List of Printed Circuit Board products
- classification:Printed Circuit Board
991~1035 item / All 2038 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
● Aluminum substrates have a proven track record in automotive products and LED lighting fixtures. We also accommodate small quantities and a variety of products. ● Thick copper substrates are being d...
- Printed Circuit Board
- Circuit board design and manufacturing
Gravure roll technology essential for the production of microdevices adopted by major companies.
- Printed Circuit Board
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.
- Printed Circuit Board
- Circuit board design and manufacturing
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section. By pre-installing and securing with screws, labor reduction becomes possible!
- Printed Circuit Board
- Circuit board design and manufacturing
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.
- Printed Circuit Board
- Circuit board design and manufacturing
By converting the busbar into a circuit board, high insulation and compactness are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
By converting the busbar into a circuit board, high insulation and compactness are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
By converting the busbar into a substrate, high insulation and miniaturization are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
By integrating the busbar into a circuit board, high insulation properties and miniaturization are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.
- Printed Circuit Board
- Circuit board design and manufacturing
Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.
- Printed Circuit Board
- Circuit board design and manufacturing
4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.
- Printed Circuit Board
- Circuit board design and manufacturing
Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!
- Printed Circuit Board
- Circuit board design and manufacturing
- Paper and pulp products
[Materials Available] We will solve your problems! Introduction of printed circuit board prototyping service examples!
- Printed Circuit Board
[Essential for Development Managers!] If you have a limited budget, want to quickly create a prototype, or have many constraints regarding circuit board prototyping, please feel free to consult with u...
- Printed Circuit Board
For development prototype personnel! You can prototype with just one single-sided flexible circuit board starting at a low cost of only 34,800 yen!
- Printed Circuit Board
Production is possible at suitable factories both in Japan and overseas, according to your requests! PCB assembly service.
- Printed Circuit Board
It is also possible to replace parts due to loading errors! We also support circuit board repairs from scratch.
- Printed Circuit Board
Low-cost PCB prototyping! Small lot of one-sided aluminum board prototyping starts at 19,800 yen, including initial costs and shipping. Free samples available.
- Printed Circuit Board
We contribute to miniaturization of products through 3D implementation technologies such as PoP (Package on Package) implementation.
- Printed Circuit Board
3D implementation contributes to miniaturization and high density.
PoP technology is adopted in products that require miniaturization and high density, such as smartphones and digital still cameras, and our company has achieved a cumulative production record of over 100 million units to date. In addition to PoP, we also possess technology for stacking substrates to accommodate product miniaturization. 【Features】 ■ By stacking two semiconductor packages, it is possible to reduce the footprint on the substrate. ■ By using wiring between the upper and lower packages, we can shorten the wiring length compared to wiring on the substrate, enabling high-speed wiring. ■ By using tested packages that are quality assured, we can reduce the failure rate compared to SiP. ■ In addition to PoP, we can also accommodate substrate stacking.
Turnkey connector implemented! A thin polymer resin film is used as insulation.
- Board to Board Connectors
- Printed Circuit Board
High-reflective solder resist achieving high brightness and high heat dissipation, reflector processing technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.
- Printed Circuit Board
As an introduction to the basics of printed circuit boards, I will introduce the manufacturing flow of a 4-layer printed circuit board.
- Printed Circuit Board
Here are some frequently asked questions (FAQ) related to production and technology of printed circuit boards.
- Printed Circuit Board
Introducing circuit formation technology! A method to improve the positional accuracy of patterns on both sides.
- Printed Circuit Board
Introducing bonding gold plating technology! Providing reliable and stable COB.
- Printed Circuit Board
Introducing bonding silver plating technology! Electroless silver plating is possible.
- Printed Circuit Board
Introducing technology to prevent resin leakage! It is possible to prevent resin from leaking.
- Printed Circuit Board
Introducing technology for improving shape accuracy! High-precision shape processing tailored to patterns is possible.
- Printed Circuit Board
Introducing the boring technique! It is possible to perform boring to lower the height of the LSI.
- Printed Circuit Board
Introducing technology for improving V-cut position accuracy! High-precision V-cut method using CCD.
- Printed Circuit Board
Introducing high-frequency technology! We provide substrates that match the impedance of mounted components and the circuit board.
- Printed Circuit Board
Introducing LED brightness enhancement technology! It enables improved reflectivity and reduced junction temperature.
- Printed Circuit Board
Introducing heat dissipation technology! Heat dissipation is possible through pattern design, selection of heat dissipation materials, and setting conductor thickness.
- Printed Circuit Board
Introducing miniaturization technology! Miniaturization with integrated rigid flex printed circuit boards.
- Printed Circuit Board
Introducing the implementation technology of printed circuit boards! Measures against poor solder wetting during assembly.
- Printed Circuit Board
Introducing magnetic reduction technology for printed circuit boards! A method to reduce magnetism using flash gold plating.
- Printed Circuit Board
Introducing dust prevention technology for printed circuit boards! There are mass production results for optical systems thanks to dust collection technology.
- Printed Circuit Board
Flexible substrates have a track record of designs ranging from single-sided to multi-layer! They support both single-sided and double-sided configurations.
- Printed Circuit Board
- Other contract services