We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Plasma CVD Equipment.
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Plasma CVD Equipment Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Plasma CVD Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. サムコ Kyoto//Industrial Machinery
  2. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  3. SCREENファインテックソリューションズ Kyoto//Industrial Machinery
  4. プラズマ・サーモ・ジャパン Kanagawa//Electronic Components and Semiconductors
  5. ケニックス Hyogo//Electronic Components and Semiconductors
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Plasma CVD Equipment Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Plasma CVD equipment for thick film formation of SiO2 サムコ
  2. [Data] Silicon processing data using the non-bosch process サムコ
  3. Plasma CVD equipment "SHUTTLELINE(R) Series" プラズマ・サーモ・ジャパン
  4. The ideal small plasma CVD device for research and prototyping: 'VC-R400G' SCREENファインテックソリューションズ
  5. Plasma CVD equipment サムコ

Plasma CVD Equipment Product List

16～20 item / All 20 items

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Plasma CVD equipment

Plasma CVD equipment

It is a device with numerous achievements in mass production of power devices, LEDs, MEMS, etc.

The range of membrane quality control is very broad, allowing us to meet the various membrane quality requirements of our customers. Additionally, we have achieved stable automatic transport for compound wafers and special wafers, which had issues with conventional equipment, contributing to improved yield. In our company, we actively customize each device to reflect our customers' requests as much as possible. We have a demonstration machine permanently installed in-house, so please feel free to consult with us.

  • CVD Equipment

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Plasma CVD equipment

Plasma CVD equipment

Includes a leakage microwave detection feature! The sample installation is exchanged using a motorized up-and-down mechanism from the bottom.

The "Plasma CVD Device" is a CVD device that has been extremely simplified for experimental use. The mass flow main unit uses manufacturer products. The display and setting devices are custom-made by our company, which helps reduce the price. Additionally, it is equipped with a mechanism that allows the distance between the plasma generation area and the sample to be adjusted by moving the microwave waveguide up and down. 【Features】 ■ Extremely simplified for experimental use ■ Equipped with a mechanism to move the microwave waveguide up and down ■ Sample attachment is interchangeable via a motorized up-and-down mechanism from the bottom ■ Includes a leakage microwave detection device ■ All internal mechanisms are compactly designed to save space *For more details, please refer to the external link page or feel free to contact us.

  • CVD Equipment

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The ideal small plasma CVD device for research and prototyping: 'VC-R400G'

The ideal small plasma CVD device for research and prototyping: 'VC-R400G'

Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!

The "VC-R400G" is a plasma CVD device that employs a unique LIA (Low Inductance Antenna) plasma source, achieving ultra-fast and high-quality vacuum deposition on flat substrates such as glass and metal. It is suitable for experiments, research, evaluation, and prototyping. By using the LIA-type inductively coupled plasma (LIA-ICP), it realizes fast, high-precision, and low-damage vacuum deposition. With multi-point control, it ensures finer uniformity. It offers a variety of manual and automatic options. 【Features】 ■ Suitable for experiments, research, evaluation, and prototyping ■ Achieves fast, high-precision, and low-damage vacuum deposition ■ Ensures finer uniformity through multi-point control of LIA ■ Realizes ultra-fast deposition more than five times compared to conventional methods ■ A wide range of options available *For more details, please refer to the related links or feel free to contact us.

  • CVD Equipment

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Plasma CVD device "210D model"

Plasma CVD device "210D model"

Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.

The "210D model" is a film deposition device using Inductively Coupled Plasma (ICP). By replacing hardware on-site, it can be used as an inductively coupled plasma etching device in just a few minutes of work. With a compact body and a variety of options, it supports various applications such as thin film deposition and trench patterning. 【Features】 ■ Can be used as plasma CVD and RIE with simple hardware replacement ■ Approximately 30% smaller footprint compared to industry standards ■ Easy to operate with an intuitive graphic interface ■ Custom specifications can be accommodated upon request *For more details, please feel free to contact us.

  • Etching Equipment

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The ideal small plasma CVD device for research and prototyping: 'VC-R400F'

The ideal small plasma CVD device for research and prototyping: 'VC-R400F'

Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!

The "VC-R400F" is a plasma CVD device that employs a unique LIA (Low Inductance Antenna) method plasma source, enabling ultra-fast and high-quality vacuum film deposition on resin films and metal foils. It is well-suited for experiments, research, evaluation, and prototyping. By using the LIA method of inductively coupled plasma (LIA-ICP), it achieves fast, high-precision, and low-damage vacuum film deposition. With multi-point control, it ensures finer uniformity. It offers a variety of manual, automatic, and optional features. 【Features】 ■ Well-suited for experiments, research, evaluation, and prototyping ■ Achieves fast, high-precision, and low-damage vacuum film deposition ■ Ensures finer uniformity through multi-point control of LIA ■ Realizes ultra-fast film deposition more than five times compared to conventional methods ■ A wide range of options available *For more details, please refer to the related links or feel free to contact us.

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