List of For Techies products
- classification:For Techies
46~90 item / All 4696 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Responsible care materials for everyone working at the forefront of manufacturing.
- Distance learning/E-learning
Responsible care materials for everyone working at the forefront of manufacturing.
- Distance learning/E-learning
No need for heat sinks or cooling fans! Contributes to space-saving in monitoring systems.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
No need for heat sinks or cooling fans! Contributes to space-saving in signal systems.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
[Exhibition at Nepcon Japan 2026] CoaXPress camera that does not require a fan or heat sink. With a low heat generation design, you no longer have to worry about heat management.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
We exhibited at NEPCON Japan 2026 (digest version materials available).
◇◆We exhibited at the 40th InterNepcon Japan◆◇ ーーーーーーーーーーーーーーーーーーーーーーーーーー Thank you for your continued support. This is Japan Bopixel. The "40th InterNepcon Japan," held from January 21 to 23, recently concluded successfully. We sincerely thank everyone who visited us. 【Highlights of this exhibition】 - 105MP/245MP ultra-high-resolution sensor-equipped CoaXPress area scan cameras - 10MP/14MP/21M ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras ▼ You can download the PDF materials of the new products introduced at the exhibition from the "Related Materials" section at the bottom of this page. Related Materials > Exhibition Digest_Japan Bopixel.pdf We also welcome requests for individual explanations! Please feel free to contact us. Japan Bopixel Corporation, Sales Department
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Recommended for those who want to promote problem-solving activities in all manufacturing sectors and levels!
- Technical Seminar
This is a seminar to acquire "real 5S," which is directly linked to the establishment of 5S activities. It is especially recommended for site leaders who are struggling with the implementation of 5S o...
- Technical Seminar
Learn the creation procedures, utilization methods, and review points based on the control plan manual through case studies and exercises.
- Technical Seminar
Learn the process through demonstrations! An explanation of the processes handled by AI and the judgment criteria taken on by humans.
- Technical Seminar
Learning from Virtual Cases: How to Build Proposal Stories that Move Other Departments
- Technical Seminar
High-end tools for efficient modeling preparation
- Technical and Reference Books
We will exhibit at TCT Japan 2026.
We will be exhibiting at TCT Japan 2026, which will be held at Tokyo Big Sight from January 28, 2026 (Wednesday). We will introduce EOS metal and resin 3D printers and the 3D printers from AMCM, which is responsible for customizing EOS devices. Exhibition: TCT Japan 2026 Location: Tokyo Big Sight, South Hall 3 Organizer: JTB Communication Design, Inc. Rapid News Publications Ltd. Date: January 28 (Wednesday) to January 30 (Friday), 2026 10:00 AM to 5:00 PM Booth Number: South Hall 3S-L06 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
We can handle hazardous substances (sodium hypochlorite) safely!
- Vocational Training/Technical School
- Disinfectant
- Other sterilization, disinfection and disinfection equipment
Introducing two methods to lighten heavy pool chemicals in a column format!
- Chemicals
- Vocational Training/Technical School
- Coagulant
Explains the basics of microwave heating to engineering applications. Learn about the principles of rapid, internal, and selective heating, thermal runaway, temperature distribution control, and heati...
- Heating device
- High frequency/microwave parts
- Technical Seminar
An explanation of the basic knowledge of photoresist essential for high-precision printing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of pattern formation for the light-emitting layer in LED manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresists useful for microchannel formation.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist useful for surface processing of optical lenses.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of photoresist essential for microstructure processing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Fundamental knowledge of photoresists essential for high-precision component manufacturing in the aerospace field.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
I will explain the basic knowledge of the printing process in an easy-to-understand manner.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist essential for electrode formation in solar cells.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for the manufacturing of liquid crystal displays.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of electrodeposition coating contributing to weight reduction and strength improvement in the aerospace field.
- Coating Agent
- Technical and Reference Books
High accuracy in discrimination is the key! Added registration of resin types to the sensor enables efficient material discrimination for "recycling-specific substrates." *Free webinar available.
- Technical Seminar
From e-learning that supports employee skill development to personnel evaluations and internal communication! Providing a centralized solution for the functions necessary for organizational management...
- Distance learning/E-learning
- Distance learning/E-learning
- Other information systems
Learn the creation procedures and utilization points of D-FMEA/P-FMEA based on AIAG & VDA FMEA through case studies and exercises.
- Technical Seminar
Creating a system based on the comparison of differences before and after the revision, as well as the organization of documents and understanding of ISO operations.
- Technical Seminar
"CHECKROID+" × "hakaru.ai by GMO" collaboration demo available! Field operations are changing this much. Practical methods for inspection DX.
- Technical Seminar
- Plant Maintenance
- Management Skills Seminar
[Available for preview] ~ Surface activated bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesive ~
- Technical and Reference Books
[Book] Trends in the Development of Semiconductor Device Junction Technology and Materials, and Reliability Evaluation (No. 2372) [Available for Preview]
- Surface-active bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesives ◎ 3D semiconductors, chiplet integration, SiC power semiconductors, automotive electronic components, micro LEDs, etc. Examples of new materials and processes for the development of advanced semiconductors, their possibilities, and verification results are included! ---------------------------- ■ Table of Contents Chapter 1: Bonding and adhesive technologies for advanced semiconductor packages, their material development, and reliability evaluation Chapter 2: Development and reliability evaluation of bonding materials and processes for power semiconductors Chapter 3: Development and reliability evaluation of bonding technologies and materials in electronic devices ---------------------------- ● Publication Date: August 31, 2026 ● Format: A4 size, 387 pages ● Authors: 423 ● ISBN: 978-4-86798-164-1 ----------------------------
Explaining the technical challenges for social implementation from 3D cell printing of marbled cultured meat to automatic production systems, quality evaluation, regulations, and commercialization.
- Food Processing Equipment
- Bioinformatics
- Technical Seminar
A systematic explanation of the manufacturing process of semiconductor ICs, from the front-end and back-end processes to assembly, including the roles and necessity of the materials used in each stage...
- Other semiconductors
- Other semiconductor manufacturing equipment
- Technical Seminar
Explaining the latest technologies and market trends in plastic recycling, biomass utilization, and the provision of biodegradability, as well as future prospects.
- plastic
- Other Recycling
- Technical Seminar
Newcomers with zero experience, those in sales or administrative positions, and anyone who is feeling nothing but anxiety are welcome.
- Technical Seminar
~Practical work for the development, approval, and manufacturing of research results in pharmaceuticals and biopharmaceuticals into "products"~
- Technical Seminar
The future of personalized medicine created by multi-omics analysis and AI utilization, and the forefront of development and regulatory affairs.
- Technical Seminar