List of Technical and Reference Books products
- classification：Technical and Reference Books
46～90 item / All 1735 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
We publish technical materials on reliability assessment, safety evaluation, failure analysis, and analysis!
- Technical and Reference Books
- Other contract services
Announcement of the publication of the "Electronic Components Failure Analysis and Reliability Evaluation Service Catalog."
We have newly published the "Electronic Components Failure Analysis and Reliability Evaluation Service Catalog." This catalog introduces service menus that assist in investigating the causes of failures and evaluating the reliability of printed circuit boards, connectors, cables, and passive components. Additionally, it includes testing methods for failure analysis and reliability evaluation, as well as actual analysis and evaluation case studies. One of the featured case studies is the hammering micro-vibration test. This test evaluates the risk of contact failure in connectors by reproducing wear caused by minute sliding of the contacts, allowing for the capture of changes in contact resistance and momentary disconnections. The catalog includes comparative evaluation case studies of vibration tests and micro-vibration tests on the same materials, enabling you to see the differences in results obtained from each test. In addition, we have published various tests along with their evaluation and analysis case studies. We encourage you to utilize this catalog when considering outsourcing investigations of electronic component failures or reliability evaluations. We also welcome inquiries regarding evaluations and analyses, so please feel free to contact us.
![[Book] CO2 Separation, Recovery Tec...](https://image.mono.ipros.com/public/product/image/342077/IPROS7749691591516391802.jpg?w=280&h=280){kind=small}
"Available for preview" ~ Expansion into DAC, CCUS, fuels, and chemicals ~
- Technical and Reference Books
[Book] CO2 Separation, Capture Technology and Process Design, Effective Utilization Technology (No. 2376) [Available for Preview]
~Expansion into DAC, CCUS, Fuels, and Chemicals~ ◎ A thorough explanation of high-efficiency, energy-saving CO2 capture technologies using absorption methods, membrane separation methods, and adsorption methods! ◎ How can we achieve low-energy, low-cost CO2 capture processes? An explanation of design and evaluation case studies! ◎ Detailed insights into the latest trends in CO2 conversion technologies such as e-fuels, methanation, and chemical synthesis! ------------------------------ ■ Table of Contents Chapter 1: Separation and Recovery Technologies for CO2 Using Absorption Methods Chapter 2: Separation and Recovery Technologies Utilizing CO2 Membrane Separation Methods Chapter 3: Separation and Recovery Technologies Utilizing CO2 Physical Adsorption Methods Chapter 4: Trends in DAC and DACCS Chapter 5: Synthesis and Manufacturing Technologies for Fuels Utilizing CO2 Chapter 6: Synthesis Technologies for Useful Chemicals Utilizing CO2 and Effective Utilization Technologies Chapter 7: CO2 Separation and Recovery Processes and Their Application Cases, Demonstration Experiments ------------------------------ ● Publication Date: September 30, 2026 ● Format: A4, 389 pages ● Authors: 46 individuals ● ISBN: 978-4-86798-166-5 ------------------------------
![[Book] Utilizing AI for Exploring N...](https://image.mono.ipros.com/public/product/image/342077/IPROS6452675495331564511.gif?w=280&h=280){kind=small}
"Available for preview" ☆ From market exploration to hypothesis generation, new application discovery, material improvement, and business proposal, all in one go!
- Technical and Reference Books
How to establish a quality culture in the pharmaceutical manufacturing site?
- Technical and Reference Books
- Technical and Reference Books
Master the basics of machine safety to the latest technology with this one book! An essential safety guide for designers and field professionals alike.
- Technical and Reference Books
The robot itself accounts for 30% of the total. What is the reason for the estimate of labor reduction being higher than expected?
- Technical and Reference Books
We will organize the question of "which part of the site is the target," which is difficult for document experts to answer, from the perspective of engineers.
- Technical and Reference Books
It's okay to switch from daily handwritten temperature records to automatic recording.
- Technical and Reference Books
An integrated strategy that governs the physical constraints of AI infrastructure!
- Technical and Reference Books
Understanding industrial reorganization and profit structure through Control Point and Control Plane!
- Technical and Reference Books
- Other medical supplies and cosmetic manufacturing materials
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
[Exhibition at Nepcon Japan 2026] CoaXPress camera that does not require a fan or heat sink. With a low heat generation design, you no longer have to worry about heat management.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
No need for heat sinks or cooling fans! Contributes to space-saving in monitoring systems.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
No need for heat sinks or cooling fans! Contributes to space-saving in signal systems.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
We exhibited at NEPCON Japan 2026 (digest version materials available).
◇◆We exhibited at the 40th InterNepcon Japan◆◇ ーーーーーーーーーーーーーーーーーーーーーーーーーー Thank you for your continued support. This is Japan Bopixel. The "40th InterNepcon Japan," held from January 21 to 23, recently concluded successfully. We sincerely thank everyone who visited us. 【Highlights of this exhibition】 - 105MP/245MP ultra-high-resolution sensor-equipped CoaXPress area scan cameras - 10MP/14MP/21M ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras ▼ You can download the PDF materials of the new products introduced at the exhibition from the "Related Materials" section at the bottom of this page. Related Materials > Exhibition Digest_Japan Bopixel.pdf We also welcome requests for individual explanations! Please feel free to contact us. Japan Bopixel Corporation, Sales Department
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Technical Documentation Collection for Electrode Plate Manufacturing
- Technical and Reference Books
Updated version of the two-year data report on positive reviews (re-evaluating the impact of the COVID-19 pandemic)
- Technical and Reference Books
Chemical materials and process technologies such as binders in the manufacturing process of electrode plates.
- Technical and Reference Books
The latest version with a significant update on the impact of COVID-19 and future outlook.
- Technical and Reference Books
A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!
- Technical and Reference Books
- Other semiconductors
- Technical and Reference Books
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
![[Book] Hydrogen Production and Its ...](https://image.mono.ipros.com/public/product/image/536/2000743760/IPROS81235308075844465306.jpeg?w=280&h=280){kind=small}
[Available for preview] ★ Latest examples of catalyst, cell, and equipment development aimed at improving efficiency and reducing costs in green hydrogen production!
- others
- Technical and Reference Books
- Technical and Reference Books
[Book] Hydrogen Production and Its Transportation, Storage, and Utilization Technologies (No. 2172) [Available for Preview]
★ Latest examples of catalyst, cell, and equipment development aimed at improving the efficiency and reducing the cost of green hydrogen production! ★ Business opportunities arising from the establishment of large-scale supply chains and the utilization of hydrogen! －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Research and Development Trends and Policy Directions Toward a Hydrogen Society Chapter 2: Hydrogen Production Technologies and Their Equipment and Material Technologies Chapter 3: Hydrogen Transportation, Storage Technologies, and Supply Chain Development Chapter 4: Design and Measurement Technologies for Hydrogen Storage Tanks and Piping Chapter 5: Initiatives for Hydrogen Utilization and Their Future Outlook －－－－－－－－－－－－－－－－－－－－－ ● Published: September 30, 2022 ● Format: A4, 603 pages ● Authors: 59 individuals ● ISBN: 978-4-86104-899-9 －－－－－－－－－－－－－－－－－－－－－
Clearly introduces the limitations of liquid systems and the challenges of all-solid systems through abundant charts and point explanations based on mechanism of action and model calculations.
- Technical and Reference Books
Providing "seeds" of inspiration for readers as a collection of "x/z EV business materials."
- Technical and Reference Books
Explaining the essential thermal management for improving performance, energy efficiency, comfort, and safety.
- Technical and Reference Books
Explanation of requirement characteristics, issues, and countermeasure technologies from the basics to the latest trends.
- Technical and Reference Books
Latest Trends in Wet/Dry Etching and Post-Etching Technologies
- Technical and Reference Books
Published 10 years after the preface "Membrane Separation Technology in Energy and Chemical Processes."
- Technical and Reference Books
An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!
- Technical and Reference Books
- Other semiconductors
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
Reconstructing the value chain through the lens of employment conditions, environmental regulations, and certifications!
- Technical and Reference Books
Cooling, water treatment, location, Digital Twin, and market outlook for 2035 in the era of water constraints!
- Technical and Reference Books
High-end tools for efficient modeling preparation
- Technical and Reference Books
We will exhibit at TCT Japan 2026.
We will be exhibiting at TCT Japan 2026, which will be held at Tokyo Big Sight from January 28, 2026 (Wednesday). We will introduce EOS metal and resin 3D printers and the 3D printers from AMCM, which is responsible for customizing EOS devices. Exhibition: TCT Japan 2026 Location: Tokyo Big Sight, South Hall 3 Organizer: JTB Communication Design, Inc. Rapid News Publications Ltd. Date: January 28 (Wednesday) to January 30 (Friday), 2026 10:00 AM to 5:00 PM Booth Number: South Hall 3S-L06 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
An explanation of the basic knowledge of photoresist essential for high-precision printing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of pattern formation for the light-emitting layer in LED manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresists useful for microchannel formation.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist useful for surface processing of optical lenses.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of photoresist essential for microstructure processing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Fundamental knowledge of photoresists essential for high-precision component manufacturing in the aerospace field.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
I will explain the basic knowledge of the printing process in an easy-to-understand manner.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist essential for electrode formation in solar cells.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for the manufacturing of liquid crystal displays.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of electrodeposition coating contributing to weight reduction and strength improvement in the aerospace field.
- Coating Agent
- Technical and Reference Books