ティックコーポレーション Product Lineup

Ultrasonic Cleaning Spray Nozzle For non-contact single substrate cleaning, we offer a megasonic nozzle with either a single nozzle, dual nozzle, or triple channel, and any combination of frequencies ranging from 600kHz to a maximum of 9MHz. The transducer of this megasonic nozzle generates megasonics and sends them through a fluid (such as pure water) to clean the surface of the substrate. Megasonic Immersion Transducer This is a megasonic immersion transducer with frequencies of 400kHz, 600kHz, 1MHz, and 2MHz. A sealed transducer made of stainless steel or plastic (e.g., PP, PVDF, or PFA) is installed at the bottom or side of an existing tank. In addition to standard systems for substrate sizes of 4", 6", and 8", custom immersion transducers are also available. The highly adaptable configuration allows the megasonic system to be used in bath-tank cleaning processes, improving cost-effectiveness. Frequencies available are 400kHz, 600kHz, 1MHz, and 2MHz.

Particles (droplets) formed by the ultrasonic spray nozzle are broken up by the vibrations of the piezo element. In other words, unlike pressurized systems, the particles do not have speed. As a result, they either fall naturally or float due to the influence of the wind. Therefore, carrier air is used to transport the formed particles for application.

The SONOSYS 1MHz megasonic system (FTF transducer & MGH generator) is a high-performance system designed to optimize the cleaning process of single substrates. The main features are as follows: - High-precision cleaning: The PFA-sealed transducer is installed approximately 1.5mm from the substrate, delivering megasonic energy uniformly. - Patent technology: Utilizing "butterfly piezoelectric ceramic" technology, it achieves up to 40% higher sound pressure and up to 30% higher efficiency compared to conventional systems. - Single process compatibility: Suitable for cleaning substrates or wafers up to 300mm. - High output specifications: Features an output adjustment range of 150W (approximately 20% to 100%) and utilizes 1MHz ultrasound. - Stable operating environment: The enclosure is a compact 19-inch design. - Operating temperature range is +10°C to +40°C. - Durability and adaptability: Capable of handling liquid temperatures up to +80°C (when using nitrogen cooling). - PTFE-coated coaxial HF cable (3m) included. - Precision design: Installation distance is approximately 1.5mm (at 1MHz), with a minimum liquid layer thickness of approximately 4mm on the substrate.

In the semiconductor industry, particularly in wafer manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yields. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

In the semiconductor industry, particularly in wafer manufacturing, the removal of fine contaminants is a critical issue that affects product quality. Fine particles and organic substances adhering to the wafer surface can lead to decreased device performance and lower yields. Our ultrasonic megasonic cleaning equipment effectively removes these contaminants from the wafer surface using megasonic technology. This supports the production of high-quality semiconductor products. 【Usage Scenarios】 - Cleaning in the wafer manufacturing process - Removal of fine contaminants and organic substances - Production of high-quality semiconductor products 【Benefits of Implementation】 - Improved cleaning quality - Enhanced yield - Increased product reliability

In the optical industry, precise cleaning that affects the quality of prisms is essential. In particular, the removal of fine dust and oil films can impact light transmittance and refractive index, potentially degrading product performance. Our ultrasonic megasonic cleaning equipment thoroughly removes fine dirt adhered to the surface of prisms using megasonic power, contributing to the production of high-quality products. [Application Scenarios] - Cleaning in the prism manufacturing process - Cleaning of optical lenses - Cleaning of precision parts [Benefits of Implementation] - Improved product quality with high cleaning power - Reduced cleaning time - Lower cleaning costs

In MEMS device manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in MEMS device manufacturing. 【Application Scenarios】 - Removal of foreign substances in the MEMS device manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

In the semiconductor manufacturing industry, particularly in wafer production, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to a decline in device performance and a decrease in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, thereby contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

In optical lens manufacturing, the removal of fine foreign substances and residues is a crucial issue that affects product quality. Even slight dirt on the lens surface can lead to a decline in device performance and a deterioration in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in optical lens manufacturing. 【Application Scenarios】 - Removal of foreign substances in the optical lens manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Effects of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

In the CMP process, the removal of slurry from the wafer surface is a critical process that affects product quality. Residual slurry on the wafer surface can lead to defects and reduced yield in subsequent processes. Sonosys' ultrasonic megasonic cleaning equipment achieves high cleaning power and uniform cleaning, contributing to quality improvement in the CMP process. [Usage Scenarios] - Slurry removal in the CMP process - Foreign matter removal in the wafer manufacturing process - Rinse process after chemical cleaning [Effects of Implementation] - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

The Sonosys Digital Generator is a next-generation digital generator developed for megasonic cleaning. It supports a wide frequency range from 400 kHz to 9 MHz, achieving high-precision output control with a maximum of 35W and a minimum of 0.35W. It is equipped with remote monitoring and control functions via Modbus communication, allowing real-time visualization of output, temperature, and operating status. Additionally, it is compatible with existing Sonosys nozzles, promoting smart factory initiatives while keeping equipment upgrade costs down. This innovative solution contributes to quality improvement and digital transformation in semiconductor cleaning, electronic component cleaning, and precision parts cleaning.