We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. null/null
  3. 三和電子サーキット Osaka//Electronic Components and Semiconductors
  4. 4 null/null
  5. 5 松和産業 Mie//Electronic Components and Semiconductors 本社
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substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  2. Aluminum foil etched circuit board
  3. Completely solving the challenges of implementation boards in harsh environments! *A Q&A collection is currently being offered.
  4. 4 Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  5. 5 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

166～180 item / All 673 items

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that can connect three HAT boards to a Raspberry Pi. You can mount a Raspberry Pi 3 or Raspberry Pi ZERO (WH) on the lower left part of the board, and attach other HAT boards elsewhere. There are free through-holes on the lower right part of the board, allowing you to solder as you wish, similar to a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C are provided for external connections (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted on the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts

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Printed circuit board - 4-layer board

Printed circuit board - 4-layer board

The shortest 24 hours! A four-layer board that leads your business to success.

Yuki Corporation responds to customer requests with the technical expertise cultivated over many years. To achieve goals such as stable quality, improved operational rates, and avoiding duplication of capital investment, experts from printed circuit board manufacturers and partial processing manufacturers have joined forces to establish a printed circuit board manufacturing company with an in-house integrated production system. We are committed to "manufacturing" and have built a production line that meets customer demands for small quantities, diverse varieties, and short delivery times. Furthermore, we will continue our unwavering efforts to deliver "valuable products," "services," and "peace of mind" as a company based on high quality and excellent technology. **Features** - Consistent support from design to printed circuit board manufacturing to component mounting. - Partial processing of surface treatment is also handled in-house. → Metal masks, various metal etching, electroplating, electroless gold, etc. - Ultra-short delivery times. Medium-volume products can also be delivered quickly. - Actively responding to high-layer, high-density, and high-difficulty products. → High-layer boards up to 20 layers, high-density boards with 5 pins between. - Actively working on environmental measures such as halogen-free materials and lead-free options. For more details, please contact us or download the catalog.

  • Circuit board design and manufacturing
  • Printed Circuit Board

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Buffalo Ceramic Buff Permanent Hole-Filling Ink Printed Circuit Board

Buffalo Ceramic Buff Permanent Hole-Filling Ink Printed Circuit Board

Achieves very high grinding power and long lifespan. A buff roll that also excels in cost performance.

We can customize the granularity and specifications to match the customer's application and work.

  • Printed Circuit Board
  • Grindstone
  • Other semiconductor manufacturing equipment

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Mini Buffrol Ceramic Buff Permanent Hole Filling Ink Printed Circuit Board

Mini Buffrol Ceramic Buff Permanent Hole Filling Ink Printed Circuit Board

A new buff roll that significantly reduces the time compared to the conventional buff roll.

The removal of semiconductor encapsulants and polishing of ceramics can achieve time savings compared to conventional methods, making it a hot new product!

  • Fine Ceramics
  • Other semiconductors
  • Grindstone

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Single Crystal Substrate Crystals: A-Z

Single Crystal Substrate Crystals: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials

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Ceramic Substrate: A-Z

Ceramic Substrate: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class supplier in the industry. You can purchase as little as one item. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials

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High thermal conductivity substrate "Copper Inlay Substrate"

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing

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Printed Circuit Board "Fluororesin Substrate"

Printed Circuit Board "Fluororesin Substrate"

High-density wiring compatible with thin plates, fine pattern formation, and small-diameter vias is also possible!

"Fluororesin substrate" is a printed circuit board made from materials such as fluororesin-impregnated glass cloth. It has a very low dielectric constant and dielectric loss tangent, providing excellent high-frequency characteristics, making it suitable for high-frequency equipment applications. We offer products tailored to needs such as thin plates and small sizes. 【Features】 ■ Excellent high-frequency characteristics (relative permittivity and dielectric loss tangent) ■ Capable of high-density wiring that supports thin plates, fine pattern formation, and small-diameter vias ■ Products tailored to your needs *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. 【Features】 ■ Efficiently dissipates heat to the backside by incorporating copper coins ■ Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High Thermal Conductivity Substrate "Thick Copper Substrate"

High Thermal Conductivity Substrate "Thick Copper Substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance large current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We offer substrates that enhance high current and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards - Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards - Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high thermal conductivity substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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