List of Other semiconductors products

  • classification:Other semiconductors

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

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  • Other conveying machines

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No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.

  • Other Pumps

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Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!

We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"

Compatible Logic IC solutions for industrial equipment supporting 74HC, 74HCT, and 74LVC!

  • Other semiconductors

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Introduction to MKP Company! We possess unique patent technology that facilitates the smooth mass production of MFC.

  • Other semiconductors
  • controller

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For industrial equipment, power supplies, and batteries. Supporting the selection and replacement of low on-resistance, high-efficiency, and high-reliability MOSFETs.

  • Other semiconductors

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This is a special industrial OPP film with a formulation of additives that is controlled as much as possible. It can be used as a release film in the electronics and optics fields without coating a re...

  • Other optical parts
  • Other semiconductors

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Reproduction is possible even without design data. 'Discontinued LSI Reproduction Service' that does not stop mass production and maintenance.

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  • Other semiconductors
  • EMS
  • Dedicated IC

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Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.

  • Technical Seminar
  • Other semiconductor manufacturing equipment
  • Other semiconductors

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Adopts a body with embedded electrostatic discharge prevention material, an ESD-compatible laser barcode scanner capable of continuous high-speed reading.

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  • Printed Circuit Board
  • Other semiconductors
  • Other clean room equipment and facilities

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HFE from Halocarbon is a fluorinated solvent with a low global warming potential (GWP) and an ozone depletion potential (ODP) of zero.

  • Electronic Components
  • Other semiconductors

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A systematic explanation of silicon, silane, silicone, and silica. Learn broadly from everyday applications to the semiconductor and optical fields.

  • Ceramics
  • Fine Ceramics
  • Other semiconductors

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A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

  • Technical and Reference Books
  • Other semiconductors
  • Technical and Reference Books

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20261105 半導体パッケージの基礎と品質管理および最新動向.png

11/5 Webinar: Basics of Semiconductor Packaging and Quality Control

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors

Producing fluorine specialty products on various scales! Supporting customers from initial development.

  • Lubricants
  • Other semiconductors
  • Chemicals

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No need for contact with the reader, making it less prone to damage! Introduction to non-contact IC cards.

  • Other production management systems
  • Entrance and exit control system
  • Other semiconductors

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A practical market research report systematically organized around thermal management, focusing on structural changes in the AI infrastructure market, competitive strategies of major companies, market...

  • Server Cooler
  • server
  • Other semiconductors

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20261022 生成AI時代に生き残るための思考力:「C3思考法 ~ 創造的・批判的思考法からプレゼン技法まで ~」.png

10/22 Webinar "C3 Thinking in the Era of Generative AI"

**Title: "Thinking Skills to Survive in the Era of Generative AI: 'C3 Thinking Method - From Creative and Critical Thinking to Presentation Techniques'"** --- To survive in the era of generative AI and create new value, we explain the necessary thinking skills through the "C3 Thinking Method," which consists of "Creative," "Critical," and "Communicative." Participants will learn practically through exercises, covering methods for idea generation using generative AI, ways to critically evaluate AI output, and techniques for effectively communicating thought results through verbalization, visualization, and presentation skills. **Knowledge Gained from the Seminar:** - Basic thinking skills required in the generative AI era and the C3 Thinking Method - Methods to expand ideas and concepts using generative AI - Key points for critically evaluating the output of generative AI - Ways to appropriately and effectively communicate thought results to others - Skills in verbalization, visual thinking, and presentation techniques **Target Audience for the Seminar:** - Individuals involved in "thinking jobs" such as corporate planning and business planning - Those responsible for human resource education and training - Individuals who want to utilize generative AI in their work - Those who wish to systematically learn the thinking skills needed in the AI era

An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!

  • Technical and Reference Books
  • Other semiconductors

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20261105 半導体パッケージの基礎と品質管理および最新動向.png

11/5 Webinar: Basics of Semiconductor Packaging and Quality Control

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors

Reproduction is possible even without design data. 'Discontinued LSI Reproduction Service' that does not stop mass production and maintenance.

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  • スライド9.PNG
  • スライド10.PNG
  • Other semiconductors
  • EMS
  • Dedicated IC

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Difficult-to-dissolve substances can also be cleaned with peeling and dissolving actions! A water-based cleaning agent that balances cleaning performance and safety.

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  • Cleaning agents
  • Other semiconductors
  • Printed Circuit Board

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A page for "flux cleaner" has been added.

We have added a page for "Flux Cleaning Agent." This product selectively removes flux residues and is a water-based cleaning agent that supports the quality and reliability of electronic devices. Conventional solvent-based cleaning agents primarily rely on dissolving action to remove flux residues, but this product simultaneously exhibits both peeling and dissolving actions through its unique cleaning technology. 【Features】 ■ High cleaning performance due to unique cleaning technology ■ Removal of oxide films and prevention of re-oxidation during cleaning ■ Increased bonding strength through cleaning ■ High safety due to being a water-based cleaning agent

Achieving stable operation even in harsh industrial environments with accurate inspection and high-speed detection!

  • Dedicated IC
  • Other semiconductors

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Achieving high-quality clocks for high-speed communication, optical communication, and data centers with ultra-low phase jitter at the femtosecond level.

  • Dedicated IC
  • Other semiconductors

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Adopts a conductive material blended body, Bluetooth-connected wireless laser barcode scanner with ESD-compatible body.

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  • Handheld barcode reader
  • Other electronic parts
  • Other semiconductors

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Adopts a body with embedded electrostatic discharge prevention material, ESD-compatible two-dimensional barcode scanner capable of reading QR codes.

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  • s_MS851 ESD-3.jpg
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  • Printed Circuit Board
  • Other semiconductors
  • Other clean room equipment and facilities

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A systematic explanation of the manufacturing process of semiconductor ICs, from the front-end and back-end processes to assembly, including the roles and necessity of the materials used in each stage...

  • Other semiconductors
  • Other semiconductor manufacturing equipment
  • Technical Seminar

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Achieving efficiency and quality improvement through the reuse of verification components! Introducing insights on building a UVM environment.

  • Other semiconductors

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Achieving high performance with a diameter of just 19mm! Introducing the structure laser diode.

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  • Other semiconductors

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We provide valuable LSI, which is the source of our customers' business, at the highest level of cost performance.

  • ASIC
  • Dedicated IC
  • Other semiconductors

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Systematically explain the latest trends such as chiplets and 3D packaging, the basics of epoxy resins, the design and evaluation of encapsulants, and next-generation materials!

  • Other semiconductors
  • Other polymer materials
  • Technical Seminar

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Responding to the rapidly increasing amount of information in AI and video! An explanation from the basics of high-speed information transmission to optoelectronic integration implementation, semicond...

  • Other semiconductors
  • Communications
  • Other optical parts

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Selection of coprocessors compatible with advanced CMOS sensors!

  • Dedicated IC
  • Other semiconductors

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The depths of material innovation driving generative AI, data centers, and physical AI!

  • Technical and Reference Books
  • Other semiconductors

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20261105 半導体パッケージの基礎と品質管理および最新動向.png

11/5 Webinar: Basics of Semiconductor Packaging and Quality Control

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors

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