List of Other semiconductors products
- classification：Other semiconductors
316～360 item / All 2599 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
![[For Power Modules] Axial Flow Fan ...](https://image.mono.ipros.com/public/product/image/2049780/IPROS11447802576667341115.jpg?w=280&h=280){kind=small}
Efficient heat dissipation is possible with a W259mm x H121mm hollow-type heat sink, axial fan, and airflow chamber.
- Other semiconductors
![[For Power Module] Axial Fan Heat S...](https://image.mono.ipros.com/public/product/image/2049780/IPROS5639149101619974518.jpg?w=280&h=280){kind=small}
Lengths are available in 100, 150, 200, 250, and 300mm, and fan types can be selected from DC24V and AC230V.
- Other semiconductors
Ultra-hard alloy pins and shafts optimal for spindles that achieve micron precision.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Introducing guide pins manufactured with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Ultra-hard alloy rings for bearings that achieve micron-level precision.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Supporting semiconductor manufacturing with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Support for improving connector quality with micron to sub-micron precision grinding technology!
- Other Auto Parts
- Other semiconductors
- Processing Jig
Micron to submicron precision! Contributing to the miniaturization and high performance of medical devices.
- Other Auto Parts
- Other semiconductors
- Processing Jig
Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.
- Other semiconductors
Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
Chemical reactions caused by dilute gases can also be considered!
- CVD Equipment
- Wafer
- Other semiconductors
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
April 10 Webinar: Comprehensive Explanation of Basic Information on Semiconductor Packaging Technology
A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. A leading expert thoroughly organizes practical perspectives from WLP/PLP to high thermal conductivity materials. ■ Title: Basic Information on Semiconductor Packaging Technology: Comprehensive Explanation ■ Date and Time: April 10, 2026 (Friday) 10:30 AM - 4:30 PM ■ Target Audience for the Seminar - Individuals involved in semiconductor packaging (sales, technology) - Those interested in semiconductor packaging technology - Those interested in semiconductor resin encapsulation and encapsulation materials ■ Knowledge Gained from the Seminar - Development history of semiconductor packaging (PKG) - Development history of semiconductor packaging technology (methods, materials) - Specifications of semiconductor encapsulation materials (raw materials, composition, manufacturing equipment, evaluation methods, etc.)
Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)
- Other semiconductors
1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.
- Other metal materials
- Other semiconductors
Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.
- Other semiconductors
- stainless
In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.
- Other semiconductors
- aluminum
Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.
- Other semiconductors
- Other metal materials
You can arrange and secure four transistors to the heat sink.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
High-performance heat sink suitable for forced air cooling (rivet type) W300mm x H83.5mm
- Other semiconductors
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)
- Other semiconductors
Bending processing tailored to usage is also available! It is also possible to combine various functional materials for punching processing.
- Other semiconductors
- Processing Contract
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W165mm x H84mm
- Other semiconductors
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Aluminum heat sink for mounting on a board, capable of securing a transistor with a clip, measuring 35 mm wide x 30 mm high.
- Other semiconductors
Aluminum heat sink for mounting on a circuit board, capable of securing a transistor with a clip, dimensions 46 mm wide x 33 mm high.
- Other semiconductors