9/2 Webinar: Semiconductor Sensor Technology for Implementing the Future

2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!

The Complete Guide to Low Dielectric Materials in the Semiconductor and AI Era ~ Deciphering the 2035 Strategy from Implementation, Regulation, and Economic Security ~ 【Features of this Book】 - Technological innovations and market changes of low dielectric materials supporting the era of over 224Gbps! - Supply chain restructuring and material strategies in the geopolitical era! - Future vision of advanced packaging driven by optoelectronic integration and glass core substrates! - Analyzing the 2035 electronic substrate materials market through a triple amplification model! - A multifaceted analysis of the competitive advantages of major material manufacturers! - Technical requirements for low dielectric materials supporting chiplets and 3D packaging! - Growth potential and investment value of the low dielectric materials market looking towards 2035!

• Other semiconductors
• Technical and Reference Books

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Explaining the products and features of in-vehicle camera systems! Summarizing and introducing the trends!

This book summarizes the trends of key sensors and related technologies and materials that support autonomous driving. In recent years, products that eliminate mechanical components, known as "mechanism-less types," or replace mechanical components with semiconductor and optical technologies have emerged. The future of the automotive business is shifting from "manufacturing and selling cars" to "providing services for comfortable mobility." Furthermore, this significant trend is progressing by involving industries such as automotive parts, semiconductors, IT, software, and materials manufacturers, and this book researches how each industry will change in the future. **Features** - Forecasting the price and market trends of millimeter-wave radars essential for ADAS - Explaining the products and features of in-vehicle camera systems and summarizing trends - Discussing the market size, price trends, and corporate entries of LiDAR, which is of interest - Tracking the impact of ADAS/autonomous driving systems on various industries *Please download the order form from the PDF download when applying.* *For more details, please download the PDF or contact us.*

• Laser Components
• Other services
• Technical and Reference Books

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will be exhibiting at "EdgeTech+ 2026," which will be held at Pacifico Yokohama from November 18 (Wednesday) to November 20 (Friday). This time, we will showcase our new product, the Renesas RZ/G3L equipped SMARC module, as well as motherboards and slim industrial computers that utilize this module. We will introduce solutions aimed at improving development efficiency through a common platform, as well as considerations for mass production and long-term operation. Additionally, we will display a wide range of products, including various embedded boards, IoT gateways, edge AI computers, short-depth 19-inch servers, and CRA-compliant products, along with examples of custom development aimed at solving customer challenges. We invite you to stop by our booth during this opportunity! ■Booth Number: Pacifico Yokohama Exhibition Hall 3-8 ■For more details: https://www.advanet.co.jp/mec-events/edgetech2026/

[Speaker] Hideo Ishihara, Specially Appointed Professor at Gifu University, National University Corporation Tokai National Higher Education and Research System Former Head of Semiconductor Division at Denso [Lecture Topics] 1. The Discovery of Quantum Mechanics and the Invention of Semiconductor Technology 2. Advanced Semiconductor Manufacturing (TSMC, Kumamoto JASM, Chitose Rapidus in Hokkaido, and Global Trends) 3. A 100-Year History of Computers and AI Semiconductors (CPU, GPU, NPU, Photonic-Electronic Integration) 4. A 100-Year History of Mobility and Semiconductors 5. Mobility (Autonomous Driving) and Semiconductors (Edge AI, Chiplets) 6. Mobility (Electrification) and Semiconductors (IGBT, SiC, GaN, Ga2O3, Diamond) 7. The Impact of Nobel Prize Research on "Quantum Entanglement" and "Bell's Inequality" 8. The Transformation of Future Society Seen from AI to AGI: Where is Humanity's Place? Living with Dreams 9. Q&A

[Key Lecture Content] 1. Circular Economy Policy Centered on Plastic Resource Circulation Strategy Keiko Osawa, Deputy Director, Resource Circulation Economy Division, GX Group, Ministry of Economy, Trade and Industry - Transition to a circular economy against the backdrop of economic security and decarbonization - Trends in system development through the Plastic Resource Circulation Promotion Act and others - Formation of the recycled plastic market and strengthening the competitiveness of the resource circulation industry - Progress and achievements of the plastic resource circulation strategy so far - Future policy directions towards realizing a circular economy and expectations for the private sector - Q&A / Business card exchange 2. JEPLAN's Initiatives in PET Chemical Recycling and Future Prospects Masaki Takao, President and CEO, JEPLAN Inc. - Domestic and international trends and challenges surrounding PET resource circulation - Features of JEPLAN's PET chemical recycling technology - Efforts towards achieving bottle-to-bottle recycling - Funding from the GX Promotion Organization and business expansion - Future prospects towards realizing resource circulation and a decarbonized society - Q&A / Business card exchange

[Key Lecture Content] 1. Direction of Bioindustry Policy and Future Priorities Ayako Yukawa, Deputy Director (General) of the Biological Chemistry Industry Division, Ministry of Economy, Trade and Industry 1. Global Trends Surrounding the Bioindustry 2. Japan's Strengths and Challenges to Overcome 3. Direction of Bioindustry Policy at the Ministry of Economy, Trade and Industry 4. Q&A / Business Card Exchange 2. The Future of Bio-Manufacturing Opened by Industrial Smart Cells - Industrial Transformation through Integrated Biofoundry Akihiko Kondo, CEO of Bacchus Bioinnovation 1. Trends in Bio-Manufacturing and the Potential of Industrial Smart Cells 2. Creation of Smart Cells through AI, Robotics, and Data-Driven Biofoundries 3. Comprehensive Technological Foundation from Microbial Breeding to Manufacturing Process Development 4. Resource Utilization of CO2 and Untapped Biomass and Prospects for Industrial Transformation 5. Q&A / Business Card Exchange