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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 松和産業 Mie//Electronic Components and Semiconductors 本社
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substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

181～195 item / All 673 items

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High-speed signal and high-density substrate "Back Drill Substrate"

High-speed signal and high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling process ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It allows for the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Allows for the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and more. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High-frequency compatible substrate "Fluororesin substrate"

High-frequency compatible substrate "Fluororesin substrate"

Materials with excellent frequency characteristics! Capable of high-frequency performance tailored to specific applications.

"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle products from both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■ General FR-4 material ■ PPE material ■ LCP material ■ Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

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Side-coated substrate

Side-coated substrate

Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.

We would like to introduce our "Side Coated Substrate." Powder shedding from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder shedding from the edges that occurs when the substrate rubs against guide rails during transport. [Applications] ■ Device substrates ■ Substrates requiring resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Tent Through Hole PCB

Tent Through Hole PCB

Prevent the flow of sealing resin and flux during component mounting!

The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole sections using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during the mounting process. Please feel free to contact us when you need assistance. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Silicone embedded substrate

Silicone embedded substrate

By changing the height of the circuit, it is possible to form silicone ink on the circuit as well!

We would like to introduce our "Silicone Embedded Substrate." By filling the gaps between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. 【Applications】 ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Functional step substrate

Functional step substrate

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Function Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate, enabling the provision of copper-thick hybrid circuit boards through continuous wiring. By forming unevenness through step formation in part of the circuit, we can provide height adjustment of mounted components and functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Ultra-thin rigid substrate

Ultra-thin rigid substrate

It is possible to manufacture a double-sided board with a substrate thickness of 0.04t, while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a thickness of 0.04 mm, while still being rigid. This is ideal for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used for several bends or bending during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between boards, all suitable for several bends. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

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End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

End face through-hole substrate. Our unique processing solves copper burrs and powder drop!

We will solve the implementation issues and challenges arising from the miniaturization of electronic components with our special structures such as edge-through-hole boards and laminated boards.

End face through holes are formed by cutting through holes created at the edges of the substrate using contour processing. Traditionally, copper burrs were generated during the cutting of through holes, but our company can provide end face through holes without burrs even with router processing thanks to our unique process. Additionally, this unique process allows for the partial etching of landless through holes and the copper plating of through holes. In printed circuit boards for electronic device applications such as compact modules, miniaturization and heat dissipation are required. Our company offers special structure printed circuit boards tailored to your needs, such as metal cavity structure boards and three-dimensional structure boards through lamination.

  • Circuit board design and manufacturing

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Heat-dissipating substrate "DPGA"

Heat-dissipating substrate "DPGA"

This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

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Cost reduction: High heat dissipation, high current circuit board

Cost reduction: High heat dissipation, high current circuit board

Achieving unit cost reduction, unit size reduction, and extended lifespan. Ideal for LED substrates and automotive substrates!

We would like to introduce Daiwa Kogyo Co., Ltd.'s "High Heat Dissipation and High Current Circuit Boards." Our "High Heat Dissipation Circuit Board" replaces ceramic substrates, achieving cost reduction in substrate expenses. Additionally, by switching from water cooling to air cooling, we achieve cost reduction in unit expenses. We also manufacture products such as "Copper Pin Embedded Circuit Boards," which reduce thermal damage to components, as well as "Aluminum Base/Copper Base Circuit Boards" that can handle thermal conductivity up to 10W, and "Thick Copper Circuit Boards" suitable for high current. If you are having trouble with circuit boards, please feel free to consult with us. 【Features】 ■ High Heat Dissipation Circuit Board - Achieves cost reduction in substrate expenses by replacing ceramic substrates - Achieves cost reduction in unit expenses by switching from water cooling to air cooling - Realizes reduction in unit size and component costs through miniaturization of heat sinks/fans ■ Copper Pin Embedded Circuit Board - Provides pinpoint heat dissipation from high-heat components - Reduces thermal damage to components *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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High Heat Dissipation Substrate 'DPGA-M'

High Heat Dissipation Substrate 'DPGA-M'

DPGA is made double-sided and supports back-side wiring! Equal-length wiring is possible even when parallel circuits are present.

"DPGA-M" is a high thermal conductivity substrate that features a single-sided multilayer design and supports backside wiring. By adopting a single-sided multilayer structure, it significantly enhances design flexibility, allowing for backside wiring. Although it has multiple layers stacked on one side, it is possible to penetrate copper bumps. This enables direct connection of high thermal conductivity components to the copper base and heat sink. 【Features】 ■ Single-sided multilayer structure ■ Enables backside wiring ■ Allows for equal-length wiring even in the presence of parallel circuits ■ Significantly increases design flexibility ■ Enables direct connection of high thermal conductivity components to the copper base and heat sink *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
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High Heat Dissipation Substrate 'DPGA-S'

High Heat Dissipation Substrate 'DPGA-S'

Separating the copper base on the back and ensuring insulation! Maintaining the strength of the substrate even after separating the copper base.

The "DPGA-S" is a high thermal conductivity substrate that separates the copper base on the back side and is designed for insulation. Thanks to the high thermal conductivity provided by the through-type copper bumps, it is possible to make the insulation layer up to 0.3mm thick. This allows for maintaining the strength of the substrate even after separating the copper base. Additionally, by separating the layers, it is also possible to mount electrodes on the copper base side. 【Features】 ■ High thermal conductivity due to through-type copper bumps ■ Insulation layer can be made up to 0.3mm thick ■ Allows for mounting electrodes on the copper base side by separating the layers ■ The back side can also be utilized for electrical connections *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
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