List of For Techies products
- classification：For Techies
676～720 item / All 4729 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
No more need to lift heavy one-gallon cans! Enjoy comfortable liquid transfer in the central kitchen.
- Other Pumps
Decision to exhibit at the 1st Chubu Food Industry Creation Exhibition '26!
We will be exhibiting at the "1st Chubu Food Industry Creation Exhibition '26" to be held at Port Messe Nagoya from November 4 (Wednesday) to November 6 (Friday), 2026. As a new addition to our lineup, we will showcase the "Cordless Sanitary Handy Pump," which is a product we started selling in April last year, alongside our "Compact Sanitary Handy Pump Model MHS." - Cordless! Portable anywhere! Easy to use! Simple cleaning! It is compatible with standard 18L cans and BIB (Bag-in-Box) and features a structure that allows for easy disassembly and cleaning. We would like to invite you to visit us at this opportunity. - Venue: Port Messe Nagoya - Our exhibition booth: Hall 1 "C-66"
Published 10 years after the preface "Membrane Separation Technology in Energy and Chemical Processes."
- Technical and Reference Books
An easy-to-understand explanation of the latest trends in PFAS regulations, which are being strengthened globally!
- Technical and Reference Books
- Other semiconductors
11/5 Webinar: Basics of Semiconductor Packaging and Quality Control
■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelationship between materials, equipment, and packaging technology - Young engineers involved in packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Those who wish to systematically acquire knowledge related to semiconductors
Reconstructing the value chain through the lens of employment conditions, environmental regulations, and certifications!
- Technical and Reference Books
Cooling, water treatment, location, Digital Twin, and market outlook for 2035 in the era of water constraints!
- Technical and Reference Books
![[Seminar] Understanding the Require...](https://image.mono.ipros.com/public/product/image/251391/IPROS2443264465005456492.PNG?w=280&h=280){kind=small}
On December 7, leading experts from Germany will thoroughly explain the main changes from the old machinery directive and specific measures for cybersecurity requirements.
- Technical Seminar
[Seminar/Training] [Latest Trends] Understanding the Requirements of the EU Machinery Regulation (2023/1230) and Cybersecurity Practical Compliance Guide
The EU Machinery Regulation (EU Machinery Regulation 2023/1230) is a comprehensive legal framework aimed at ensuring the safety, reliability, and compliance of machinery placed on the EU market. Established in June 2023, it will fully apply from January 20, 2027, as a new regulation replacing the previous EU Machinery Directive (2006/42/EC). This seminar will clearly explain important topics faced in practice, including key amendments in the new regulation, digitalization and cybersecurity (such as Annex III 1.1.9), and safety requirements for AI and autonomous systems. < Seminar Topics > - Part 1: Overview of the EU Machinery Regulation (2023/1230) and key changes from the old directive (2006/42/EC) - Part 2: Safety requirements and responses to cybersecurity and new technologies - Part 3: Practical aspects of conformity assessment procedures and technical documentation (TCF) - Part 4: Practical roadmap and case studies for entering the European market
![[Seminar] IATF 16949 Internal and S...](https://image.mono.ipros.com/public/product/image/251391/IPROS14383599808342287714.PNG?w=280&h=280){kind=small}
Recommended seminar for those considering skill enhancement and competency maintenance for IATF 16949:2016 internal auditors and second-party auditors, held on December 1st.
- Technical Seminar
IATF 16949 Rules 6th Edition Certification Structure Optimization Seminar - Changes in IATF Rules 6 That You Will Regret Not Knowing
With the issuance of the IATF Rules 6th Edition, the concepts regarding multi-site certification, corporate schemes, remote support locations (RSL), and extended sites have been reviewed. These changes are not merely rule modifications; they have the potential to reduce audit man-hours and certification maintenance costs by optimizing the certification structure. On the other hand, many companies continue to maintain their traditional certification structures and are not fully utilizing the benefits of the rule changes. In this seminar, we will explain how to streamline the certification structure by utilizing the new concepts recognized in the Rules 6th Edition, including: - Utilizing extended sites - Optimizing remote support locations - Reviewing corporate schemes (redesigning multi-site configurations) We will provide examples to illustrate these points. This seminar is recommended for: - Automotive industry suppliers with multiple factories - Organizations that have multiple registered sales offices, etc. - Those considering a review of certification maintenance costs and audit man-hours - Individuals who want to understand the changes in the Rules 6th Edition from a practical perspective.
![[Seminar] JC-STAR Level 1 Applicati...](https://image.mono.ipros.com/public/product/image/251391/IPROS14948709653097941850.PNG?w=280&h=280){kind=small}
Seminar on systematically learning the structure, technical requirements, and evaluation methods of JC-STAR held on November 18.
- Technical Seminar
[Seminar/Training] Security Labeling System (JC-STAR) Level 1 (★1) Application Practice Seminar
With the spread of IoT products and the increasing security risks, Japan has launched the IoT product security labeling system "JC-STAR," operated by the IPA. This seminar will clearly explain the overview of JC-STAR in harmony with international standards, the application procedures for obtaining ★1, and key points regarding technical requirements and evaluation methods. TÜV SÜD Japan, a registered organization certified by the Ministry of Internal Affairs and Communications and a JC-STAR verification provider, will provide useful knowledge from application preparation to acquisition based on its experience in third-party evaluations. <Seminar Topics> - Overview and objectives of the JC-STAR system - Steps and necessary documents from application to label issuance - Details of technical requirements and the underlying concepts - Specific processes and key points of the evaluation method - Common application mistakes and how to avoid them
![[Technical Seminar] Identifying and...](https://image.mono.ipros.com/public/product/image/2008760/IPROS1736491160973720006.png?w=280&h=280){kind=small}
Transforming 'good research seeds' into projects that can be adopted by pharmaceutical companies.
- Technical Seminar
From microwave ovens to high-temperature heating furnaces! A thorough explanation of the basics and applications of microwave heating, equipment design, problem-solving, and chemical reactions.
- Heating device
- Microwave Reactor
- Technical Seminar
Responsible care materials for everyone working at the forefront of manufacturing.
- Distance learning/E-learning
Responsible care materials for everyone working at the forefront of manufacturing.
- Distance learning/E-learning
![[Online] Toyota Method for Problem ...](https://image.mono.ipros.com/public/product/image/2008454/IPROS4520277202503850055.png?w=280&h=280){kind=small}
Recommended for those who want to promote problem-solving activities in all manufacturing sectors and levels!
- Technical Seminar
![[Online Seminar] The Concept of 5S ...](https://image.mono.ipros.com/public/product/image/2008454/IPROS1224618979630665881.jpg?w=280&h=280){kind=small}
This is a seminar to acquire "real 5S," which is directly linked to the establishment of 5S activities. It is especially recommended for site leaders who are struggling with the implementation of 5S o...
- Technical Seminar
![[Technical Seminar] Practical Train...](https://image.mono.ipros.com/public/product/image/2008760/IPROS9816112047588589345.png?w=280&h=280){kind=small}
Learn the creation procedures, utilization methods, and review points based on the control plan manual through case studies and exercises.
- Technical Seminar
![[Technical Seminar] Utilizing Gener...](https://image.mono.ipros.com/public/product/image/2008760/IPROS6815112994040652103.png?w=280&h=280){kind=small}
Learn the process through demonstrations! An explanation of the processes handled by AI and the judgment criteria taken on by humans.
- Technical Seminar
![[Technical Seminar] Practical Cours...](https://image.mono.ipros.com/public/product/image/2008760/IPROS12788557517042430077.png?w=280&h=280){kind=small}
Learning from Virtual Cases: How to Build Proposal Stories that Move Other Departments
- Technical Seminar
High-end tools for efficient modeling preparation
- Technical and Reference Books
We will exhibit at TCT Japan 2026.
We will be exhibiting at TCT Japan 2026, which will be held at Tokyo Big Sight from January 28, 2026 (Wednesday). We will introduce EOS metal and resin 3D printers and the 3D printers from AMCM, which is responsible for customizing EOS devices. Exhibition: TCT Japan 2026 Location: Tokyo Big Sight, South Hall 3 Organizer: JTB Communication Design, Inc. Rapid News Publications Ltd. Date: January 28 (Wednesday) to January 30 (Friday), 2026 10:00 AM to 5:00 PM Booth Number: South Hall 3S-L06 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/
Explains the basics of microwave heating to engineering applications. Learn about the principles of rapid, internal, and selective heating, thermal runaway, temperature distribution control, and heati...
- Heating device
- High frequency/microwave parts
- Technical Seminar
An explanation of the basic knowledge of photoresist essential for high-precision printing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of pattern formation for the light-emitting layer in LED manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresists useful for microchannel formation.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist useful for surface processing of optical lenses.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Explaining the basic knowledge of photoresist essential for microstructure processing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Fundamental knowledge of photoresists essential for high-precision component manufacturing in the aerospace field.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
I will explain the basic knowledge of the printing process in an easy-to-understand manner.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of photoresist essential for electrode formation in solar cells.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for semiconductor manufacturing.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
An explanation of the basic knowledge of photoresist, which is essential for the manufacturing of liquid crystal displays.
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Basic knowledge of electrodeposition coating contributing to weight reduction and strength improvement in the aerospace field.
- Coating Agent
- Technical and Reference Books
High accuracy in discrimination is the key! Added registration of resin types to the sensor enables efficient material discrimination for "recycling-specific substrates." *Free webinar available.
- Technical Seminar
From e-learning that supports employee skill development to personnel evaluations and internal communication! Providing a centralized solution for the functions necessary for organizational management...
- Distance learning/E-learning
- Distance learning/E-learning
- Other information systems
![[Technical Seminar] IATF 16949 Core...](https://image.mono.ipros.com/public/product/image/2008760/IPROS6188347336530772265.png?w=280&h=280){kind=small}
Learn the creation procedures and utilization points of D-FMEA/P-FMEA based on AIAG & VDA FMEA through case studies and exercises.
- Technical Seminar
![[Technical Seminar] ISO 9001/14001 ...](https://image.mono.ipros.com/public/product/image/2008760/IPROS9821100887902233393.png?w=280&h=280){kind=small}
Creating a system based on the comparison of differences before and after the revision, as well as the organization of documents and understanding of ISO operations.
- Technical Seminar
![[Book] Development of Junction Tech...](https://image.mono.ipros.com/public/product/image/342077/IPROS6087329246979178772.gif?w=280&h=280){kind=small}
[Available for preview] ~ Surface activated bonding, hybrid bonding, Ag·Cu sintering bonding, conductive adhesive ~
- Technical and Reference Books
[Book] How to Utilize AI Agents for Exploring New Business Themes and Generating Ideas (No. 2374) [Available for Preview]
☆From market exploration to hypothesis generation, new application exploration, material improvement, and business proposal, all in one go! ☆What is the method that takes on the vast amount of information collection, organization, and structuring, dramatically enhancing exploration capability and speed! －－－－－－－－－－－－－－－－－－－－－ ■Key Points of This Book From "AI that generates answers" to "AI that performs tasks" Information collection, idea generation, theme exploration, R&D operations Construction, internal and external data collaboration Legal issues, ethical concerns －－－－－－－－－－－－－－－－－－－－－ ■Table of Contents Chapter 1: Mechanisms and Features Chapter 2: Addressing Legal Issues and Ethical Concerns Chapter 3: Building AI Agents and Introducing Them to Research and Development Chapter 4: Performance Evaluation and Internal/External Data Collaboration Chapter 5: Approaches to Information Collection and Analysis Chapter 6: Idea Generation and New Business Theme Exploration Chapter 7: Introduction and Case Studies of AI Agents in R&D Operations －－－－－－－－－－－－－－－－－－－－－ ●Publication Date: September 30, 2026 ●Format: A4, 510 pages ●Authors: 48 ●ISBN: 978-4-86798-165-8 －－－－－－－－－－－－－－－－－－－－－
Explaining the technical challenges for social implementation from 3D cell printing of marbled cultured meat to automatic production systems, quality evaluation, regulations, and commercialization.
- Food Processing Equipment
- Bioinformatics
- Technical Seminar