サーマプレシジョン List of Products and Services

- LD405 + LED385 + LED365 three-wavelength mixing technology - High-output light source + front and rear double-row structure for higher production capacity ◆ Features - High-speed and high production capacity - High-precision alignment - High cost performance - High-output LD equipped (self-manufactured)

• Stepper

【Features】 ■ Achieves high productivity equivalent to or greater than conventional methods such as electroless plating through a vacuum process. ■ Enables high-density plasma modification treatment using a new plasma source. ■ Allows for a high-adhesion process through direct copper sputtering onto organic insulators and glass. ■ Realizes film formation on high aspect ratio TH and BVH, which is considered difficult with conventional sputtering. ■ Offers overwhelming cost competitiveness in equipment compared to traditional sputtering devices. 【Adhesion Strength (Peel Strength)】 Non-alkali glass: ~10 Quartz: ~7 Epoxy resin: ~6 Polyimide: ~12

• Sputtering Equipment

■ For 8 inches and below, "single exposure method" is available, while for 12 inches, "step and repeat exposure method" can be selected. ■ Achieves high productivity due to a wide exposure area. ■ Has a deep focal depth, with numerous achievements in the MEMS and RF filter industries. ■ Compatible with TAIKO wafers. ■ Global alignment method. ■ High-precision alignment exposure is achieved with a high-rigidity frame. ■ Focus map mechanism is standard equipment.

• Stepper

The UV-LED light source "ULA Series" for exposure machines is a UV-LED lamp designed for exposure equipment. 【Features】 ■ Customizable for various optical specifications ■ Wavelengths: 365nm, 385nm, and 405nm can be mixed ■ Can replace the light source of proximity/contact aligners ■ High production: Achieves equal or greater illuminance compared to mercury lamps ■ Reduced power consumption: Achieves overwhelming reduction in running costs ■ Space-saving: Separation of UV-LED light source and power supply unit is possible ■ High-speed responsiveness: Electronic control for on/off irradiation timing (Mercury lamps are always on with a mechanical shutter) *For more details, please contact us or download the PDF to view.

• others

PWB, wafer, and other electronic component plating solutions, as well as various types of plating such as wiring plating, Viafill, Damacine, and bump plating are supported. By expanding the range of rotation speeds, more new additives can be analyzed. Additionally, the "Get Me Expert" feature allows for immediate contact with on-site support. It is compatible with additives sold by chemical manufacturers worldwide. 【Features】 ■ Compatible with PWB, wafer, and other electronic component plating solutions ■ Supports various types of plating such as wiring plating, TSV plating, Viafill, Damacine, and bump plating ■ Up to four syringes for diverse sample analysis ■ Automatic analysis of up to 42 samples (V30 model) ■ Automation of SE solution and calibration standard solution preparation ■ Multilingual support ■ Built-in galvanostat ■ Improved maintenance of reference electrodes ■ Compatible with additives from the following chemical manufacturers: Atotech, Ishihara Chemical, Kamimura Industry, Okuno Pharmaceutical Industry, Dow Chemical, McDermid, Mertex, ADEKA, EEJA, JCU, etc. *For more details, please refer to the catalog or feel free to contact us.

• Analytical Equipment and Devices

The "CMS (Cerma Micro Stepper) - Ck" is a projection exposure device capable of fine pattern exposure, compatible with full-size substrates of 650×550mm. It uses a UV-LED light source as the standard light source. It is suitable for applications that require high precision, high resolution (L/S) of 2μm, and high productivity, starting with interposers. 【Features】 ■ Supports mass production processes from L/S = 1.4/1.4μm ■ Die-by-die alignment & global alignment methods ■ Capable of chip-first processes ■ Equipped with a tilt mechanism for each shot to improve yield *For more details, please refer to the documentation. Additionally, we have a clean room where our products can be evaluated. If you would like a demo, please feel free to contact us. (We can accommodate surrounding processes including lamination, coating, and development.)

• others

Therma Precision Co., Ltd. provides cutting-edge technology to electronic component manufacturers in Japan through the sale of manufacturing equipment and inspection and analysis equipment for major electronic components such as printed circuit boards, semiconductors, LCDs, and PDPs. 【About the Oxide and Metal Film Thickness Measurement Device】 The PC-M1 is a device that easily measures the thickness of thin film oxide and thin film metal using a continuous electrochemical reduction method. 【Metals for Oxide Measurement】 [About Oxide Measurement] ○ Copper: Cu2O, CuO, Cu2S ○ Tin: SnO, SnO2 ○ Silver: Ag2O, AgCl, Ag2SO4, Ag2S 〇 For other materials (such as aluminum), please consult us. Measurements are taken in various Å (angstrom) units. 【Comparison with Other Analyzers】 PC-M1 vs. Other Analyzers Measurement Time: Several hundred seconds vs. several hours Identification of Oxide Types: Possible vs. Difficult Measurement of Intermetallic Compounds: Possible vs. Difficult Equipment Cost: Within tens of millions vs. thousands to hundreds of millions Ease of Handling: Easy vs. Difficult Minimum Measurement Area: mm² vs. μm² For more details, please contact us or download the catalog.

• others

TherMoire AXP 3.0 utilizes shadow moiré measurement technology to enable surface analysis with a variety of optional modules. It visualizes the surface shape of samples in user-specified temperature profile environments. In addition to measuring warping during heating, optional features are available for analyzing surface behavior in sub-zero temperature environments and calculating CTE values. Furthermore, the design ensures high temperature uniformity due to the top and bottom heating. For more details, please contact us or download the catalog.

• Other measurement, recording and measuring instruments

The metal surface treatment agents SSP-1000 and SSP-2000 can remove impurities from the copper surface before resist application with minimal etching. They can simultaneously remove oxides and grease. By processing the copper surface smoothly, the adhesion with the resist is improved, enhancing resolution. The SSP series is designed for processing in the pre-lamination stage, particularly when physical mechanical polishing is difficult, such as with inner layers and flexible substrates, and when it is desired to minimize chemical etching. It is also capable of completely removing chromium, which has been challenging with conventional treatments, using a single solution. 【Features】 - Sufficient adhesion effect with the resist is achieved through the primer film. - The primer film provides ongoing simple rust prevention until the next process. - There is almost no impact on the copper surface even after several consecutive treatments. For more details, please contact us or download the catalog.

• Other consumables

The DFP module (AXP) can measure non-continuous flat surfaces (island-like) such as products with steps, packages with solder balls, and boards with recesses that could not be measured with shadow moire. The gantry fixture allows for movable measurement positions (capable of moving to specific locations on large samples). It is also possible to measure small structures such as connector holes with high-resolution XY (over 1.9 million pixels) and automatic mask processing. 【Features of Other Options】 - DFP2: Capable of measuring mounted items (steps, solder balls, unevenness, etc.) - DIC2.0: Capable of measuring strain (expansion, contraction, etc.) - SRT: Capable of heating/cooling from -55°C to 300°C - Visualization of both-sided behavior during mounting (reflow) is possible. 【Specifications】 ○ Compatible models – AXP ○ Maximum FOV (Field of View) – 100mm x 100mm ○ Maximum sample size – 400mm x 400mm For more details, please contact us or download the catalog.

• Other measurement, recording and measuring instruments

◆TherMoiré PS200S 【Features】 - Lower heating specification - Measurement field 200mm×200mm - Warpage data acquisition time approximately 2 seconds - Option to equip with DIC2.0 ◆TherMoiré PS600S 【Features】 - Compatible with large substrates - Measurement field 600mm×600mm - Warpage data acquisition time approximately 2 seconds - Option to equip with DFP2, DIC2.0 ◆Table Top Shadow Moiré 【Features】 - Tabletop type room temperature inspection device - Measurement field 300mm×300mm - Warpage data acquisition time approximately 2 seconds ◆Table Top DFP 【Features】 - Inspection device for mounted products at room temperature - Measurement field 192mm×240mm - Warpage data acquisition time approximately 1 second ● For more details, please contact us or download the catalog.

• Other measurement, recording and measuring instruments

The light source device is equipped with a lamp (reflector assembly), rod lenses (optical components that uniform the illumination), and a shutter, among other components. The light from the source is directed to the sample using a series of light guides (optical fibers) and illumination lenses (rod lenses) tailored for various applications. 【Features】 ○ Wavelength selection available ○ Freedom in irradiation shape For more details, please contact us or download the catalog.

• Other FA equipment

It is ideal for removing chips from processing fluids, long-term reuse of coolant liquids, reuse/disposal of recovered sludge, decolorization, and reduction of BOD/COD, among other applications. It is suitable for wastewater treatment in various industries. Recovery of tungsten, cerium oxide, and copper powder is possible. 【Features】 ○ Precise filtration and low moisture content sludge recovery using centrifugal force of 1700G [up to 3000G] ○ No consumables such as filter media like paper filters or filter presses required ○ Capable of filtration separation of valuable materials regardless of whether they are water-soluble, oil-based, magnetic, or non-magnetic For more details, please contact us or download the catalog.

• centrifuge

The recovery of silicon sludge from silicon processing wastewater using a centrifuge achieves stable recovery of silicon sludge with a moisture content of approximately 30%. High purity recovery is possible due to a low-wear structure that minimizes the contamination of impurities in the silicon sludge. 【Features】 ○ Stable recovery of silicon sludge with a moisture content of approximately 30% ○ High purity recovery due to a low-wear structure that minimizes the contamination of impurities in the silicon sludge ○ Unmanned recovery of silicon sludge through fully automated operation For more details, please contact us or download the catalog.

• centrifuge

The next-generation composite material for printed circuit boards, "Clear Sheet," has low thermal conductivity due to independent bubbles and low moisture absorption, providing insulation effects. It has moderate flexibility and excellent elasticity. It also boasts superior resilience, maintaining cushioning properties close to the initial state even after repeated impacts. Since it uses polyethylene, it does not generate dioxins. Its foamed structure is designed with consideration for the environment, energy conservation, and resource savings. 【Features】 ○ Protects products with excellent cushioning properties ○ No self-dusting due to being made of plastic material ○ Anti-static agents prevent issues caused by static electricity and the adhesion of foreign substances For more details, please contact us or download the catalog.

• Paper and pulp

The substrate and film brush cleaning machine "VSC-727" can flexibly adapt to the shapes between patterns thanks to its special brushes. Unlike adhesive rollers, it is effective in removing particles between fine patterns. It employs a suction conveyor to stably transport thin substrates. 【Features】 - The brush unit can be easily detached and attached without tools. - Equipped with a gap adjuster, it accommodates substrates ranging from 60μ to 3.2mm. For more details, please contact us or download the catalog.

• Other cleaning machines

How about fully automated measurement for the inspection of copper plating film thickness? The handheld copper plating thickness measurement device "Cabidarm" can automate various points such as the plating process, final inspection process, and incoming inspection. 【Features】 ○ Measurements are taken instantly ○ The dedicated probe does not scratch the substrate ○ It is possible to connect to a PC via USB cable for advanced statistical processing For more details, please contact us or download the catalog.

• Coating thickness gauge

The completely non-silicone dispersion defoamer for development, "FOAMKILLER NSI-0.00," is a revolutionary defoamer that ensures both immediate and lasting effects without containing silicone. It can also be used as a dispersant to prevent sludge accumulation. 【Features】 - No risk of contamination as it does not contain any silicone components. - Provides rapid defoaming effects when used with alkaline developing solutions. - Extremely excellent dispersibility of sludge, allowing for smooth cleaning of tanks during bathing. For more details, please contact us or download the catalog.

• Other consumables

Ampoc's "developing, etching, and stripping device" features a wider transport wheel width and holes to reduce the surface tension of the liquid, enabling stable transport of thin plates. By using both transport wheels and small-diameter rolls at the connecting parts and liquid discharge, it can prevent troubles such as substrate entanglement at the seams. This is a new generation vertical device that eliminates the effects of liquid vertical flow due to zero contact and rotation. 【Features】 ○ Compatible with thin materials ○ Achieves complete contact-free operation without transport marks ○ Fully automated production with a robot transport system ○ Liquid pooling at the clamp area has been resolved 【Latest Design】*For details, please refer to the catalog ◆ Thermal circulation reuse system ◆ Stripping residue dehydration system ◆ Developing liquid purification system ◆ Magnetic gear For more information, please contact us or download the catalog.

• Other processing machines

Our coating machine is a slit coater based on the concept of sheet processing. It is a device for the slit coating method that applies functional materials such as photoresist to various substrates. We offer solutions ranging from laboratory equipment to mass production systems tailored to our customers' needs. 【Features】 ● Evaluation Equipment 　・Easy functional expansion 　・User-friendly operation 　・Easy maintenance ● Mass Production Equipment 　・High throughput 　・High coating liquid usage efficiency 　・High uniformity of in-plane film thickness 【Product Lineup Information】 　・Slot die running type: SCS series 　・Substrate fixed stage running type: SCT series 　・Inline transport type: SCL series 　・Laboratory type: SCR series 　・Roll-to-roll type: SCR series 【Others】 In addition to slit coaters, we can also propose inkjet coaters, which have a proven track record as mass production machines. We offer coating systems that include pre-coating wet or dry cleaning devices related to the coating process, as well as post-coating drying devices such as hot air, IR, hot plate, and vacuum drying systems.

• Other processing machines

The SX series is a compact and versatile small X-ray device. Its capabilities have improved, and the image quality is different. Additionally, it is equipped with a proprietary micro-focus X-ray tube.

• Image Processing Equipment