WELCON List of Products and Services

We can assist customers with challenges in areas such as heat exchange, heating, cooling, temperature uniformity, heat transport, and heat diffusion, from problem extraction and proposal planning to design, analysis, prototyping, performance evaluation, quality assurance, and mass production. We provide high-performance thermal management components that leverage microchannel structures (channels less than 1000μm). Our manufacturing process using "diffusion bonding technology" allows for strong and leak-free joints without melting the metal. We guarantee pressure resistance upon shipment (with achievements in compliance with the High-Pressure Gas Safety Act (KHK), the European Pressure Equipment Directive (PED), and ASME). We will comprehensively introduce our strengths and product lineup. 【Standard Lineup of Thermal Management Components】 ■ Microchannel heat exchangers: Heat transfer (exchange) between fluids ■ Microchannel heat sinks: Heat removal and addition by fluids ■ Vapor chambers: Heat diffusion and transport (sheet-type heat pipes) ■ Inline heaters: Heating and vaporization of fluids *For more details, please download the PDF or feel free to contact us.

• Heat exchanger

Due to the increase in computational load and high output, the heat generated by chips and light sources has increased, and we often hear the following concerns: - Air cooling cannot sufficiently cool the high heat generation. - I want to try water cooling, but I wonder if it will leak. - Considering carbon neutrality, I want a cooling method that reduces environmental impact and power consumption. Therefore, we are releasing a brochure on heat sinks as a reference for considering water cooling! Please feel free to download the brochure.

• Cooling system

Introducing the microchannel heat exchanger (inline heater) manufactured by WELCON. 【Features】 - Diffusion bonded, low leakage without the use of filler materials - Customizable in size, performance, pressure loss, etc. - Uniform heating without temperature variation 【Recommended Applications】 - Heat transfer fluid heating - Chemical heating - Monomer heating - Resin heating, etc. For more details, please refer to the catalog! *For more information, please check the PDF document or feel free to contact us.

• Heat exchanger

WELCON's heat sinks enable uniform cooling and are characterized by their high cooling performance with minimal refrigerant usage. In this document, we will introduce the concerns related to heat sink cooling that have been raised by our company, which has been involved for many years in the planning, method examination, analysis verification, prototype development, evaluation, and mass production of heat sinks.

• Cooling system

This time, we would like to introduce our high-pressure microchannel heat exchanger, the 'WEL-Cool(R) H2 Series,' which we are currently developing. It is a heat exchanger for hydrogen compressors that applies the technology of the heat exchanger H2C (pre-cooler) designed for hydrogen stations. Its rectangular shape makes it easy to install and contributes to space-saving. Additionally, we are developing two standard designs tailored for different applications: one for packaged hydrogen stations and another for medium-sized hydrogen stations. <Example of expected specifications> - Design pressure: 94 MPa - Heat resistance temperature: 190°C *For more details, please download the PDF or feel free to contact us.

• Heat exchanger

The "WEL-Cool Heat Sink" is a microchannel water-cooled heat sink (cold plate) that can be customized in various ways, including dual-side cooling, thin design, size, and performance. It features a microchannel structure on both sides, allowing for simultaneous cooling. Additionally, it achieves high performance (low thermal resistance) while maintaining low pressure loss. The innovative internal structure helps to equalize the temperature distribution. Please feel free to contact us for inquiries. 【Features】 ■ Simultaneous cooling on both sides ■ High performance (low thermal resistance) and low pressure loss ■ Equalized temperature distribution ■ Manufactured using diffusion bonding, with no filler metal used in the product ■ Customization available in various forms *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

Our company engages in manufacturing using both design technologies for heat, fluid, and structures, as well as diffusion bonding technology. "Diffusion bonding" is a technique that promotes the movement of atoms at the bonding interface by heating and applying pressure to the materials to be joined. This document provides a detailed explanation of the characteristics and processing examples of diffusion bonding through photos and diagrams. If you are interested in diffusion bonding, please feel free to contact us. [Contents] ■ Characteristics of diffusion bonding ■ Processing examples of diffusion bonding *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

Our company designs, manufactures, and sells microchannel heat sinks. We can suppress the temperature rise to 40°C for a heat generation of 260W/cm². The microchannel flow paths are arranged across the entire cooling surface, ensuring that the refrigerant is evenly distributed throughout all flow paths. Fresh refrigerant uniformly spreads within the plane, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Features】 ■ Suppresses temperature rise to 40°C for a heat generation of 260W/cm² ■ Microchannel flow paths are arranged across the entire cooling surface ■ Internal structure ensures even distribution of refrigerant across all flow paths ■ Reduces refrigerant volume ■ No need to significantly lower the refrigerant inlet temperature *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment

A heat sink is a component used to cool absorbed heat, commonly used when dissipating heat from heat sources such as CPUs. Many designs utilize a structure called "fins" to release heat into the air or to flow water internally to absorb heat. Our company designs, manufactures, and sells water-cooled heat sinks, which we refer to as "microchannel heat sinks." The "water-cooled microchannel heat sink" allows fresh coolant to evenly distribute across the surface, reducing temperature variations, improving cooling efficiency, and achieving low thermal resistance. 【Structure】 ■ Matrix structure ■ Distribution flow path ■ Microchannel flow paths arranged across the entire cooling surface ■ Internal structure that evenly distributes coolant to all flow paths *For more details, please refer to the PDF materials or feel free to contact us.

• Other environmental equipment
• Heat exchanger

We are offering a clear explanatory document that introduces the "vapor chamber," which is suitable for cooling and heat dissipation in electronic devices, industrial equipment, and medical/testing equipment! A vapor chamber is a heat dissipation device that transports and spreads heat, allowing for efficient heat dissipation from various products. Due to its thin sheet form, it has recently been adopted in mobile devices compatible with 5G. This document provides an easy-to-understand explanation of the basics and features of vapor chambers! It includes diagrams and photos, making it accessible even for those who are unfamiliar with vapor chambers. You can download the document immediately from the "PDF Download" link. We encourage you to take a look! [Contents] - What is a vapor chamber? (3 pages total) - Features of vapor chambers (4 pages total)

• Heat exchanger
• Other electronic parts
• air conditioning

WELCON Co., Ltd. specializes in the production of "thermal management devices." The development of microchannel products using diffusion bonding technology has achieved "high efficiency" and "miniaturization" in thermal management devices. These can be utilized in energy-related equipment, electronic devices, medical devices, and inspection equipment. If you are struggling with thermal management for your equipment, please feel free to consult us. Additionally, you can view materials that not only introduce the thermal management devices we handle but also provide information about microchannels through the "PDF Download." We encourage you to take a look. 【Contents of the materials】 ■ What is a microchannel? ■ Introduction to microchannel thermal management devices ・ Microchannel heat exchangers ・ Microchannel heat sinks (water-cooled) ・ Vapor chambers (VC) *For more details, please refer to the PDF materials or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

Since our establishment, we have been working to adapt diffusion bonding technology for mass production, and we are pleased to present a detailed explanation of "diffusion bonding" from our company! The diffusion bonding we conduct is a solid-state bonding technique that joins metals without melting them, which broadens the range of feasible products and functions. For example: - High-pressure, compact, and high-performance heat exchangers (such as those for hydrogen stations) - Water-cooled heat sinks capable of uniform cooling - Vapor chambers (sheet-type heat pipes) that can diffuse localized heat input in a planar direction - Microreactors that efficiently mix minute amounts of two fluids Through the realization of fine and complex structures, we have been working on miniaturization and high performance. Please feel free to consult us, especially for any heat-related issues. This document clearly explains the principles, methods, and features of diffusion bonding! It is designed to be easy to read, even for beginners in manufacturing, using diagrams and photos. You can download the document immediately from "PDF Download." We encourage you to take a look! 【Contents】 - What is diffusion bonding? - Methods of diffusion bonding - Features of diffusion bonding

• Heat exchanger
• Other electronic parts
• air conditioning

Many existing heat sinks have a simple structure known as a 1-path structure, where the flow path from the inlet to the outlet is connected by a single line. In this case, there is a temperature variation between the inlet side, where fresh refrigerant is supplied, and the outlet side, where the refrigerant is heated by the heat source. The heat sinks provided by WELCON as standard products can cool uniformly without temperature variation. They feature a "matrix flow path" that implements microchannels with fine chambers like those in liquid crystals, allowing fresh refrigerant to be distributed uniformly. [Features] - No temperature variation - Can cool uniformly - Fresh refrigerant is distributed uniformly by implementing fine chambers like those in liquid crystals with microchannels *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

Our company has a high alignment accuracy that enables the precise realization of microchannel structures. Even when stacking 300 plates with a honeycomb hole structure ranging from 250μm to 800μm, it is possible to stack and bond them accurately, allowing for the holes to be continuous. We will consider an optimal internal structure design based on the specifications. Please feel free to contact us when needed. 【Microchannel Features】 ■ Contributes to reducing both diameter and flow path length ■ By controlling the convergence of both parameters, overall pressure loss can also be controlled ■ If the flow rate is constant, pressure loss can be controlled *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

Solid-phase diffusion bonding is a method of directly joining materials that are to be bonded, which is significantly different from techniques such as welding or brazing. By applying heat and pressure to the materials to be joined, this technique promotes atomic movement at the bonding interface, allowing for bonding without melting the materials. This solid-state bonding expands the range of possible manufacturing methods and functionalities. Through the method of solid-phase diffusion bonding, it is possible to create fluid devices with microchannel structures and complex fine three-dimensional structures. 【Features】 ■ Lamination bonding of thin plates is possible ■ Bonding strength comparable to the base material can be achieved ■ Complex hollow components can be manufactured ■ Precise bonding with minimal deformation is possible ■ Bonding of dissimilar materials is possible *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce our efforts to miniaturize heat exchangers. Heat exchangers with microchannels can be miniaturized without compromising heat exchange performance compared to those without microchannels. Additionally, miniaturization allows for flow rate reduction. At WELCON, we have reduced the volume to one-hundredth while maintaining the same performance using microchannels. You can find more details through the related links. [Overview] ■ Microchannel heat exchangers ■ Increased heat transfer area due to microchannel design ■ High corrosion resistance and heat resistance through solid-phase diffusion bonding *For more details, please refer to the PDF materials or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce an example of a three-dimensional structure that our company has developed. The "inflation sample," which is a hollow component inflated under internal pressure, shows no leaks or fractures at the joint interface even after deformation. The "gas mixer" alternates two fluids at the outlet through microchannels. The "microreactor," composed of a reactor section and a heat exchange section, allows for individual temperature control of the fluids before and during mixing, thereby controlling the reactions of each fluid. Please feel free to contact us if you have any inquiries. 【Features】 <Inflation Sample> ■ A sample inflated under internal pressure in a hollow component ■ No leaks or fractures at the joint interface after deformation <Gas Mixer> ■ Alternates two fluids at the outlet through microchannels ■ Increases the contact area of the two fluids for efficient mixing *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce examples of dissimilar material joining that our company has conducted. Joining of stainless steel plates and copper plates, as well as aluminum and copper heat sinks, is possible, allowing for the joining of different metals. This can be applied to designs that leverage the characteristics of the materials. We can propose prototypes suitable for the desired combination of materials and sizes. 【Features】 ■ Condensed knowledge of joining and material evaluation expertise accumulated by WELCON ■ Capability to join different metals ■ Ability to propose prototypes suitable for the desired combination of materials and sizes ■ Well-suited for application to designs that utilize the characteristics of the materials *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce examples of the application of "molds with cooling circuits" that our company has implemented. It features uniform temperature control within the mold and an internal cooling circuit design tailored to the product shape. Our company can arrange internal cooling circuits even in thin rib shapes and narrow sections. This can be applied to molds designed for high cycles. 【Features】 ■ Uniform temperature control within the mold ■ Internal cooling circuit design tailored to the product shape ■ Internal cooling circuit for reducing resin cooling time ■ Capability to arrange internal cooling circuits in thin rib shapes and narrow sections *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce an example of the application of diffusion bonding for "mold parts gas vent blocks" that our company has conducted. This structure is designed to remove gas generated from the molten resin during resin filling into the mold. Our company is capable of arranging numerous fine holes with diameters of 0.01 to 0.03 mm on the surface. It can be applied to custom-shaped products according to specifications, including hole diameter, shape, size, and arrangement density. 【Features】 ■ High injection surface strength ■ Reduced gas venting resistance ■ Capability to arrange numerous fine holes with diameters of 0.01 to 0.03 mm on the surface ■ A structure that allows gas generated from the molten resin to be removed from the mold during resin filling *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce an example of the diffusion bonding application for "mold parts manifold" that our company has conducted. It has a flow path structure for injecting molten resin into the interior of the mold. It is suitable for application to injection molding molds and hot runner blocks. 【Features】 ■ Smoothens the wall surface of the resin passage (interior) to reduce flow resistance ■ Has a flow path structure for injecting molten resin into the interior of the mold ■ Well-suited for application to injection molding molds and hot runner blocks *For more details, please refer to the PDF materials or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

We would like to introduce an example of diffusion bonding application for our "low thermal expansion high thermal conductivity material." It consists of a columnar body that facilitates heat transfer in the direction perpendicular to the surface, and a plate that suppresses the thermal expansion coefficient in the plane. The thermal conductivity is approximately 280 W/mK, and the in-plane thermal expansion coefficient is 5 to 10 ppm/K, making it a composite material that balances thermal conductivity and low thermal expansion. 【Features】 ■ Thermal conductivity: Approximately 280 W/mK ■ In-plane thermal expansion coefficient: 5 to 10 ppm/K ■ A composite material that balances thermal conductivity and low thermal expansion ■ Composed of a core and core plate *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

WELCON manufactures and sells the standard heat exchanger for hydrogen stations, 'WEL-Cool H2A/H2C', which is used to cool hydrogen before filling. Heat exchangers for hydrogen stations must meet safety standards such as long-term hydrogen exposure resistance and high pressure (approximately 100 MPa: megapascals). Our product meets these safety standards through our unique microchannel flow structure, achieving high heat exchange performance and compactness. 【WEL-Cool Features】 ■ From the first generation "WEL-Cool H2A" to the second generation "WEL-Cool H2C" ■ The "H2C" reduces size and weight by about half compared to the "H2A" ■ Reduced coolant usage ■ Connectable from both sides (2 surfaces) *For more details, please refer to the PDF document or feel free to contact us.

• Heat exchanger
• Other electronic parts
• air conditioning

The "WEL-Cool Heat Exchanger PF0.5" is a compact microchannel heat exchanger with high heat exchange performance due to its φ0.5mm channels. It is made entirely of SUS316L, with diffusion bonding for base material strength. Customization of heat exchange capacity and design pressure is possible. Additionally, this product features a highly efficient counterflow design. 【Features】 ■ High heat exchange performance with φ0.5mm channels ■ Highly efficient counterflow design ■ Made entirely of SUS316L, with diffusion bonding for base material strength ■ Customization of heat exchange capacity and design pressure *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment
• Heat exchanger

The "WEL-Cool Heat Exchanger CF0.5" is a customizable small microchannel heat exchanger with adjustable heat exchange capacity and design pressure. It features high heat exchange performance with φ0.5mm channels and has passed a pressure resistance test of one million cycles at the design pressure. Made entirely of SUS316L, it is lightweight and palm-sized, allowing for direct connection to piping. 【Features】 ■ High heat exchange performance with φ0.5mm channels ■ Lightweight and palm-sized for direct connection to piping ■ Made entirely of SUS316L, with diffusion bonding of base material strength ■ Passed a pressure resistance test of one million cycles at the design pressure ■ Customizable heat exchange capacity and design pressure *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment
• Heat exchanger

The high-pressure, high-efficiency microchannel heat exchanger "WEL-Cool Heat Exchanger" is a compact and high-quality heat exchanger with excellent pressure resistance. Our heat exchangers utilizing microchannels can significantly enhance heat exchange efficiency compared to conventional heat exchangers by employing numerous very small pathways. The standard models are made of SUS316L and are available in 3kW to 10kW types. We also offer custom solutions tailored to environmental conditions and specifications, with a proven track record in manufacturing lightweight heat exchangers using materials like aluminum. - If you would like to first try a prototype heat exchanger made of aluminum… - If you have requests such as wanting to supply heat exchangers while maintaining quality assurance for mass-produced items… please feel free to consult with us. 【Features】 ■ Outstanding heat exchange efficiency ■ High pressure resistance ■ Accurate process control of mass and heat exchange ■ Miniaturization and lightweighting of devices ■ Fast response *For more details, please contact us or download the catalog.

• Heat exchanger

It is possible to manufacture shapes that are difficult or impossible to create with conventional machining. Parts can be produced using machining, etching, pressing, and other processes. If you provide the specifications (quantity, material, dimensional accuracy, etc.), we will assist you from the design stage. 【Features】 ○ Round cross-section holes with curvature can be produced ○ High aspect ratio fine hole shapes can be produced ○ Square cross-section holes can be produced For more details, please contact us or download the catalog.

• Processing Contract

"WEL-Therm" is a patented heat spreader made of all-metal construction, ensuring high toughness with low thermal expansion and high thermal conductivity materials. It can be applied in "semiconductor power devices," as well as "power modules such as IGBTs" and "semiconductor manufacturing equipment." It is low-cost because it does not use rare metals like Mo or W. 【Features】 ■ Patented ■ High thermal conductivity: 280W/mK ■ Coefficient of thermal expansion: 5–10ppm/K ■ High toughness ensured due to all-metal construction ■ All design parameters such as thermal conduction core diameter, arrangement density, and total thickness are freely customizable *For more details, please refer to the PDF document or feel free to contact us.

• Composite Materials

"WEL-HeatRibbon" is a sheet-type vapor chamber. It rapidly moves and diffuses heat in response to localized heat input. The working fluid enclosed in a sealed space undergoes phase changes repeatedly, allowing it to diffuse heat from the heat source. This product can also be used under spatial constraints by bending it. 【Features】 ■ Rapidly moves and diffuses heat in response to localized heat input ■ Being sheet-type allows for use under spatial constraints ■ Outer shape and thickness can be designed according to specifications ■ Uniform temperature distribution ■ Capable of accommodating special shapes through free planar shapes and bending/forming *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment

The "M4040/M2020" is a microchannel heat sink that is effective for heat removal from high heat density sources. In the commonly seen "single flow path," there is a "temperature variation" on the cooling surface. WELCON's fluid distribution design technology achieves effective heat absorption from high heat density sources through uniform cooling. By improving the heat absorption density compared to conventional products, it enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping. There is a proven track record of mass production for cooling CPUs in supercomputers. When combined with heat exchangers, precise temperature control is possible. 【Features】 ■ 260W/cm² heat absorption ■ Uniform temperature across the entire surface due to matrix flow paths ■ Customizable ■ Achieves low flow rate and low thermal resistance ■ Enables downsizing, weight reduction, simplification, and energy saving, including the pump and piping *For more details, please refer to the PDF document or feel free to contact us.

• Other environmental equipment

This is an introduction to our "Diffusion Bonding Technology," which possesses top-tier technology in the country and can handle everything from basic research, idea proposals, joint development, device development, to mass production processing with in-house designed and manufactured equipment. 【Features】 - Capable of laminating thin plates - Achieves bonding strength comparable to the base material - Can manufacture hollow components in complex closed spaces - Allows for precise bonding with minimal deformation - Bonding of materials that are difficult to weld using fusion welding - Capable of bonding dissimilar metals and materials - Applicable for mass production of 3D laminated structures and 3D printers *For other functions and details, please download the catalog or contact us.

• Welding Machine