List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1126～1170 item / All 4821 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Welding high-performance heat sink, 550mm wide x 84mm high - available in length variations.
- Other semiconductors
Welding high-performance heat sink with a width of 600mm and a height of 84mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 33 mm and a height of 10 mm - available in various lengths.
- Other semiconductors
Many alternative products from other manufacturers, JSCJ's logic IC.
- Dedicated IC
Covering the latest trends in the AI semiconductor and memory markets, you can also check advanced technology information and market forecasts! Sign up for free on the site to receive the latest infor...
- Other semiconductors
HI-6120/6121 is optimized for MIL-STD-1553 remote terminals.
- Other semiconductors
Aluminum extruded heat sink with a width of 33 mm and a height of 6 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 31 mm and a height of 10 mm - available in various lengths.
- Other semiconductors
The HI-6110 is the world's smallest message processor with remarkably low power consumption.
- Other semiconductors
This is a device related to the treatment of CMP wastewater (including CMP slurry). If you are having trouble with wastewater treatment, please take a look.
- Other semiconductors
Considering optimal designs for filters to remove various chemical pollutants in the air, such as acidic, alkaline, and organic gases, tailored to the customer's environment.
- Other semiconductors
Did you know that CMP slurry can be regenerated as CMP slurry?
- Ceramics
- Other semiconductors
Aluminum extruded heat sink with a width of 31 mm and a height of 6 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 30 mm and a height of 17.5 mm - available in length variations.
- Other semiconductors
Many alternative products from other manufacturers, JSCJ's logic IC.
- Dedicated IC
The GS4 series of LL DRAM is suitable for network devices with low latency.
- Memory
GSI Technology Rad-Hard SRAM
Release of Rad-Hard versions of SigmaQuad-II+, SyncBurst, and NBT SRAM! GSI's Rad-Hard SRAM is expected to be a key component in advanced systems utilizing cutting-edge FPGAs, ADCs, and DACs. The initial release products are certified to Class-Q and Class-V levels to meet the stringent requirements of aerospace and defense customers. For satellite and defense customers eagerly awaiting alternatives to current Rad-Hard memory solutions, GSI's Rad-Hard SRAM leverages our proven commercial technology and architecture with radiation enhancement, providing efficient and high-performance state-of-the-art memory at the 40nm technology node.
★Equipped with 4-core Intel Core i3-9100HL★2x XMC/PMC ★SSD option★2x GE★Long-term supply
- Microcomputer
Dustproof and waterproof USB memory. There are also products available for a wide temperature range.
- Memory
★ 2x Front Removable Storage Module ★ High-speed PCIe transfer from host to module ★ Ruggedized support
- Microcomputer
3U VPX rugged environment storage products 480GB to 8TB data capacity
- Microcomputer
Aluminum extruded heat sink with a width of 30 mm and a height of 7.5 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 25 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 11.5 mm - available in various lengths.
- Other semiconductors
We will comprehensively respond to our customers' needs, from consulting on requirements specifications to chip replacement!
- Other semiconductors
FPGA capable of high-speed and real-time processing.
- Other semiconductors
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
7/2 Basic Course on Semiconductor Packaging Technology WEB Seminar
Title: "Fundamentals of Semiconductor Packaging Technology ~ From the Evolution of Package Types to Manufacturing Processes, Equipment and Materials Used, and Latest Trends ~" This is an introductory seminar where you can systematically learn about semiconductor packaging technology from the basics to advanced techniques. It provides a clear explanation of the role of packaging technology that supports the high performance of semiconductors, its background of evolution, manufacturing processes, and materials and equipment technologies. In addition to the characteristics of various package types such as DIP, QFP, BGA, and WLCSP, it also details major manufacturing technologies like back grinding, dicing, die bonding, wire bonding, and molding. Furthermore, you will learn about the trends and future prospects of the latest technologies such as SiP, FOWLP, CoWoS, EMIB, chiplets, and optoelectronic integrated packaging. This content is ideal for semiconductor engineers as well as sales and marketing personnel who want to understand packaging technology from the ground up.
The GS8 series is a high-speed, large-capacity synchronous SRAM that can be supplied for a long term.
- Memory
The SigmaDDR series is a high-speed DDR II SRAM that is fully compatible with products from other companies such as Cypress.
- Memory
The LL DRAM II has finally arrived from SRAM manufacturer GSI Technology.
- Memory
Aluminum extruded heat sink with dimensions of 27.95 mm wide x 15.24 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 12.5 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 8 mm - available in various lengths.
- Other semiconductors
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
Aluminum extruded heat sink with dimensions 27 mm wide x 22 mm high - available in various lengths.
- Other semiconductors
New BGA 24-pin is here! Non-volatile memory that achieves high-speed writing and long-term retention! Numerous achievements in industrial equipment such as rotary encoders with non-volatile, low power...
- Memory
- Memory
Clip-type rail mount that allows for quick attachment of heat sinks, cases, etc. to DIN rails compliant with TS35 standards.
- Other semiconductors
Aluminum clip for fixing heat sink and aluminum case to DIN rail.
- Other semiconductors
We offer silicon wafers such as particle management wafers and dummy mirror wafers!
- Wafer
- Other semiconductors
We continue to supply many electronic materials, starting with semiconductors.
- Other semiconductors
It is a product that is strong against avalanches.
- Electron tube
- power supply
- Transistor
The arrival of the small and thin package DFN56.
- Electron tube
- power supply
- Transistor