光機械製作所 List of Products and Services

Material: PET film, Thickness: 50μm Processing Method: Film full cut Size: Cut to thickness of 50μm Features: By using ultra-short pulse lasers, we minimized thermal effects and achieved very sharp and precise cutting edges. This provides excellent processing quality, especially for thin and delicate materials like PET film.

• Other electronic parts

We design and manufacture exchangeable tip drill holders. The photo shows a custom drill equipped with a chamfering cutter, allowing for both drilling and chamfering after drilling to be performed in one operation.

• drill
• byte

【Features】This product is a scribing process into the interior of glass using filamentation with our company's ultrashort pulse laser. The cutting surface is taper-free and has a matte finish (Ra < 1μm). 【Material】Soda-lime glass, thickness: 0.3mm 【Processing Range】Circular cutting sizes: φ3mm, φ6mm, φ12mm

• Other FPD related

【Features】This product utilizes ultra-short pulse lasers on SUS material pipes to create fine hole processing. It is capable of processing not only flat plates but also cylindrical shapes like pipes. If you have any questions about the processing, please feel free to contact us. 【Material】SUS304 pipe, outer diameter φ1.5mm 【Processing Range】Through hole diameter φ0.5mm

• Other electronic parts

Our company offers contract processing services for laser fine machining using ultra-short pulse lasers, providing fine hole processing and small hole processing for various materials. Our website features examples of fine hole processing on substrates such as stainless steel (SUS304), titanium (Ti), copper (Cu), nickel (Ni), CFRP, and glass (alkali-free glass, quartz glass), so please take a look. Now, we would like to introduce our glass fine hole processing. We have developed a process for creating through holes of φ50μm in 0.45mm thick quartz glass. Until now, our limit for through hole drilling in glass of similar thickness using ultra-short pulse lasers was around Φ100μm. However, with the new process, we are now able to process smaller diameter long holes. Moving forward, we will continue our development with the aim of accommodating thicker materials and different hole diameters.

• Other semiconductors

Among laser light, those that repeatedly blink at short intervals are called "pulse lasers." Among them, lasers with a short emission time (duration), particularly those in the pico (10^-12) second or femto (10^-15) second range, are referred to as ultra-short pulse lasers. In 2018, Dr. Gérard Mourou and Dr. Donna Strickland, who devised and demonstrated a method called CPA (Chirped Pulse Amplification), were awarded the Nobel Prize in Physics. This was 33 years after the first paper was published in 1985. While the details are omitted here, this technology significantly contributed to the development of short pulse and high intensity in pulse lasers. By the 1990s, ultra-short pulse laser processing began to be actively researched in research institutions around the world. From the 2010s, fiber-excited ultra-short pulse lasers started to be commercially available as industrial lasers. The laser oscillators we have introduced are these industrial picosecond and femtosecond lasers.

• Other electronic parts

【Material】 Polyester Thickness: 0.1mm 【Dimensions】 Processing Size: 8mm square range 【Features】 This product has been trimmed from polyester resin with a thickness of 0.1mm. Due to the minimal thermal impact of ultra-short pulse laser processing, it is possible to perform fine processing on thin resin materials. If you have any questions about the processing, please feel free to contact us.

• Other electronic parts

【Material】 Polycarbonate Thickness: 1mm 【Dimensions】 Processed within a 10mm square range 【Features】 The resin contains a periodically arranged heterogeneous phase with a refractive index different from that of the material, forming a diffraction grating. When white light is transmitted, it can be observed to separate into rainbow colors as shown in the image. Applications include decorative logos, drawings, markings, lot management, and anti-counterfeiting measures. The processability varies depending on the type of resin, so please contact us if you have any materials of interest.

• Other electronic parts

【Industry and Application】 Automotive-related industry Medical devices and medical parts-related industry Precision stainless steel parts for medical devices 【Material】 Aluminum foil, thickness: 11μm 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultrashort pulse laser processing 【Features】 This product has a QR code laser-processed onto aluminum foil material. Please try scanning it! Our fine laser processing minimizes thermal impact on thin materials with a thickness of 11μm, allowing for clean processing. Physical damage and thermal effects are significantly reduced, enabling fine processing with minimal burrs.

• others

【Industry and Application】 Automotive-related industry Medical devices and medical parts-related industry Precision stainless steel micro parts for medical devices 【Material】 SUS304 (sus304) 【Dimensions】 Pipe outer diameter Φ1.5mm / Through hole diameter Φ0.5mm 【Processing】 Ultrashort pulse laser processing 【Features】 This product has undergone hole processing on a pipe shape made of SUS304 (sus304) material. Our fine laser processing allows for not only flat plate processing but also processing of cylindrical shapes like pipes. Since this product uses ultrashort pulse laser, physical damage and thermal effects are significantly minimized, enabling fine processing with minimal burrs.

• Other electronic parts

【Material and Processing】 SUS304 Thickness: 0.05mm Cutting Width: 0.1mm Cut-out Processing 【Features】 This product has undergone fine shape processing of thin film materials using ultra-short pulse laser. It is expected to be processed for miniaturization of parts and for incorporation into stacked products.

• Other electronic parts

【Material and Processing】 Glass, Microchannel, Groove width 200μm 【Features】 This product can process not only straight grooves but also curved microchannels in glass using ultrashort pulse lasers. 【Industry and Applications】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components

• Glassware and containers

【Microfabrication Company Logo Mark Ultra-Short Pulse Laser Thin Film Material】 【Material】 Aluminum foil Thickness: 11μm 【Industry and Application】 Automotive industry Medical devices and medical parts industry Semiconductors and electronic components 【Dimensions】 Processing size: 3mm x 3mm square range 【Processing】 Ultra-short pulse laser processing 【Features】 This product features a company logo mark laser processed onto aluminum thin film material. Due to its thickness of 11μm, it is less likely to be affected by heat, allowing for clean processing.

• Other electronic parts

【Micro Hole Processing Micron Level SUS304 Stainless Steel Micro Hole Processed Parts】 【Material】 SUS304 (sus304) 【Industry and Applications】 Automotive industry Medical devices and medical parts industry Precision stainless steel micro parts for medical devices 【Dimensions】 Pipe outer diameter Φ1.5mm / Single wall through hole diameter Φ0.5mm 【Processing】 Ultrashort pulse laser processing 【Features】 This product features hole processing on a pipe shape made of SUS304 (sus304) material. Ultrashort pulse laser processing allows for not only flat plate processing but also processing of cylindrical shapes like pipes. This product utilizes ultrashort pulse lasers, which significantly reduce physical damage and thermal effects, enabling fine processing with minimal burrs.

• Other Auto Parts

【Material】 Borosilicate glass 【Industry and Applications】 Electronics and electrical components industry Automotive parts industry Precision components for semiconductors 【Dimensions】 Thickness 1.3mm 3mm×3mm 【Processing】 Ultrashort pulse laser processing 【Features】 This is a cutting process for borosilicate glass. Made from 1.3mm thick borosilicate glass, it has excellent heat resistance and chemical resistance, making it suitable for laboratory instruments and kitchenware. By utilizing ultrashort pulse laser processing for scribing inside the glass using filamentation, it is possible to cut non-tempered glass.

• Wafer

【Material】 Nickel 【Industry and Applications】 Medical devices and medical parts industry Automotive parts industry Electronic and electrical components industry 【Dimensions】 Thickness 0.2mm (200μm) 【Processing】 Ultrashort pulse laser processing 【Features】 This product features fine square hole processing in nickel material. The material is nickel with a thickness of 0.2mm (200μm), processed with fine square holes of 40μm (with a remaining 20μm) at a pitch of 60μm.

• Other physicochemical equipment

【Material】 SUS304 (sus304) 【Industry and Application】 Automotive industry Medical devices and medical parts industry Precision stainless steel micro parts for medical devices 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort pulse laser processing 【Features】 This product is a precision part made from SUS304 (sus304) stainless steel, processed through fine cutting. The material is cut from 0.5mm thick stainless steel with a cutting width of 0.1mm (100μm). For size comparison, a hair is placed above it. This product utilizes ultrashort pulse laser technology, which significantly reduces physical damage and thermal effects, allowing for fine processing with minimal burrs.

• Other Auto Parts

**Material** Borosilicate glass **Industry/Application** Electronics and electrical components industry Automotive parts industry Precision components for semiconductors **Dimensions** Thickness: 1.3mm Length: 76mm **Processing** Ultrafast pulse laser processing **Features** This is a cutting process for borosilicate glass. Using ultrafast pulse laser processing, borosilicate glass with a thickness of 1.3mm has been cut. By utilizing filamentation for scribing inside the glass, it is possible to cut non-tempered glass.

• Wafer

【Microfabrication Trimming Micron Level Polyimide】 【Material】 Polyimide 【Industry and Applications】 Semiconductors Electronic Components 【Material Dimensions】 Plate Thickness: 25μm Remaining Width: 10μm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is made of polyimide material. Trimming processing was performed on polyimide with a thickness of 25μm. The remaining width is 10μm. Since this product uses ultrashort pulse lasers, physical damage and thermal effects are greatly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor components ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Tokatsu Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Wafer
• Processing Contract
• Other semiconductors

【Fine Lithium Cobalt Oxide Thickness: 15μm Lithium-ion Battery】 【Material】 Lithium Cobalt Oxide 【Industry/Application】 Lithium-ion Battery 【Dimensions】 Thickness: 15 microns Diameter: φ1–5mm 【Processing】 Ultrafast Pulse Laser Processing 【Features】 This product is made by cutting lithium cobalt oxide with high quality using an ultrafast pulse laser. It can be used as an anode material for lithium-ion batteries without generating burrs. Due to the use of ultrafast pulse laser, physical damage and thermal effects are minimized, allowing for fine processing with fewer burrs. Hikari Machinery Manufacturing Co., Ltd. ■HIKARI LASER LAB. 511 Room, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Laser marker
• Lithium-ion battery

【Micro Hole Processing Glass Quartz Ultra-Short Pulse Laser Cutting】 【Material】 Glass Quartz 【Industry and Applications】 Medical devices and medical parts related industry Precision stainless steel micro parts for medical devices 【Dimensions】 Thickness 0.5mm (500μm) 【Features】 This product uses ultra-short pulse laser technology to process micro holes in glass. It enables small diameter hole processing with minimal burrs. It is compatible with drilling holes in various types of glass, with a minimum hole diameter of approximately 0.1mm. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwa-no-ha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Contract manufacturing
• Laser marker
• Beverage Production Equipment

【Microfabrication Cutting Glass (Quartz) Filamentation】 【Material】 Glass (Quartz) 【Industry and Application】 Medical Devices Automotive Related 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 We performed cutting and extraction processing of glass (quartz) with a thickness of 0.5mm. By using ultrashort pulse lasers, physical damage and thermal effects were significantly minimized, enabling microfabrication. We support two cutting methods (full cut, filamentation use). ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Other semiconductor manufacturing equipment
• Other physicochemical equipment

【Laser Micro Holes φ100μm Non-Alkali Glass Quartz】 【Material】 Non-Alkali Glass 【Industry and Applications】 Medical Devices Communication Equipment 【Dimensions】 Thickness 0.5mm (500μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has a material thickness of 0.5mm and a hole diameter of 100μm. It enables small diameter hole processing with minimal burrs. It is compatible with drilling various types of glass (quartz). It can accommodate minimum hole diameters of approximately 0.1mm. Microprocessing of Difficult-to-Cut Materials and Shapes ◆ Automotive Parts, Medical Device Parts, Electronic Components, Semiconductor Components ◆ Prototype and Development Projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Other optical parts
• Other markings

【Micro Hole Processing Micron Level φ50μm Synthetic Quartz Glass Medical】 【Material】 Synthetic Quartz Glass 【Industry and Application】 Medical Devices and Medical Parts Communication Equipment Automotive Interior Parts 【Dimensions】 Thickness 0.45mm (450μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 Performed through-hole processing with 10,000 holes within a 20mm range on synthetic quartz glass. Through technological development, we achieved through-hole processing with a hole diameter of Φ50μm. In our conventional processing, the limit for glass of similar thickness was approximately Φ100μm. This product uses ultrashort pulse lasers, which significantly reduce physical damage and thermal effects, allowing for fine processing with minimal burrs. Hikari Machinery Manufacturing Co., Ltd. ■HIKARI LASER LAB. 511 Room, Higashi-Kashiwa Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Laser marker
• Other lighting equipment

【Micro Hole Processing, Micro Machining, Micron Level, Needles, Medical Industry】 【Material】 Needles 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product underwent micro hole processing on the supplied needles. By using ultrashort pulse lasers, we achieved fine processing with minimal burrs, as physical damage and thermal effects are significantly reduced. ◆ Micro machining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Resin mold
• Processing Contract
• Other food machinery

【Microfabrication, Thin Film Processing, Trimming Processing, Micron Level, SUS304】 【Material】 SUS304 【Material Dimensions】 Thickness: 0.1mm Remaining Width: 0.05mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is a trimming process using SUS304 material. Fine processing is performed on a thin film with a thickness of 0.1mm and a remaining width of 0.05mm. This is an example of thin film processing unique to ultrashort pulse lasers. By using an ultrashort pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashikashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Other Auto Parts
• Other machine elements

【Microfabrication Trimming Processing SUS304 Laser Cutting】 【Material】 SUS304 【Material Dimensions】 Thickness 0.05mm Cut Width 0.1mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features cut-out processing of SUS304 material. It has undergone microfabrication with a cut width of 0.1mm, and we can also accommodate trimming of irregular shapes. By using ultrashort pulse lasers, we have significantly reduced physical damage and thermal effects, enabling fine processing with minimal burrs. ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Other Auto Parts
• Other semiconductor manufacturing equipment

【Micro Holes CFRP Composite Material Micro Machining】 【Material】 Composite Material CFRP 【Dimensions】 Hole Diameter 0.1mm Thickness 0.1mm 【Processing】 Ultra Short Pulse Laser Processing 【Features】 Drilling processing is performed on CFRP material. In mechanical processing, issues such as fiber entanglement and fiber breakage due to tool engagement can occur, but using a non-contact laser allows for processing without compromising functionality. The use of ultra-short pulse lasers minimizes physical damage and thermal effects, enabling fine machining with minimal burrs. ◆ Fine machining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Contract manufacturing
• Brake parts

【Laser Micromachining Micro Trimming Processing Copper Cu Micro Holes】 【Material】 Copper (Cu) 【Material Dimensions】 Thickness 0.1mm (100μm) 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product achieves micro trimming processing on 0.1mm thick copper. The residual allowance between the long holes is 50μm, which is very fine. Copper is a material that is easily affected by heat, but by selecting the wavelength of the ultrashort pulse laser, it is possible to process fine shapes with reduced thermal effects. Physical damage and thermal effects are significantly minimized, resulting in fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hik

• Processing Contract
• Other semiconductor manufacturing equipment
• Non-ferrous metals

【Laser Micromachining Glass Processing Internal Modification Marking】 【Material】 Glass 【Industry/Application】 Medical parts-related industry 【Processing】 Ultrafast pulse laser processing 【Features】 This product underwent internal modification processing without damaging the glass surface using an ultrafast pulse laser. Since marking was performed inside the glass, it will not wear away. By using an ultrafast pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Laser marker
• Glass

【Laser Microprocessing Glass Marking Applied to the Medical Industry】 【Material】 Glass 【Industry and Application】 Medical devices and related components 【Processing】 Ultrafast pulse laser processing 【Features】 This product performs fine marking on the glass surface with a Φ0.1mm spot using an ultrafast pulse laser. (Compliant with SEMI format) Since this product uses an ultrafast pulse laser, physical damage and thermal effects are minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects We take care of it all. From processing to equipment setup. Hikari Kikai Seisakusho Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Laser marker
• Processing Contract
• Sealing machine

【Laser Micromachining Hydrophobicity Release Properties Surface Modification Metal Resin】 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product has been modified using ultrashort pulse laser micromachining to impart hydrophobicity to the metal surface. It is also referred to as functional processing, which adds functionality and enhances the product's performance. While hydrophobicity has been added this time, applications such as "hydrophilicity," "friction reduction," and "sliding properties" are also possible, contributing to the improvement of product functionality. It is a technology that utilizes the lotus effect. ◆ Micromachining of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We take care of everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/

• Processing Contract
• Engine parts
• Drive system parts

By using ultra-short pulse lasers for precision machining, fine structures (micro and nano) are created on metal surfaces to impart a water-repellent effect and modify the surface. Water and oil repellency leads to improved functionality, such as preventing product seizure and rust. The technology for adding fine structures to metal surfaces can also be applied to components that require reduced friction and improved sliding properties.

• Processing Contract
• Other machine tools
• Other Auto Parts

By utilizing filamentation with a ultrashort pulse laser for scribing inside glass, it is possible to cut even chemically strengthened glass without causing cracks or breakage. The cutting width is narrow due to fine processing, resulting in a flat cutting surface with a roughness of less than 2μm. Scribing can be applied to glass before chemical strengthening and can also serve as a starting point for breaking. Material: Chemically strengthened glass Thickness: 700μm http://www.hikarikikai.co.jp/laser/

• Processing Contract
• Contract manufacturing
• Semiconductor inspection/test equipment

Trimming processing was performed on nickel thin plates with a short-pulse laser, creating hexagonal holes. It is possible to shape fine holes. With non-thermal processing using a short-pulse laser, even difficult-to-cut materials can be finely processed with minimal burrs, even for complex shapes and narrow residual widths. While conventional machining imposes significant stress on the workpiece, leading to distortion and thermal effects that make it difficult to work with certain materials, short-pulse lasers can handle these challenges. Material: Nickel / Thickness: 200μm Hexagonal hole: Opening 200μm

• Processing Contract
• Evaporation Equipment
• Engine parts

Material: Glass (Quartz) / Thickness 0.15mm A long hole with a width of 0.5mm has been trimmed into the glass thin plate. It is possible to shape fine holes. Fine processing of glass, such as cutting and trimming of thin and fragile glass plates, is possible.

• Glass
• Processing Contract
• Other semiconductors

Cutting (full cut) of brittle and very fragile ceramic thin plates can be performed using ultrashort pulse lasers. Processing with ultrashort pulse lasers does not directly contact the workpiece, resulting in minimal impact on the workpiece. Additionally, since non-thermal processing is possible, there is very little burr formation during processing. Material: Ceramic / Thickness: 200μm

• Processing Contract
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Material: SUS304 / Thickness: 0.1mm / Hole pitch: 100μm A through hole with a diameter of 20μm was processed in a stainless steel flat plate using a super short pulse laser. Processing is possible not only on flat surfaces but also on curved surfaces.

• Processing Contract
• stainless
• Other physicochemical equipment

We have trimmed hexagonal holes into a thin sheet of highly biocompatible titanium. It is possible to shape fine holes. With a narrow remaining width, we can achieve fine processing with minimal burrs even for complex shapes. Material: Titanium Thickness: 0.2mm Size: Opening 200μm Shape: Hexagonal hole

• Processing Contract
• alloy
• Lithium-ion battery

In addition to the elongated strip-shaped cutout, a 0.1mm wide recess has been processed. Although it is a thin plate that is difficult to process and tends to curl in molds, fine processing can be beautifully finished with picosecond and femtosecond lasers.

• Processing Contract
• Contract manufacturing
• stainless

The tip of the PCD cutting tool was grooved using an ultra-short pulse laser. This improves the discharge of "cutting chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as carbide and CBN (cubic boron nitride). Chip breaker (groove) processing Material: PCD (polycrystalline diamond sintered body) Breaker width: 600 μm

• Processing Contract
• byte
• Other cutting tools

Grooves were processed at the tip of a carbide cutting tool using an ultra-short pulse laser. This improves the discharge of "chips" generated during cutting and maintains a good cutting condition. It is also possible to process materials such as PCD (polycrystalline diamond) and CBN (polycrystalline cubic boron nitride). In this way, by applying fine processing with a laser, it is also possible to enhance functionality. Material: Carbide

• Processing Contract
• Other machine tools
• Drive system parts