テクノプリント List of Products and Services

Our company has recently introduced a sputtering deposition machine, enabling us to perform sputtering deposition in-house. <Have you ever experienced the following?> - I want substrate cleaning as well. - Are the deposition conditions fixed within one batch? - Is the number of pieces per batch fixed? Does it become two batches if it increases by even one piece? - I want to request a quick turnaround from deposition to patterning. - I want assistance with arranging glass substrates. - I would like to consult about the sputtering deposition conditions. - I want to entrust the arrangement of cases after deposition. - Is it possible to process from deposition to patterning and individual piece cutting in one go? Our sputtering deposition processing addresses these concerns. <Features> - Substrate cleaning before deposition can be performed as needed. - We consider short lead times for small lot sizes. - We flexibly accommodate processing quantities starting from one piece for small lots. - We also accept processing with variations in deposition conditions, such as changing film thickness for small lots. - After test deposition, we can notify you of the peeling test results and proceed with the main processing. - We provide a seamless service from deposition to patterning and individual piece cutting. - We achieve short lead times through multilayer film patterning via interlayer insulating films. *Please note that there are conditions regarding the types of films, sizes, and quantities we can accommodate, so for more details, please refer to our materials or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

In this document, we present the equipment related to our specialty in "thin film patterning processing." We value our commitment to "manufacturing" and strive to provide our customers with valuable Q (Quality), C (Cost), D (Delivery), and S (Service), contributing to society. Please take a look at our list of equipment. 【Equipment List (Excerpt)】 ■ Cleaning Process - Batch-type cleaning equipment - Sheet-type cleaning equipment ■ Film Formation Process - Sputtering film deposition machine ■ Photolithography Process (Coating/Resist, Exposure, Development) - Roll coater - Spin coater - Bar coater - Screen printing - Exposure machine - Sheet-type - Batch tank ■ Etching Process (Wet etching, Stripping/Resist) - Sheet-type (ITO) - Shower type (Cu, Al, Cr) - Batch tank *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

Metal Mesh Film Heater A solution for preventing snow accumulation and melting through the replacement of traditional halogen with LED head and rear lights. In anticipation of ADAS and autonomous driving, measures for frost and melting on the windshield in front of the automatic safety brake camera! Until now, transparent metal films referred to ITO films, but we have achieved a visually transparent metal film through metal mesh pattern processing using fine pattern processing technology. By selecting Cu for the film quality, we have enabled lower resistance compared to ITO and a wider range of film formation methods.

• Circuit board design and manufacturing

We offer "protective film and insulating film coating" services. We can process materials such as resist and polyimide, and we can also accommodate other supplied materials. For resist, both roll coater and spin coater can achieve thicknesses of 1 to 2 μm, and for polyimide and other materials, we can adjust the film thickness as needed (up to 5 μm). If the effective area of the spin coater is φ300mm, it can process up to 300mm x 300mm. 【Features】 <Coatable Film Types> ■ Resist, polyimide, etc. (can accommodate other supplied materials) <Film Thickness> ■ For resist, both roll coater and spin coater can achieve 1 to 2 μm ■ Film thickness can be adjusted for polyimide and other materials as needed (up to 5 μm) → Coating with spin coater *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

For aircraft and special vehicle monitor applications that require full performance of LCDs! For heat-resistant glass to prevent condensation in surveillance cameras and equipment that require visibility! For chemical analysis and cell culture experiments where heating is desired while observing microchannels, etc.! To prevent fogging on mirrors in bathrooms and washrooms!

• Circuit board design and manufacturing

We offer "fine structure formation" services. We customize molds with μm precision using various resist materials and provide them on evaluation substrates. Pattern shapes can be linear or circular (cylindrical), and we can achieve an aspect ratio of 5:1 (with a film thickness of 50μm or more), having experience up to 3:1. Are you struggling to create high-precision jigs with uneven substrates? Please feel free to contact us when you need assistance. 【Features】 ■ Customized molds with μm precision using various resist materials provided on evaluation substrates ■ Pattern shapes can be linear or circular (cylindrical) ■ Aspect ratio of 5:1 (with a film thickness of 50μm or more) possible (experience up to 3:1) *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

Here are some application examples of "microstructure formation." With this technology, not only simulations but also evaluations and verifications close to actual devices are possible. By creating masks, multiple shapes such as L-shapes, straight lines, and circles (cylinders) can be formed on the same substrate with varying line widths. Substrates such as glass and silicon wafers are also possible. Please feel free to contact us when needed. 【Application Examples】 ■ Evaluation of the followability of adhesives, adhesive films, and fillers (inside semiconductor packages, etc.) ■ Micro holders for micro LEDs, etc. ■ Cover glass spacers for solar cells, etc. *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

- I just want you to apply our company's resist. - Is there anywhere that can do just exposure and development? - I want the film-coated substrate to be peeled off! - I want to work in a clean room. - I want to get small glass as cheaply as possible!

• Chemicals

- Cutting small pieces from large glass - Beveling - Grooving (glass etching)

• Circuit board design and manufacturing

We offer "lamination processing (such as hollow cell production)." We can laminate glass + glass and perform step cuts. We have processing achievements with a gap of 0.01mm between the glass + glass using sealing materials. We can process glass substrates up to a maximum size of 400mm × 360mm and can accommodate thickness variations of ±0.2mm. 【Processing Details】 ■ Glass + glass lamination (step cuts possible) ■ Glass + film lamination (specifications to be discussed) *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

We accept orders for the creation of evaluation substrates for devices. We can supply prototype evaluation substrates in small lots with a variety of types, including glass substrates for evaluating organic EL sealing devices. Additionally, we can provide performance evaluation substrates for optical devices that require pattern recognition. If you are wondering, "Is there a place where I can request customization of evaluation adjustment substrates or reference substrates?" please feel free to contact us. 【Application Examples】 ■ Performance evaluation substrates for optical devices that require pattern recognition * Useful for evaluating performance when considering the purchase of expensive equipment such as exposure machines ■ Creation of glass substrates for evaluating organic EL sealing devices ■ Prototype supply of evaluation substrates for devices in small lots with a variety of types * For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing

We offer "outline cutting and chamfering processing" at our company. We support scribing, dicing (outsourced), and wire chamfering. The substrates can be soda glass, non-alkali glass, quartz, wafers, etc., and can be supplied by you or arranged by us. The thickness ranges from 0.1mm to 10±0.05mm depending on the substrate conditions. 【Processing Details】 ■ Scribing ■ Dicing (outsourced) ■ Wire chamfering *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

Recently, there have been many inquiries about the application of transparent resist and fine processing patterning. Due to its insulating and transparent properties, it is suitable as a protective film for substrates and interlayer insulating films, replacing conventional PI. Thick films are used for the formation of microchannel molds.

• Circuit board design and manufacturing

We offer "Lift-off processing" at our company. This is a technology for patterning thin films that are difficult to etch, where a reverse pattern is formed using resist, followed by the deposition of the required film. After deposition, the resist is removed. If the effective area is φ300mm, processing can be done on glass substrates up to a maximum size of 300mm × 300mm. 【Features】 ■ Patterning of thin films that are difficult to etch ■ Formation of a reverse pattern using resist, followed by deposition of the required film ■ Removal of resist after deposition ■ Specified deposition temperature (around 100°C) ■ Examples: Si, Pt, Ta, etc. *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

We offer "fine metal mesh pattern processing." The "metal mesh film antenna" is designed to support transparent antennas for buildings and vehicles in response to 5G mini base stations. The film substrate size can be considered up to A4 (300×300mm for PET/PC, etc.), and we can also accommodate Cu wiring processing with line or space widths of 5 (3) μm. Additionally, we can handle straight and wave-shaped designs. Please consult us regarding conventional thin film patterning and build-up via plating. 【Features】 <Metal Mesh Film Antenna> ■ Supports transparent antennas for buildings and vehicles in response to 5G mini base stations. <Metal Mesh Film Heater> ■ Prevents snow accumulation and melting by replacing conventional halogen lights with LED head and rear lights. ■ Addresses frost and melting issues on the windshield in front of the camera for automatic safety braking, considering ADAS implementation. *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

We offer "mask creation" services. We can accommodate substrate sizes up to 470×370. We convert customer-drawn images or CAD drawings into mask diagrams and produce photomasks. We have a lineup that includes "Cr masks," as well as "Em masks" and "Film masks." [Features] - Convert customer-drawn images or CAD drawings into mask diagrams - Accommodate substrate sizes up to 470×370 *Minimum size is approximately 4”×4” *For more details, please feel free to contact us.

• Photomask
• Contract manufacturing
• Circuit board design and manufacturing

We would like to introduce our "Microfluidic Chip." This product is designed to miniaturize bio and chemical analysis (systems) by microfabricating various chemical operations such as mixing, reaction, separation, purification, and detection of solutions, and integrating them onto a substrate using microfabrication technology. An aspect ratio of 5:1 is possible. Wiring can be patterned onto a glass substrate, so please feel free to contact us when needed. 【Features】 ■ Channel width: 20μm to 200μm (processing accuracy: ±5μm to ±10μm) ■ Channel depth: 5μm to 100μm (processing accuracy: ±2μm to ±5μm) ■ Aspect ratio of 5:1 is possible (with a film thickness of 50μm or more) ■ Values can be customized ■ Wiring can be patterned onto a glass substrate *For more details, please feel free to contact us.

• Printed Circuit Board
• Other electronic parts

We offer "photosensitive resin patterning" services. For an effective area of φ300mm, the maximum processing size is 300mm×300mm. We can process materials such as resist, polyimide, resin black, and photosensitive Ag (MAX 170□). We have processing achievements with both polyimide and photosensitive Ag having line and space of 10μm. 【Features】 <Processable Film Types> ■ Resist, polyimide, resin black, photosensitive Ag (MAX 170□), etc. <Processing Size> ■ MAX: 300mm×300mm 　※ Effective area: φ300mm *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

We offer "screen printing" services. The minimum size is 100mm x 100mm, and we can process glass substrates up to a maximum of 400mm x 360mm. We have a processing track record of L/S=100μm/100μm. The substrates include soda glass, alkali-free glass, quartz, etc. Both customer-supplied and company-arranged options are available, so please feel free to contact us when needed. 【Features】 <Processable Films> ■ Resist, Ag, etc. <Substrates> ■ Soda glass, alkali-free glass, quartz, etc. (Both customer-supplied and company-arranged options available) *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

We offer "FPC bonding processing." The alignment accuracy is ±0.2mm. We can accommodate ACP and ACF, and we can bond FPC to both processed substrates and supplied substrates. Processing is possible for glass substrates up to a maximum size of 300mm × 300mm. Please consult us separately regarding FPC sizes. 【Features】 <Processing Size> ■ MAX: Processing is possible for glass substrates up to 300mm × 300mm ■ MIN: 100mm × 100mm (FPC sizes are available for separate consultation) <Processing Accuracy> ■ Alignment: Accuracy ±0.2mm *For more details, please feel free to contact us.

• Circuit board design and manufacturing
• Processing Contract

We offer pattern processing for small lot prototypes to mass production for ACF, organic EL, various TEG, MEMS, solar cells, etc., using etching technology. We also accept processing of various film substrates such as glass, PC, PET, and PI. Additionally, we can handle substrate and film formation arrangements. We would like to introduce the "various patterning processes" that we perform. We possess various processing technologies, including lamination processing (such as air cell production), photosensitive resin patterning, and ITO heater processing. *For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to introduce our processing technology "ITO Heater Processing" from Techno Print. This technology heats the target object through direct contact heat transfer or non-contact radiation. It is suitable for heat glass used to prevent condensation in surveillance cameras and devices that require visibility, as well as for monitors in aircraft and special vehicles that need to fully utilize the performance of LCDs. Additionally, we have prepared the frequently requested "ITO Heater Standard Sample Products." 【Principle】 ■ When current flows through the electrodes, Joule heat is generated in the transparent conductive film. ■ The glass is heated, and far-infrared rays are radiated from the glass surface. ■ The target object is heated by direct contact heat transfer or non-contact radiation. *For more details, please refer to the PDF materials or feel free to contact us.

• others

We assist in the production of empty cells and other items using our thin glass bonding technology developed with glass/glass touch panels. Additionally, our glass edge cutting for bonded glass is also well-regarded.

• Sensors
• Circuit board design and manufacturing