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substrate(lsi) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
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substrate Product List

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Introduction to Takeda Manufacturing Co., Ltd.

Introduction to Takeda Manufacturing Co., Ltd.

We will manufacture tools in a short delivery time to match the testers you have!

Takeda Manufacturing Co., Ltd. is engaged in the development, manufacturing, and sales of boards for LSI testers and various electronic devices. We have a wealth of experience in cable harnesses, checkers, machined products, resin products, sheet metal products (including painting), and other electronic device prototypes. We strive to create safe tools that can be used for a long time, taking the operating environment into full consideration, so please feel free to contact us with your requests. 【Industry】 ■ Development, manufacturing, and sales of boards for LSI testers and various electronic devices. *For more details, please download the PDF or contact us.

  • Evaluation Board
  • Circuit board design and manufacturing
  • substrate

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Examples of customized boards (ASIC-PLC Board C)

Examples of customized boards (ASIC-PLC Board C)

Examples of customized board achievements (ASIC-PLC Board C)

Board Development: Examples of Customized Board Achievements This is an introduction to boards customized by TDG based on user requests and specifications. ■□■ASIC-PLC Board■□■ This is a PLC board equipped with system LSI such as SIC and PLD. The CPU can be selected from Hitachi's H8 or SH series. Additionally, software development and operation using general-purpose ladder programming is possible. <Board for Printing Machines> By controlling with TDG's ASIC board, we achieve high functionality, miniaturization of control panels, reduced wiring, and cost reduction. *For more details, please contact us.

  • PLC
  • substrate

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DSP Multi-Modem Board

DSP Multi-Modem Board

Leave the development of the modem to us! We will develop products that comply with international standards and recommendations.

Features of the DSP Multi-Modem Board This is a modulation and demodulation board for data transmission using dedicated voice bandwidth lines. The modulation methods comply with the following four types: - International Standard Recommendation ITU T V.29 9600bps, 7200bps, 4800bps - International Standard Recommendation ITU T V.27bis 4800bps, 2400bps - International Standard Recommendation ITU T V.26, V.26bis 2400bps, 1200bps - International Standard Recommendation ITU T V.23 1200bps, 600bps *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Test Board Making Service

Test Board Making Service

We can respond to the design and implementation of prototype (small quantity) boards for LSI testing at a low cost and with a short delivery time!

The "Test Board Making Service" provides affordable and quick responses for the design and implementation of prototype (small quantity) boards for LSI testing. The initial cost is 0 yen, and by using direct drawing for production, total costs can be reduced by 20-40%. Delivery can be handled in as little as 4 days at the shortest. We also accommodate measures against crosstalk and high current application. If you have any other requests, please feel free to contact us. 【Features】 ■ Affordable and quick responses for design and implementation ■ Initial cost is 0 yen; produced using direct drawing ■ Total costs reduced by 20-40% ■ Capable of addressing crosstalk measures and high current application *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • others
  • substrate

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GaN substrate (square)

GaN substrate (square)

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor.

Gallium nitride (GaN) is a very hard and mechanically stable wide-bandgap semiconductor. Due to its higher breakdown voltage, faster switching speed, higher thermal conductivity, and lower on-resistance, GaN-based power devices are significantly superior to silicon-based devices.

  • Other metal materials
  • substrate

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Rigid substrate

Rigid substrate

Rigid substrate

Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Glass substrate

Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract
  • substrate

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Prototype and mass production of printed circuit boards.

Prototype and mass production of printed circuit boards.

We specialize in prototype manufacturing and small-scale production of printed circuit boards, primarily focusing on single-sided, double-sided, four-layer, and six-layer boards. In addition to FR-4 material, we can also accommodate aluminum and iron materials.

Manufacturing of high-layer-count multilayer substrates, IVH substrates, build-up substrates, and back-drill substrates with eight or more layers is possible in collaboration with partner companies. We can also accommodate substrate manufacturing using "low dielectric materials" MEGTRON 6 and MEGTRON 7, as well as "FR-4" halogen-free materials. In addition to printed circuit board manufacturing, we also perform the following tasks: - We collaborate with partner companies that have first and second-class qualifications in printed wiring board manufacturing to conduct artwork design and simulation analysis. - We also handle component mounting for prototype projects.

  • Circuit board design and manufacturing
  • Prototype Services
  • Other FA equipment
  • substrate

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Low Thermal Expansion Material

Low Thermal Expansion Material

LEX Zero Thermal Expansion Material CTE = 0 (Zero)

Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)

  • LEX ZERO1.png
  • LEX ZERO2.png
  • LEX ZERO3.jpg
  • LEX ZERO4.png
  • alloy
  • Other optical parts
  • Resin mold
  • substrate

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Metal matrix composite substrate Baseplate

Metal matrix composite substrate Baseplate

High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.

AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.

  • Other metal materials
  • substrate

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VMIVME-2170A

VMIVME-2170A

32-bit Optically Isolated Digital Output

Optically Coupled Digital Output board consists of VMEbus compatibility logic,data control logic, four 8-bit output registers, and 32 optically isolated high-level outputs. The board is implemented as a double Eurocard form factor PC board, and provides all necessary address decoding and data transfer control logic to accept both 8- and 16-bit data transfers. Optical couplers isolate the 32 outputs from each other and from the VMEbus. Both supervisory and nonprivileged data transfers are supported.

  • Embedded Board Computers
  • substrate

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Technical Introduction: "Zaguri (COB Technology)"

Technical Introduction: "Zaguri (COB Technology)"

Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.

Sato-sen Co., Ltd.'s router machines are equipped with Z-axis sensors that measure the thickness of the board and perform machining from the top surface, enabling high-precision counterboring. This allows for the embedding of LSI through cavity processing for die bonding. 【COB Technology Features】 ○ Providing reliable and stable COBs → Strict quality control by experienced engineers from a company that has emerged from the plating industry ○ Proven track record from COB development to mass production ○ Even when leads cannot be drawn due to gold plating for electro-bonding in design, unique lead-free electro-bonding gold plating is possible ○ Equipped with bonding machines and pull-cut testers in-house, ensuring a quality assurance system through various chemical analyses, SEM, etc. For more details, please contact us.

  • Printed Circuit Board
  • substrate

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Substrates, etc. Brain Power [Authorized Dealer]

Substrates, etc. Brain Power [Authorized Dealer]

From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.

Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.

  • Printed Circuit Board
  • substrate

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ATE substrate

ATE substrate

Leave the semiconductor inspection device substrate (ATE substrate) to Cygnus.

We manufacture ATE boards at a top-tier overseas manufacturer. We have numerous achievements in probe cards, performance boards, burn-in boards, and more. AW design support (domestic) is also available.

  • Printed Circuit Board
  • substrate

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[Research Material] Global Market for Silicon Carbide (SiC) Substrates

[Research Material] Global Market for Silicon Carbide (SiC) Substrates

World Market for Silicon Carbide (SiC) Substrates: Ultra, Production, Research, Dummy, IT, LED Lighting, Automotive, Industrial, Consumer, Others

This research report (Global Silicon Carbide (SiC) Substrate Market) investigates and analyzes the current status and outlook for the global silicon carbide (SiC) substrate market over the next five years. It includes information on the overview of the global silicon carbide (SiC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the silicon carbide (SiC) substrate market by type include ultra, production, research, and dummy, while the segments by application cover IT, LED lighting, automotive, industrial, consumer, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of silicon carbide (SiC) substrates. It also includes the market share of major companies in the silicon carbide (SiC) substrate market, product and business overviews, and sales performance.

  • Other services
  • substrate

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[Research Material] World Market for Single-Sided FPC Coverlays

[Research Material] World Market for Single-Sided FPC Coverlays

Global Market for Single-Sided FPC Coverlays: Yellow Coverlays, Black Coverlays, Consumer Mobile Devices, Medical, Industrial, Avionics...

This research report (Global Single Sided FPC Coverlay Market) investigates and analyzes the current state and outlook for the global single-sided FPC coverlay market over the next five years. It includes information on the overview of the global single-sided FPC coverlay market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided FPC coverlay market include yellow coverlay, black coverlay, and others, while the segments by application cover consumer mobile devices, medical, industrial, avionics, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of single-sided FPC coverlay. It also includes the market share of major companies in the single-sided FPC coverlay market, product and business overviews, and sales performance.

  • Other services
  • Other services
  • substrate

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[Research Material] World Market for Single-Sided Printed Circuit Boards

[Research Material] World Market for Single-Sided Printed Circuit Boards

World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others

This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.

  • Other services
  • substrate

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[Market Report] Global Market for Ceramic Substrates

[Market Report] Global Market for Ceramic Substrates

Evolving Technology: Opening the Path to Innovation in the Global Ceramic Substrate Market

The global ceramic substrate market has emerged as a driving force behind technological advancements, enabling innovation across various industries. Ceramic substrates, with their exceptional thermal, electrical, and mechanical properties, are shaping the future of electronics, automotive, and aerospace. Known for their high thermal conductivity, low thermal expansion, and excellent electrical insulation, ceramic substrates are revolutionizing the manufacturing of electronic components. These substrates provide a stable platform for integrating semiconductors, LEDs, sensors, and other electronic devices, unlocking the potential for miniaturization, lightweight design, and high efficiency in products. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others
  • substrate

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[Research Material] Global Market for Sapphire Composite Substrates

[Research Material] Global Market for Sapphire Composite Substrates

World Market for Sapphire Composite Substrates: C-Plane Sapphire Substrates, R/M-Plane Sapphire Substrates, Patterned Sapphire Substrates ...

This research report (Global Sapphire Compound Substrate Market) investigates and analyzes the current state and outlook for the global sapphire compound substrate market over the next five years. It includes information on the overview of the global sapphire compound substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the sapphire compound substrate market include C-Plane sapphire substrates, R/M-Plane sapphire substrates, and patterned sapphire substrates, while the segments by application include LED, RFIC, laser diodes, silicon-on-sapphire (SoS) ICs, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of sapphire compound substrates. It also includes the market share of major companies in the sapphire compound substrate market, product and business overviews, and sales performance.

  • Other services
  • substrate

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[Market Report] Global Market for Ceramic Balls

[Market Report] Global Market for Ceramic Balls

Shaping Progress: The Global Market for Ceramic Balls Pioneering Precision and Performance

The global ceramic ball market is ushering in a new era of technological advancement, redefining industries with its exceptional precision, durability, and unparalleled performance. As a cornerstone of technological innovation, ceramic balls are shaping a world where excellence and efficiency converge. In a world where precision is paramount, ceramic balls take center stage. These spherical marvels are designed with nanometer-level accuracy, offering outstanding roundness and surface finish. From advanced bearings to cutting-edge electronics, ceramic balls ensure unmatched precision. For application methods, please check the [PDF download] button or apply directly through the related links.

  • others
  • substrate

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