Control, information acquisition, and analysis system for meters, switches, and sensors → Development of communication control boards such as Wi-Fi, control viewing applications, and big data servers 1. Communication prioritized between machines and devices. Data is sent to smartphones via a Wi-Fi module using serial communication. 2. Accumulation and calculation of machine information, and display of machine information. Broadly perform data transfer to the server, data reception, and information display. 3. Accumulation of information transferred from the application. Transmission of various service information. 4. Management of data sent from the server. It is possible to introduce operational status. ★In addition, we have numerous achievements in in-house development and contract development! ★For more details, please refer to the case materials available for download in the "PDF Download" section below.

企業：KYOWAエンジニアリング・ラボラトリー
価格：Other

Other network tools
substrate

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Control of machine meters, switches, sensors, etc. - IoT development case study

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone apps." ■Example: Development of communication control boards for controlling machine meters, switches, sensors, etc., and for Wi-Fi integration with smartphones, as well as an engine information app. 1. Communication control of machine and device meters, switches, sensors, etc. via boards Data transmission to smartphones via Wi-Fi modules using serial communication. 2. Various information can be processed on the smartphone app: - Accumulation and calculation of engine information (such as component lifespan and failure prediction) - Display of engine information (such as meters) - Display of fault diagnosis (diagnostic) information - Data transfer to the server (engine information) - Data reception from the server and information display. 3. Enables data management and operational status introduction in offices and other locations. ★ We also have numerous achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

企業：KYOWAエンジニアリング・ラボラトリー
価格：Other

Other network tools
substrate

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Real-time Factory Operation System (System Screen Edition) IoT Development Case Study

Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System - Check operational status in real-time via web browsers or dedicated apps - Understand the number of units operating in real-time and the total number of units operated in a day - Access rights can be granted only to administrators - Screen display items can be customized according to customer needs ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

企業：KYOWAエンジニアリング・ラボラトリー
価格：Other

Other network tools
substrate

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Chiller repair available for most manufacturers!

Repairs for chillers from other manufacturers are possible! We can accommodate multiple brands. Please contact us!

We repair chillers from other manufacturers based on our expertise in chiller manufacturing. We can also modify conventional units to energy-saving types. With consideration for the environment, we will replace and repair compressors from conventional HCFC to HFC. *For more details, please download the catalog or contact us.*

企業：エイディーディー
価格：Other

Chiller
substrate

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Special Printed Circuit Board Manufacturing Service for LED Lighting (Metal Base Board)

Ideal for LED lighting products with high temperatures. Significantly reduces lifespan deterioration due to reasons other than the LED chip.

We offer a variety of materials, including aluminum and copper, in different thicknesses, allowing for the production of metal base substrates with various specifications. LEDs are characterized by their energy efficiency, brightness, and long lifespan; however, one drawback is that their lifespan can decrease due to factors other than the heat generated by the LED chip, which can be problematic. Metal base substrates are designed to dissipate the heat generated by the LED during operation. By using materials such as aluminum or copper, which have good thermal conductivity, we can effectively dissipate the heat generated by the LED. For more details, please contact us or download the catalog.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

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Printed circuit board manufacturing - single-sided board

Standard materials: Galapagos substrate, paper phenol, composite.

We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship within the shortest possible working days of 1 day. For more details, please contact us or refer to our catalog.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

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Printed circuit board manufacturing double-sided flexible circuit board

The thinnest flexible substrate with a total thickness of 100μ is possible. Halogen-free options are also available.

Like one-sided flex, we have a variety of materials in stock. The thinnest option allows for a total thickness of 100μ for flex PCBs, and of course, we can also accommodate halogen-free requirements. For more details, please contact us or refer to our catalog.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

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Printed circuit board manufacturing - build-up boards

This is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, leading to an increased demand for printed wiring boards using the build-up method. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, we can accommodate up to two-layer builds (two layers of build-up layers above and below). Additionally, we can also handle stack vias and filled vias. We have a track record of manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to our catalog.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

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Special Printed Circuit Board Manufacturing - Impedance Control Board

Control the pattern width and interlayer thickness to perform impedance control.

Based on our extensive past experience, we control the pattern width and layer thickness to perform impedance control. By using the Polar company's impedance simulation software 'Si8000', we can pre-calculate the impedance values of the completed circuit boards, enabling accurate impedance control. Additionally, we can simulate the layer configuration, line width, and spacing during the pattern design phase, allowing us to propose specifications that facilitate easier impedance control. For measuring the impedance of the completed circuit boards, we use the 'MZPC50' measuring instrument from Microcraft Co., Ltd., and we can provide measurement results (using the TDR method). For more details, please contact us or refer to our catalog.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a circuit board with resin embedded in the through holes and pads placed on top.

This is a circuit board designed to secure the mounting space for components by embedding resin in through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Benefits of K2: Reducing initial costs of flexible circuit boards.

Mold cost 0 yen! Cut initial costs to manufacture flexible substrates cheaply and quickly!

At K2, we do not create molds or Thomson molds (Victoria molds) for small lot production of flexible printed circuits, which generally allows us to respond to the time-consuming flexible circuit manufacturing with short lead times. Since there are no costs for creating molds, we can significantly reduce the initial costs, making our prices attractive. Furthermore, this method allows for individual correction of each circuit board, providing the advantage of high quality. 【Features】 ■ Flexible circuit board mold cost: 0 yen ■ Short lead times ■ High quality *For more details, please refer to the PDF document or feel free to contact us.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

We can manufacture special circuit boards that align with your design philosophy! We also accommodate high-difficulty designs and specifications.

Our company possesses a series of equipment necessary for substrate manufacturing, including plating process equipment and manufacturing lines for build-up substrates. We can consistently produce specialized substrates that require advanced processing technology and precision, and we can provide them in a short delivery time. Additionally, for inquiries regarding environmental surveys or after the substrate manufacturing, our specialized staff will be ready to respond thoroughly even after delivery. 【Features】 ■ Flexible response to detailed customer requests ■ Thorough data checks contribute to reducing delivery times and costs ■ Short delivery times possible through in-house integrated production and strict delivery management *For more details, please refer to the materials. Feel free to contact us with any inquiries.

企業：ケイツー
価格：Other

Printed Circuit Board
substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Have you ever been turned down for special substrate manufacturing?

Accurate technical advice is possible! By introducing advanced equipment, we can accommodate a wide range of specialized substrates.

Our company is capable of handling a wide range of special substrates by creatively utilizing various equipment available in-house, starting with advanced DI (Direct Imaging) equipment. Additionally, since over 90% of our staff are full-time employees, we have accumulated extensive knowledge and know-how regarding substrates by inheriting past experiences, enabling us to provide accurate technical advice to our customers. Please feel free to consult us regarding any special substrates. 【Special substrates we can handle】 ■ Build-up substrates ■ Heat dissipation substrates ■ Impedance control substrates ■ Rigid-flex and multilayer flex substrates ■ Cavity substrates ■ Fine patterns *For more details, please refer to the PDF document or feel free to contact us.

企業：ケイツー
価格：Other

Other services
substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Same manufacturing line as trial production! A 100% equipment utilization rate enables short delivery times for medium lot production.

Our company is equipped with large-capacity facilities as a prototype manufacturer, allowing us to produce not only small lots but also medium-lot prototypes and medium-volume production with short lead times. Thanks to the 100% operating rate of our large-capacity equipment, we can handle urgent requests without any issues, even for large quantities. We have secured sufficient inventory even during periods when material procurement was difficult, ensuring there are no delays in delivery. 【Features】 - Capable of producing small lots as well as medium-lot prototypes and medium-volume production with short lead times - 100% equipment operating rate - Sufficient inventory secured, with no delivery delays - Initial costs do not become excessively high - Capable of handling special substrates such as flexible and rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

企業：ケイツー
価格：Other

Other services
substrate

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

substrate - メーカー・企業560社の業務用製品ランキング | イプロスものづくり

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substrateの製品ランキング

substrateの製品一覧

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Chiller repair available for most manufacturers!

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Printed circuit board manufacturing - single-sided board

Printed circuit board manufacturing double-sided flexible circuit board

Printed circuit board manufacturing - build-up boards

Special Printed Circuit Board Manufacturing - Impedance Control Board

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Benefits of K2: Reducing initial costs of flexible circuit boards.

Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

Have you ever been turned down for special substrate manufacturing?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

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