List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

1231~1260 item / All 5048 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

  • TRON 1000.PNG
  • TRON 5000 black n white.JPG
  • TRON 5000.JPG
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  • Butyl Smooth.JPG
  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.

  • Bonding Equipment

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Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.

  • Bonding Equipment

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We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.

  • Other semiconductor manufacturing equipment

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Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.

  • Bonding Equipment

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Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.

  • Bonding Equipment

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We create tapered capillaries with a constant inner diameter using our unique manufacturing technology.

  • Analytical Equipment and Devices
  • Other machine elements
  • Semiconductor inspection/test equipment

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We will exhibit at the 2024 Japan Proteomics Society Annual Meeting and the 20th Joint Meeting of the Japanese Clinical Proteogenomics Society.

Our company will be exhibiting at the Joint Conference of the 2024 Annual Meeting of the Japanese Proteomics Society and the 20th Annual Meeting of the Japanese Clinical Proteogenomics Society, which will be held at Link Station Hall Aomori from June 26 to 28, 2024. At our booth, we will showcase a complete set of interfaces that enable high-sensitivity measurements using capillary electrophoresis-mass spectrometry (CE-MS). We invite anyone using CE-MS, as well as those who own an MS and are interested in utilizing capillary electrophoresis, to visit our booth.

[Domestic Authorized Dealer] LEVITRONIX Bearingless Pump Achieves liquid delivery performance and control performance that meet the demands of advanced processes!

  • CMP Equipment

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Enhance the supply pressure of pure water within the factory to eliminate pressure shortages! Furthermore, suppress fluctuations in pure water supply pressure to achieve a stable supply of pure water.

  • Other semiconductor manufacturing equipment

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Ideal for experiments, research, evaluation, and prototype production! Achieving high-speed, high-precision, low-damage vacuum deposition on flat substrates such as glass and metal!

  • Sputtering Equipment

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Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!

  • CVD Equipment

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For experimental use in companies and university laboratories! A compact slit coater that accommodates various coating conditions and materials, achieving high precision in coating uniformity.

  • Coater

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A compact slit coater (die coater) that flexibly accommodates various coating conditions and materials, achieving high-precision coating uniformity.

  • Coater

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For experimental use in companies and university laboratories! A high-precision and compact slit coater (die coater) that accommodates various coating conditions and materials.

  • Coater

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Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on flat substrates such as glass and metal!

  • CVD Equipment

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It is a manual polishing device for a luminescence spectroscopic analysis apparatus.

  • Wafer processing/polishing equipment

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With a space-saving design, the vacuum pump module can be installed up to 18 meters away from the process module.

  • CVD Equipment

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Achieving high-quality polishing that retains the edge through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through automation.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.

  • Etching Equipment

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Kyoto, the ever-evolving hub of precision sheet metal! Adapting to flexible manufacturing.

  • 3D CAD
  • Other CAD
  • Wafer processing/polishing equipment

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Samples will be displayed at the exhibition. Improved separation from printed circuit boards! Chemical resistance including organic solvents and alkali.

  • Photomask

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The corresponding pipe sizes are OD 38.1mm to 76.2mm! Introducing our pipe outer surface polishing machine.

  • Wafer processing/polishing equipment

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Non-contact transport of wafers and glass substrates using ultrasound! It's a clean transport technology! No contamination from contact! No contamination risk from air blow!

  • Other semiconductor manufacturing equipment
  • Secondary Cells/Batteries
  • Other conveying machines

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We will provide you with the latest information on "Majesty-DI."

  • Printed Circuit Board
  • Photomask
  • Substrate transport device (loader/unloader)

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Conducting ultra-precision grinding processing for core pins of molds for mobile phone connectors!

  • Wafer processing/polishing equipment
  • Processing Contract

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We provide sapphire components with wide transparency characteristics, hardness, chemical stability, heat resistance, and good thermal conductivity.

  • Etching Equipment

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