List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
586～630 item / All 5227 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
Even uniquely shaped items like those in the photo can be produced from just one piece. Ideal for cleaning narrow spaces inside equipment.
- Brush
- Other semiconductor manufacturing equipment
- Parts feeder
Excellent bonding using AMX patented micro-punch technology.
- Other semiconductor manufacturing equipment
IC multi-function inspection support! Equipped with an LCR meter developed in-house.
- Tester
Compatible with flat cables! Equipped with automatic mechanisms, manual mechanisms, and desktop mechanisms, etc.
- Tester
Double table/shuttle type! Inspection equipment for FC-CSP/large individual chip substrates.
- Semiconductor inspection/test equipment
Overall alignment accuracy ±2.5μm! Inspection equipment for large individual pieces/quarter panels.
- Semiconductor inspection/test equipment
LUL can provide proposals tailored to your specifications! We accommodate a variety of automation requirements.
- Semiconductor inspection/test equipment
Micro-capacity inspection with high resolution! Capable of inspecting various products such as thin-film RF filters and accelerometers.
- Tester
USB3.2 10Gbps 5 Megapixel SWIR Model
- Monochrome camera
- Semiconductor inspection/test equipment
A device that transfers 25 wafers to a carrier or boat at once.
- Semiconductor inspection/test equipment
A device for arranging broken wafers in order of lot number.
- Semiconductor inspection/test equipment
With our core technology, we respond to our customers' themes! Haimeka will walk alongside our customers!
- Contract manufacturing
- Other semiconductor manufacturing equipment
- Circuit board design and manufacturing
Contributes to the efficiency and quality improvement of semiconductor manufacturing processes. Since there are no specialized parts, maintenance is easy, allowing for quick recovery. It achieves low ...
- Semiconductor inspection/test equipment
We provide consistently! Electronic components, electronic modules, electronic equipment inspection devices.
- Semiconductor inspection/test equipment
![[Analysis Case] Organic Contaminati...](https://image.mono.ipros.com/public/product/image/8dc/2001259488/IPROS7869069611740115784.jpg?w=280&h=280){kind=small}
We will analyze trace amounts of organic contaminants adhered to the material using TD-GC/MS.
- Contract measurement
- Semiconductor inspection/test equipment
![[Analysis Case] Composition Analysi...](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280){kind=small}
Shape observation and simple quantitative analysis using SEM-EDX.
- Contract Inspection
- Wafer
- Other semiconductor manufacturing equipment
Bringing precision dispensing closer to you. Precision dispenser 'Quspa-Dx'.
- Other semiconductor manufacturing equipment
We propose a custom-made dispenser that fulfills your ideals.
- Other semiconductor manufacturing equipment
Achieved over 50% higher throughput compared to conventional serial testers by adopting Per-Pin architecture!
- Tester
Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26
Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=
High-performance wafer-level test system compatible with wafers from 8 inches to 12 inches!
- Tester
Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26
Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=
Supports PAM4/NRZ signals and covers the 1.6TBASE/CEI-224G standard!
- Tester
Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26
Yonata Electronics Co., Ltd. will exhibit at "OPIE '26," which will be held at Pacifico Yokohama from April 22 (Wednesday) to April 24 (Friday), 2026. We will showcase various test solutions for optical communication, silicon photonics, and semiconductors, including a live demo of the PXIe/benchtop SMU, a 1.6T compatible DCA/BERT, LD testing, CPO, PCIe high-speed cable BER, WAT/WLR, and more. We sincerely look forward to your visit. 【Highlights】 - Live demo of the 1.6T optical transceiver evaluation solution - First public unveiling of the PCIe high-speed cable BER tester - Live demo of the high-precision SMU - Display of CPO solutions and LD evaluation proposals for AI data centers 【Exhibition Information】 ■ Venue: Pacifico Yokohama ■ Date: April 22 (Wednesday) to April 24 (Friday), 2026 ■ Address: 1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa 220-0012 ■ Booth: K-14 For more details, please refer to: https://www.opie.jp/2026/list/info.php?id=5296&ex=
A collection of case studies on the implementation of process analyzers / online analyzers actually introduced around the world!
- Analytical Equipment and Devices
- Moisture Measuring Device
- Semiconductor inspection/test equipment
A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...
- Other semiconductor manufacturing equipment
- Other semiconductors
- Technical Seminar
Liquid hazardous materials can also be safely transported with all-fiber solutions.
- Wafer
- Resist Device
- Photomask
The installation direction can be freely set! Achieving maintenance-free operation with a long lifespan of 30 million rotations!
- Slip Ring
- Sputtering Equipment
A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.
- High pressure cleaner
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Clean drying using high-purity IPA is possible for devices, wafers, glass, components, etc., regardless of material or shape.
- Other semiconductor manufacturing equipment
Our local subsidiary in Thailand supports your business! - A trading company known for its flexibility.
- Other semiconductor manufacturing equipment
- others
- Other Connectors
![[Compact & Lightweight] UV (Ultravi...](https://image.mono.ipros.com/public/product/image/2b2/2000455383/IPROS90958152167746040604.png?w=280&h=280){kind=small}
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!
- Tester
It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!
- Tester
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.
- Semiconductor inspection/test equipment
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
![[Compact & Lightweight] UV-LED Irra...](https://image.mono.ipros.com/public/product/image/41b/2000460215/IPROS62495294798517871344.png?w=280&h=280){kind=small}
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
A Comprehensive Explanation of the Benefits and Applications of Formic Acid Reduction (Manufactured by Unitec Japan)
- Annealing furnace