substrate - メーカー・企業561社の製品一覧とランキング

Business Content: Electronic Device Development

Supporting the development of new products at every stage! We support manufacturing.

From the development, design, and manufacturing of electronic devices to product commercialization support, the Fuji Print Industrial Group plays a role in supporting cutting-edge manufacturing. The areas we handle cover almost all categories related to electronic devices. Furthermore, we have established a system that allows orders to be placed from any part of the necessary operations, from consulting to manufacturing, enabling a customer-oriented and flexible response. 【Features】 - Support for not only new designs but also renewal designs - Capable of designing ASICs and single-chip microcontrollers - Proposals for design changes and process changes - Support for surface mount, discrete, and mixed boards, accommodating large, irregular shapes, and multilayer boards - Capable of handling various adjustments and inspections For more details, please contact us or download the catalog.

企業：富士プリント工業
価格：Other

Other electronic parts
substrate

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Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.

"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.

企業：名東電産
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Achieve shield effect! Side plating substrate capable of forming half-through holes on the side parts.

At Meito Electric Co., Ltd., we manufacture and sell printed circuit boards such as "side-plated substrates," "dissimilar material laminated substrates," and "cavity substrates." The "side-plated substrate" achieves a shielding effect by applying plating treatment to the outer edge surface of the substrate. The "dissimilar material laminated substrate" allows for combinations tailored to your needs, such as laminating high-frequency materials with epoxy resin. The "cavity substrate" can be produced more easily than structures that embed electronic components into the substrate. 【Features】 ○ Side-plated substrate: → Half through-holes can be formed on the side surface → Plating can also be formed around the entire circumference of the substrate's side surface ○ Dissimilar material laminated substrate: → Various sizes are available to accommodate small quantities of diverse multilayer workpieces → Supports surface treatments such as heat-resistant flux, lead-free solder leveling, and gold plating ○ Cavity substrate: → Enables low-profile modules *For more details, please refer to the PDF document or contact us directly.

企業：名東電産
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Meito Electric Co., Ltd. Major Equipment Introduction

High technology supporting the industrial society! Meito Electric Industry Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. started processing and selling electrical insulation materials in 1967 and began manufacturing and selling printed circuit boards in 1983. The range of products we handle is widely used in applications such as automotive, communication equipment, housing-related, and industrial machinery, among others. We would like to introduce our main equipment that seeks higher precision. 【Main Equipment】 ○ Design Department: Design Room, Laser Plotter Room ○ Third Factory: NC Drill, NC Router ○ Shimizu Factory: Desmear Line, Copper Plating Line ○ Second Factory: Exposure Room, Etching Line, AOI Inspection Room, Screen Printing Machine For more details, please contact us or download the catalog.

企業：名東電産
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
Contract measurement
substrate

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Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Handbook on 'Improving Heat Dissipation of PCBs' is now available! High heat dissipation of PCBs is essential for miniaturizing products! Includes advantages and disadvantages of using copper and aluminum.

In the miniaturization of products, enhancing the thermal dissipation of the substrate is essential. Heat sinks are used to improve thermal conductivity, but they take up extra space, which contradicts the goal of miniaturization. Meito Electric specializes in processing that improves the thermal dissipation of substrates by using aluminum and copper as conductors. ★ We have a proven track record in various fields, including automotive substrates and LED substrates! We are currently offering technical materials related to improving substrate thermal dissipation for free! These materials also include the advantages and disadvantages of substrates made from copper and aluminum. *If you would like the technical materials, please feel free to download them or contact us.

企業：名東電産
価格：Other

Contract manufacturing
substrate

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Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.

For high current substrate applications! The "aluminum core substrate," lighter than copper core substrates, also improves overall heat dissipation.

"Aluminum core substrate" is a suitable substrate when you want to improve heat dissipation throughout the substrate while also reducing weight compared to copper core substrates. 【Features】 ● Excellent thermal conductivity ● Industry's highest dielectric breakdown voltage ● Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF materials or contact us directly.

企業：名東電産
価格：Other

LED Module
substrate

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PTFE material IVH substrate *Technical documentation available

Non-through IVH substrate made of polytetrafluoroethylene material! We also offer high-quality, highly reliable custom-made substrates using our unique technology.

The PTFE IVH substrate is a non-through IVH substrate made from polytetrafluoroethylene material. Our company manufactures composite multilayer substrates composed of bonded dissimilar materials. (We also produce various other types of substrates.) IVH and BVH structures using composite materials such as Teflon + FR-4 and PPE + FR-4 are possible. We can also bond copper and aluminum with substrate materials or multilayer substrates, and we can develop our processing technology to create custom substrates that meet your requirements. 【Substrate Specifications】 ● Bonded material thickness: 0.1t and above ● Line space: 100/100μm, intersection ±50μm ● Surface treatment: water-soluble heat-resistant flux, lead-free solder leveling, Au flash, etc. *For more details, please refer to the PDF document or contact us directly.

企業：名東電産
価格：Other

Printed Circuit Board
Circuit board design and manufacturing
substrate

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Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Application of film formation technology and thin film processing technology to submounts with increasing demand!

Our company applies and develops the film formation and thin film processing technologies cultivated in the manufacturing of thin film magnetic heads (HDD, FDD) and optical prism components to create thin film electrodes, resistive films, and solder films tailored to substrates such as ceramic substrates, forming them into high-precision fine circuit patterns. We are also capable of patterning on three-dimensional surfaces and thick film Cu plating. Our customers use our products not only in Japan but also in various countries around the world, including Asia and Europe and the Americas. We will continue to develop new technologies in the future. ■ Standard substrate materials (thermal conductivity W/m·K) AlN (170~230) AlN/Cu (~270) SiC (~370) ■ Applications Laser diode (LD) mounting substrates Light-emitting diode (LED) mounting substrates Photodiode (PD) mounting substrates ■ Laser market applications Visible light semiconductor lasers Optical communication (FTTx, data centers, mobile base stations) Consumer industrial applications (sensors, LiDAR, laser processing, medical) Lighting (projectors, automotive headlights), etc.

企業：Citizen Finedevice Co.,Ltd
価格：Other

Circuit board design and manufacturing
substrate

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Hydraulic press machine, powder forming machine

It comes with a swing arm type mold transfer device.

We provide high-precision hydraulic molding machines tailored to various materials. Our knowledgeable staff, well-versed in the characteristics of materials, designs and manufactures custom solutions to meet the specifications and environments of individual users. In addition to high quality and durability, we achieve shorter processing times and higher efficiency for our customers, earning us high praise.

企業：森田油圧機製作所
価格：Other

Powder Molding Machine
substrate

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Printed Circuit Board Assembly "Demonstration Experiment Report" *Free Gift Available

A report filled with amazing know-how is available for free! With the experience and knowledge unique to mass production factories, we offer prototype services that prototype factories cannot provide!

The "proposal-type prototyping" that solves the troubles of developers and designers often encounters design-related defects during our long-term mass production. When we raise issues, we frequently hear the phrase, "There were no problems during prototyping." Additionally, it is not uncommon to proceed with mass production knowing that making design changes at this stage is cumbersome. When problems arise during mass production, designers often receive harsh words from the manufacturing and quality departments, such as "This is a design issue!" At Reship Electronics, we have extensive mass production experience across a wide range of fields, including automotive, industrial machinery, consumer electronics, and amusement, and we are well-acquainted with the characteristics of each market. Utilizing that knowledge and experience, we extract improvement points with an eye toward mass production even at the prototyping stage, and we propose solutions to prevent quality and cost issues during mass production. *Prototyping Plan 1: As long as functional evaluation can be performed, that's good enough. ⇒ We will produce according to your requests. *Prototyping Plan 2: We will conduct a final functional evaluation of the prototype, but I believe this design will be the basis for mass production. ⇒ We will identify potential quality risks and challenges for efficient production that may arise during mass production and propose improvement plans.

企業：レシップ電子
価格：Other

Printed Circuit Board
substrate

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[Information] Reship Electronic News Vol. 4

Supporting integrated production from design, procurement, production to assembly! Introducing the technology department that supports Reship Electronics!

Our "Circuit Board CAD Department" started operations at Reship (then Sanyo Electric Manufacturing) in 1992 to conduct circuit board design in-house for the Reship Group. This document includes an "Introduction to the Circuit Board CAD Department," "Equipment Owned," and "Highlights of Factory Tours," among other sections. We invite you to read it. 【Contents (partial)】 ■ Introduction to the Circuit Board CAD Department ■ Equipment Owned ■ DENSHi Column ■ Highlights of Factory Tours ■ Flow of Factory Tours *For more details, please refer to the PDF document or feel free to contact us.

企業：レシップ電子
価格：Other

Circuit board design and manufacturing
substrate

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Hirai Precision Industry Co., Ltd. Ceramic Processing Technology Introduction

Foundation technology advantageous for miniaturization of modules!

Ceramic processing is a processing technology that uses glass-ceramic substrates with a thermal expansion coefficient close to that of silicon. Glass-ceramic substrates can be fired at temperatures below 1000°C, allowing the use of Ag, AgPd, and Au as internal conductors. Additionally, since the dielectric constant is lower than that of alumina substrates, signal delay is also minimized. The thermal expansion coefficient being close to that of silicon makes direct die bonding and flip chip (FC) connections to the substrate easier. 【Features】 - Advantageous for miniaturization of modules - Direct die bonding and flip chip (FC) connections to the substrate are easy *For more details, please refer to the catalog or feel free to contact us.

企業：平井精密工業
価格：Other

others
substrate

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Tohoku University Technology: Nitride semiconductor freestanding substrate production method: T14-121

Able to product GaN at low cost by forming of nitride semiconductor crystal boules

Recently, III-nitride semiconductors (GaN and InGaN) have been attracting attention as semiconductor materials for light-emitting devices such as LED and lasers. This nitride semiconductor has a bandgap energy with wide range wavelengths from infrared to ultraviolet light, and it is a promising material for blue & green LED and semiconductor lasers with UV to infrared region emission wavelengths. However, in the case of nitride semiconductors, the equilibrium vapor pressure between the gas and solid phases of nitrogen is much higher than the conventional III-V materials, so it is not possible to fabricate GaN single crystal substrates at low cost. Another option is to use freestanding GaN substrates, but the current fabrication techniques are costly. 　This invention is able to fabricate nitride semiconductor freestanding substrates with low threading dislocation density at a low cost. This invention comprises a total of seven steps, from the process of forming a buffer layer having a nitride semiconductor on the growing substrate main surface, to the process of fabricating a plurality of nitride semiconductor freestanding substrates.

企業：Tohoku Techno Arch Co., Ltd.
価格：Other

others
substrate

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Tohoku University Technology: Substrate with AlN Film and Manufacturing Method: T13-034

It is possible to produce a "super high quality" aluminum nitride film on inexpensive sapphire substrates!

Ultraviolet light-emitting devices are widely attracting attention as next-generation light sources for applications such as alternatives to fluorescent lamps, high-density DVDs, biochemical lasers, decomposition of pollutants using photocatalysts, He-Cd lasers, and alternatives to mercury lamps. These ultraviolet light-emitting devices consist of AlGaN-based nitride semiconductors, known as wide-gap semiconductors, which are layered on heterogeneous substrates such as sapphire. However, there have been challenges with the AlN films grown on sapphire, which contain numerous threading dislocations and exhibit poor quality. The present invention significantly improves the crystallinity of the AlN films through a simple method of thermally treating substrates with AlN films grown on sapphire in an N2/CO mixed gas.

企業：Tohoku Techno Arch Co., Ltd.
価格：Other

others
substrate

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Custom power supply circuit board for railway vehicles.

We will provide power supply units with excellent mass production capabilities, utilizing the extensive production know-how cultivated in the implementation industry.

The characteristic of our in-house power supply is its excellent mass production capability. To reduce mass production costs and improve mass production quality, we will make the most of our 35 years of implementation know-how and component procurement know-how. Additionally, regarding production locations, we can choose from Japan (Tochigi Prefecture) and China (Shenzhen in Guangdong Province, Wuxi in Jiangsu Province), regardless of lot size. We have established a system where all bases can perform production at the same level.

企業：大日光・エンジニアリング
価格：Less than 10,000 yen

Circuit board design and manufacturing
substrate

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[Case Study] IH Soldering Equipment

We are engaged in environmentally friendly manufacturing using equipment and processes that minimize the use of CO2, solder, and VOCs.

We would like to introduce a case where we switched from point dip soldering to our "IH soldering equipment." This change was implemented with the goals of "reducing the amount of solder and flux used" and "contributing to carbon neutrality while enhancing corporate value." As a result of the implementation, we achieved a 29% reduction in solder usage, zero liquid flux usage, and an 85% reduction in power consumption. While production efficiency may decrease slightly, we can perform environmentally conscious soldering, and by manufacturing with Dainikko, we believe we can create environmentally friendly products. We encourage you to consider manufacturing with Dainikko to enhance your corporate value. [Purpose of Implementation] ■ Improve yield rate ■ Reduce the amount of solder and flux used ■ Contribute to carbon neutrality and enhance corporate value *For more details, please download the PDF or feel free to contact us.

企業：大日光・エンジニアリング
価格：Other

Soldering Equipment
substrate

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Canon Components Electronic Circuit Business

We conduct a consistent business from development to manufacturing and sales.

The printed circuit board, which serves as the most important base component in the electrical units used in Canon products. Canon Components has been involved in the design of this printed circuit board since the early stages of product development.

企業：キヤノン・コンポーネンツ電子回路事業部
価格：Other

Other machine elements
Other machine elements
substrate

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TAB flexible substrate

Quality improvement is achievable through the non-contact method using the reel-to-reel process! Please consult us first, regardless of large lots.

The printed circuit board "TAB flexible board" supports a variety of FPCs from prototyping to mass production through R to R lines. Additionally, we conduct simulations from the circuit design stage to provide high-performance, high-quality products. All products are quality assured through automatic visual inspection and electrical testing. We possess a variety of analytical equipment to confirm quality and measure/length at each stage. We offer FPCs compliant with RoHS and made from flame-retardant materials. 【Features】 ■ Mass production of FPCs is realized through R to R ■ We have Ni (nickel)/Au (gold) electroplating equipment to achieve quality that meets customer needs ■ The structure formation of inner leads for connection points is realized *For more details, please request materials or view the PDF data available for download.

企業：キヤノン・コンポーネンツ電子回路事業部
価格：Other

Printed Circuit Board
substrate

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Interposer flexible substrate

Are you having trouble procuring build-up substrates for the main board?

By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.

企業：キヤノン・コンポーネンツ電子回路事業部
価格：Other

Other semiconductors
substrate

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Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

企業：キヤノン・コンポーネンツ電子回路事業部
価格：Other

Wiring materials
Other electronic parts
substrate

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Emergency LED Bulb for Power Outages

Emergency lamp that lights up immediately during a power outage.

It is an LED bulb with a built-in battery that lights up immediately during power outages due to disasters. • The lighting time when using the battery is 3 hours. • It consumes very little power, making it ideal for indoor night lights in living rooms, hallways, and entrances.

企業：加美電機
価格：Other

others
substrate

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[Component Assembly and Various Manufacturing] Flexible Circuit Boards, FPC, Flexible Boards

From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!

- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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【Substrate Analysis Service】FPC・Flexible Substrate

We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC

- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

It is a flexible substrate that combines heat resistance and transparency. FPC

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Stretchable flexible printed circuit board (FPC/flexible board)

It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC

While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

We propose an extremely thin and highly flexible FPC.

It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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ブックマークに追加いたしました

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ブックマークを削除いたしました

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これ以上ブックマークできません

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無料会員登録

Blind Via (BVH) connection Flexible Printed Circuit (FPC)

It is a flexible substrate effective for high-density wiring. FPC

Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

製品を詳しく見る

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Noise countermeasures Shielded flexible circuit board, FPC, flexible board

It is a flexible substrate, FPC, flexible circuit board with noise reduction structure.

This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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ブックマークに追加いたしました

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ブックマークを削除いたしました

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これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Printed Circuit Board Thermal Fluid Analysis Service (Thermal Management) FPC・Flexible Boards

Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC

We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Circuit board design and manufacturing
Contract manufacturing
Contract Analysis
substrate

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ブックマークに追加いたしました

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会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Support for the launch of flexible printed circuit boards (FPC).

Pattern Width VS Temperature Rise Test FPC

●Setting design and evaluation criteria Creating flexible printed circuits (FPC) with multiple pattern widths, applying several patterns of current, and measuring temperature distribution and pattern voltage drop using a thermal viewer. FPC

企業：サーテックフレキ基板（FPC）ソフトウェアハードウェア成膜加工基板設計
価格：Other

Prototype Services
substrate

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substrate - メーカー・企業561社の製品一覧とランキング | イプロスものづくり

substrateのメーカー・企業ランキング

substrateの製品ランキング

substrateの製品一覧

Business Content: Electronic Device Development

Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Meito Electric Co., Ltd. Major Equipment Introduction

Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.

PTFE material IVH substrate *Technical documentation available

Thin film circuit substrate (submount/carrier) *Technical materials available for free!

Hydraulic press machine, powder forming machine

Printed Circuit Board Assembly "Demonstration Experiment Report" *Free Gift Available

[Information] Reship Electronic News Vol. 4

Hirai Precision Industry Co., Ltd. Ceramic Processing Technology Introduction

Tohoku University Technology: Nitride semiconductor freestanding substrate production method: T14-121

Tohoku University Technology: Substrate with AlN Film and Manufacturing Method: T13-034

Custom power supply circuit board for railway vehicles.

[Case Study] IH Soldering Equipment

Canon Components Electronic Circuit Business

TAB flexible substrate

Interposer flexible substrate

Flexible printed circuit board [Reel to Reel method]

Emergency LED Bulb for Power Outages

[Component Assembly and Various Manufacturing] Flexible Circuit Boards, FPC, Flexible Boards

【Substrate Analysis Service】FPC・Flexible Substrate

Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

Stretchable flexible printed circuit board (FPC/flexible board)

Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

Blind Via (BVH) connection Flexible Printed Circuit (FPC)

Noise countermeasures Shielded flexible circuit board, FPC, flexible board

Printed Circuit Board Thermal Fluid Analysis Service (Thermal Management) FPC・Flexible Boards

Support for the launch of flexible printed circuit boards (FPC).

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