Copper Pin Embedded Substrate "DPGA-EF"
Embed copper pins directly under the heating components! This can reduce the cost difference based on the number of copper pins.
"DPGA-EF" is a type of substrate that embeds copper pins only in the necessary areas. It can be produced at a lower cost compared to copper bases with bumps. The copper pins are inserted into the holes of the rigid substrate and fixed with resin. Unlike press-fitting, there is no risk of cracks or other issues. Additionally, the copper pins are embedded all at once. Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized. 【Features】 ■ Both sides of components can be mounted ■ Heat-generating components can be cooled precisely ■ There are no concerns about cracks or chemical residue, as it differs from the copper pin press-fitting method ■ It can be produced at a lower cost compared to copper bases with bumps ■ Unlike the press-fitting method, the cost difference based on the number of copper pins can be minimized *For more details, please refer to the PDF document or feel free to contact us.
- Company:ダイワ工業
- Price:Other