List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
361～405 item / All 5007 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
A technology essential for the removal of residual organic matter after biodegradation and coagulation sedimentation!
- Oxidation/Diffusion Device
- others
Introducing the issues of non-degradable organic substances and examples of wastewater treatment with diagrams and photos!
- Oxidation/Diffusion Device
- others
Introducing a method for the decomposition treatment of organic matter containing refractory organic substances!
- Oxidation/Diffusion Device
- others
Achieve multi-functional bonding solutions with a single unit! Specialized in bonding for batteries.
- Bonding Equipment
"Improving productivity, bond quality, and reliability" - Expanding the bonding area, equipped with advanced pattern recognition, and enhancing process control in wire bonding.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
The Model 1200 tabletop reflow device is an ideal tabletop unit for process development and small-scale production of microelectronics packages.
- Bonding Equipment
Supports the installation of multi-functional high-precision components! Compatible with applications requiring advanced load control and image recognition. [Demo units available for loan]
- Bonding Equipment
Stable and high-quality wire bond process management! Achieve improved operating rates and high productivity!
- Bonding Equipment
- Other mounting machines
- Other contract services
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Compatible with in-situ ellipsometers and transmission spectrometers! High-speed ALD equipment manufactured by the German company FHR.
- Other semiconductor manufacturing equipment
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From design to after-service of the equipment! We can offer various equipment proposals.
- Sputtering Equipment
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Support for the entire lifecycle from device design to after-sales service!
- Sputtering Equipment
- Plasma surface treatment equipment
We relentlessly pursue customer satisfaction and technical expertise, contributing to society. We have extensive experience in contract manufacturing for OEMs and prototype machines.
- CVD Equipment
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Under the management philosophy of 'pursuing customer satisfaction and technical expertise to the utmost and contributing to society,' we develop our business.
- Vacuum Equipment
- Evaporation Equipment
- Sputtering Equipment
Using conductive PP! Suitable for prototypes and small-scale transportation, shipping, and storage.
- Racks and Cases
- Other semiconductor manufacturing equipment
- cabinet
Introduced the ROKURO CEGA capable of processing at Φ0.01. Also supports simultaneous 5-axis machining.
- Ion implantation equipment
Round hole filters and honeycomb mesh, etc.! You can create freely shaped designs.
- Etching Equipment
- Optical inspection of LEDs - Electrical characteristic testing - High-speed processing of classification - By exchanging attachments, one machine can be used for both side view and top view.
- Automatic sorting machine
- Chip type LED
- Other semiconductor manufacturing equipment
Standard products available in a variety of sizes, customization is also OK! *Currently offering product samples to 10 people by lottery.
- Other semiconductor manufacturing equipment
We will be exhibiting at the 2nd Semiconductor Industry Exhibition to be held in Kyushu in October 2025.
This time, Orte Corporation will exhibit at the "2nd Kyushu Semiconductor Industry Exhibition," continuing from last year. As a specialized manufacturer of collets for chip transport, we will introduce a variety of cutting-edge products that respond to the latest assembly processes, including rubber collets for ionizer countermeasures and patented holder mechanisms that can accommodate high-aspect and large chips. Particularly noteworthy is the rubber collet with a U-shaped recessed type that achieves a contact width of less than 0.1mm between the chip and the collet, utilizing ultra-precision processing technology. It is also compatible with optical devices and bumped chips, making it ideal for high-precision applications that require flatness at the collet tip. We will have sample displays of our products, including collets, so please feel free to stop by our booth. 【Exhibition Contents】 - Pickup collets (rubber/plastic/metal/others) - Bonding-related components (upward needles, dispense nozzles, transfer pins) - Wire bonding-related components (EFO torch, wire clampers, window clampers, finger clamps) - Transport components (magazine racks, IC chip trays)
High-performance, cost-effective RF/DC magnetron sputtering system for research and development.
- Sputtering Equipment
- Evaporation Equipment
- Other semiconductor manufacturing equipment
◇◆◇ nanoPVD-S10A Magnetron Sputtering Device ◇◆◇
This is a research and development RF/DC magnetron sputtering device. Despite its high performance and multifunctionality, it fits into limited laboratory space with a compact size and easy operation via a 7-inch front touch panel. ● Achievable pressure: 5x10^-5 Pa (*fastest 30 minutes to 1x10^-4 Pa!) ● Film uniformity: ±3% ● Various options: up/down rotation, heater, cathode for magnetic materials, and more ● 3-source cathode + 3 MFC systems, with additional RF/DC power supply, allowing for versatile applications such as multilayer films and simultaneous deposition. - Insulating films - Conductive films - Compounds, etc. 【Main Features】 ◉ Compatible substrates: 2" (up to 3 sources) or 1" (1 source) ◉ 2" cathode x up to 3 sources ◉ Easy operation via touch panel with PLC automatic program control ◉ High-precision APC process control with MFC ◉ Up to 3 MFC systems ◉ USB port for Windows PC connection, capable of creating and saving recipes for up to 1000 layers and 50 films. Live data logging on PC. ◉ Vacuum system: TMP + RP (*dry pump option) ◉ Substrate rotation, vertical lift, and heating (Max 500℃) ◉ Quartz crystal film thickness monitor/controller
High-performance, cost-effective RF/DC magnetron sputtering device for research and development.
- Other semiconductor manufacturing equipment
- Sputtering Equipment
Sputtering/Dual Chamber System【MiniLab-E080A/S060A】
Two thin-film experimental devices are connected via a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected through the load lock. With Moorfield's unique load lock system, connections to the left, right, and rear process chambers are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB Evaporation: 7cc crucible x 6 - Resistance Heating Evaporation x 2 - Organic Evaporation Limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron Cathode x 4 sources for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma Etching Stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique 'soft etching' technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Supports RCA cleaning and various etching! Significantly reduces the usage of chemicals and pure water as well as the footprint.
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
Accommodating various process needs with a diverse range of chamber forms! Work sizes range from 2-inch to 12-inch wafers.
- Other surface treatment equipment
- Other semiconductor manufacturing equipment
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
High-speed line inspection at SWIR 2K×1, 110kHz
- Monochrome camera
- Semiconductor inspection/test equipment
Flow spray of 2 mmlit/min or less is possible!
- nozzle
- valve
- Etching Equipment
The website of the ultrasonic spray nozzle manufacturer "Sonaer" has been renewed.
The website of the ultrasonic spray nozzle manufacturer "Sonaer" has been renewed. Compared to the previous website, product browsing has improved, and we have also started offering a new system. If you are interested, please feel free to contact us.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
A super compact spin coater that won't be in the way even inside the glove box.
- Other semiconductor manufacturing equipment
The micro heater can be easily wrapped around pipes and can be used even in a vacuum.
- Other semiconductor manufacturing equipment
- Food Packaging Machinery
Various shapes can be produced according to the shape of the heated object. We can manufacture even from just one piece!
- Other semiconductor manufacturing equipment
- Other processing machines
Support yield improvement through pressure management!
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
Support yield improvement through pressure management!
- Other semiconductor manufacturing equipment
- Other measurement, recording and measuring instruments
The layout and operability of the NS series remain unchanged, achieving stable low-temperature measurements.
- Tester
- Other semiconductor manufacturing equipment
Full support from FPC design, prototyping, and mass production to board power-on testing, appearance inspection systems, and FA automation! TAIYO FPC SOLUTIONS!
- Semiconductor inspection/test equipment
- Printed Circuit Board
- Circuit board design and manufacturing
Technological capabilities that contribute to the development and practical application of advanced materials.
- Etching Equipment
- Plating Equipment
- Other surface treatment equipment
Equipped with a function to adjust the swing angle! It can maintain an even spray balance!
- Wafer processing/polishing equipment
- Other surface treatment equipment
Design of the arrangement of transport components (rolls) developed independently by our company! Stable transport without corner bends or dents is possible.
- Etching Equipment
Utilizing hydrogen gas, stainless steel bright treatment is possible!
- stainless
- Annealing furnace
- Electric furnace
It is a top-grade fluid transfer solution that achieves visibility and flexibility.
- Piping Materials
- hose
- Other semiconductor manufacturing equipment
A multipurpose hybrid hose that combines the high durability of the rubber hose with the cleanliness and chemical resistance of the PFA in the fluid contact area.
- Food Processing Equipment
- Other Cosmetics Factory Equipment and Parts
- Other semiconductor manufacturing equipment
