List of Other electronic parts products
- classification：Other electronic parts
766～810 item / All 8039 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
We introduce the features of Cu wire bonding and the selection of cross-section preparation methods!
- Wiring materials
- Other electronic parts
It is an EMI/RFI shielded product with a variety of cross-sectional shapes through extrusion molding!
- Other electronic parts
This is a grounding reinforcement and EMI countermeasure product made from a flexible sponge substrate, coated with a reinforced aluminum foil on the surface!
- Other electronic parts
It is a high-speed ECU interface that efficiently communicates with the ECU via the microprocessor's DAP interface.
- Other electronic parts
- Other network tools
- Microcomputer
The ultimate solution for current, voltage, and temperature measurement under high voltage, with galvanic isolation for all measurement channels up to 1,500V, high precision, and wide range measuremen...
- Other electronic parts
This is an introduction to examples of electronic component processing used in home appliances and mobile phones.
- Other electronic parts
Moldless lost-wax casting "Digital Cast" and metal 3D printing "Digital Sinter," what is the optimal solution for your needs?
- Machine elements
- Other electronic parts
- gear
Industrial precision multi-directional joystick controller using precision potentiometers.
- Other electronic parts
This is a MEMS microphone manufactured by Zilltek Technology in Taiwan.
- Other electronic parts
It was made for cleaning commercial barbecue grills.
- Other electronic parts
- Chemicals
Structural analysis of Adesto RM24EP128KS CBRAM
- Other electronic parts
Panasonic ReRAM-equipped MN101LR05D 8-bit microcontroller
- Other electronic parts
Disassembly and cost analysis of all electronic circuit boards mounted in the vehicle.
- Other electronic parts
A complete disassembly investigation of the electronic circuit boards used in the BMW i3.
- Other electronic parts
The iPhone 6S from Apple, which has added new features.
- Other electronic parts
Selling the latest Dear Down report at a low price in a bundle.
- Other electronic parts
A talented individual that has evolved from Air to Air2, achieving further performance enhancement.
- Other electronic parts
Recently prominent wearable products. This time, we introduce Microsoft's Band.
- Other electronic parts
A device that allows you to view footage from home while you are out.
- Other electronic parts
Analysis of safety systems to protect human lives as much as possible.
- Other electronic parts
Suitable for replacement of Omron's B7AS series.
- Other electronic parts
32ch Insulation DIO Card LPCIe-7230
- Other electronic parts
- Expansion Boards
EtherCAT Master Motion Controller PCIe-8338
- Other electronic parts
- Expansion Boards
4/8/12-channel PCI Express x4 Gen3 USB3 Vision Top Performance Frame Grabber
- Other electronic parts
- Image Processing Board
4-channel, 24-bit, high-precision load cell input PCI Express card
- Other electronic parts
- Expansion Boards
2/4ch PCI Express GigE version + frame grabber
- Other electronic parts
- Expansion Boards
ADLINK wins Silver Award at the "Image Information AWARD".
ADLINK Japan has won the Silver Award at the "15th Video Information AWARD" organized by Video Information Web. The "Video Information AWARD" recognizes 101 nominated machine vision-related products from new products and technologies announced by various companies in 2017, based on reader votes, and this is the first time ADLINK has received an award. The products that won this time are the NEON-1021, the latest smart camera featuring the Intel Atom E3845 processor; the EOS-1300, a 4-channel PoE compact vision system; and the PCIe-GIE72/74, a 2/4 channel GigE Vision PoE+ frame grabber. About Video Information Web Video Information Web publishes magazines and books in the "Video Information" series. It introduces high-quality information more quickly across a diverse range of topics, from cutting-edge technologies in the video industry to applications in medical imaging.
96ch 12-bit Maximum 3MS/s High-Density Analog Input PCI Express Card
- Other electronic parts
64ch 12/16-bit Maximum 3MS/s Multifunction DAQ PCI Express Card
- Other electronic parts
32ch 80MB/s High-Speed Digital I/O Card
- Other electronic parts
- Expansion Boards
16ch 16bit maximum 250 kS/s low-cost multifunction DAQ PCI Express card
- Other electronic parts
8ch relay output & 8ch isolated DI card
- Other electronic parts
- Expansion Boards
4ch 14/16-bit Maximum 2MS/s Simultaneous Sampling Multifunction DAQ PCI Express Card
- Other electronic parts
The test environment of IEC60068.2.66 created by temperature, humidity, and pressure conditions.
- Capacitor
- Other electronic parts
- Dedicated IC
We will be exhibiting at TEST2025 from September 10 to 12.
In various industries such as generative AI, semiconductors, and automobiles, testing challenges are becoming increasingly diverse. To meet these testing needs, we offer solutions unique to a leading company in environmental testing equipment, including product sales, contract testing, equipment rental, and after-sales service.
【Super Convenient!!】A handy clip for attaching antennas to your body when you want to. "It would be great to have this!" Made in Japan for your peace of mind, highly praised!!
- Other electronic parts
Case Renewal! 2.4GHz Band High-Definition Video and Audio Stereo Uncompressed Wireless Device
【Specifications】 Model: GTV-T1/R1-B ● This is a renewed case for the GTV-T1/R1 model, compatible with both vertical and horizontal placement. ● The electrical performance is the same as that of the GTV-T1/R1. (Successor to the GTV-T1/R1) ● It is lighter, weighing approximately 230g, with dimensions of 80W × 116D × 41H mm. ● Dustproof measures have been enhanced! ● "Technical conformity" certification obtained.
Compact and high-efficiency heat management supporting high-density implementation.
- Other electronic parts
It has a wide heat exchange surface of 250 mm in width and 40 mm in height, achieving efficient passive cooling.
- Other electronic parts
If you want to learn about photoresists, which are essential for semiconductor manufacturing, please take a look!
- Printed Circuit Board
- Other electronic parts
- Technical and Reference Books
Photoresist-type electrocoating paint suitable for fine processing of electronic components and similar applications!
- Other electronic parts
- Chemicals
- glue
3D objects can be coated with a thin film mask! Electrodeposition liquid for fine processing, 'Hani Resist'.
"Hani Resist" is a fine processing electrocoating developed based on our company's pioneering electrocoating technology for aluminum building materials (electrocoating resin synthesis technology, electrocoating liquid management technology, electrocoating process technology). Due to its superior adhesion compared to other electrocoating liquids, it is suitable for applications that were previously impossible, such as masks for plating and for etching. 【Features】 ■ Excellent conformability to three-dimensional structures ■ Superior adhesion ■ High resolution ■ Pinhole-free ■ Chemical resistance Product lineup ■ Negative type cationic electrocoating paint ■ Negative type anionic electrocoating paint 【Development product】 ■ Positive type anionic electrocoating paint *For more details, please refer to the catalog or feel free to contact us.
LE Audio compatible! Audio sharing is possible without device connection limitations.
- Other electronic parts
Adopts non-porous gas-permeable hollow fibers! Suitable for low surface tension liquids such as those containing surfactants. *Video available.
- Other electronic parts
Mainly used for laboratory and analytical purposes! Designed with a large membrane area within a very small size. *Video available.
- Other electronic parts
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.
- Other electronic parts
[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.