Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.
106～120 item / All 1059 items
By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.
The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.
The wafers in the solar cell manufacturing process can be evaluated using photoluminescence.
The PVX1000+POPLI-Octa can evaluate wafers during the solar cell manufacturing process using photoluminescence. It is capable of assessing the passivation effects of the PN junction layer after thermal diffusion, the AR layer deposition, surface contamination, as well as the protective effects of the rear insulation layer and the evaluation of Local-BSF. Additionally, by using a DC power supply for EL observation of the module, it is possible to pinpoint the locations of defects. By applying reverse bias to the module and observing LEAK points, defects that have caused PID can be easily identified.
Microscopic PL observation of the fine structure of wafers in the solar cell manufacturing process.
The PVX1000+POPLI-μ allows for photoluminescence observation of the fine structure of wafers during the solar cell manufacturing process using a microscope. In the case of PERC, it is possible to evaluate individual Local-BSFs based on PL intensity and assess the damage to the passivation layer around the laser contact holes. Additionally, defect location identification is possible through EL observation of the module using a DC power supply.
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials with a crystalline structure, such as metals and ceramics, are thought to be composed of numerous crystal lattices like cubic ones, and this analytical method examines the orientation of these lattices (crystal orientation). Various maps are used, including IQ maps (Image Quality Maps), IPF maps, GROD maps, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.
By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.
We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for various defect modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, including "Light Emission Analysis/OBIRCH Analysis," which allows layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Light Emission Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Microprobe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.
Since semiconductors have different physical properties, new methods are required for failure analysis!
Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of pseudo-leaks. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.
We will introduce a comparison of brightness and characteristics between good products and ESD-damaged products, along with examples of luminescence analysis using EMS microscopy!
We conduct failure analysis of orange LEDs that have been damaged by electrostatic discharge (ESD). LEDs that have been destroyed in ESD testing and show a decrease in luminous intensity can be analyzed using emission luminescence and the IR-OBIRCH method, allowing us to clarify the failure phenomena. We have examples such as "Comparison of brightness and characteristics between good products and ESD-damaged products" and "Luminescence analysis using emission microscopy." [Analysis Examples] ■ Comparison of brightness and characteristics between good products and ESD-damaged products - By polishing the lens part of a bullet-type LED to flatten it, dark areas were observed during brightness comparison. ■ Luminescence analysis using emission microscopy - In ESD-damaged products, dark areas were observed under forward bias, while only the damaged areas emitted light under reverse bias. ■ IR-OBIRCH and SEI analysis - Detailed damage locations were identified through IR-OBIRCH analysis of ESD-damaged products. *For more details, please refer to the PDF document or feel free to contact us.
Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!
At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCDs. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Content (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Tests - Lighting Inspections ■ Analytical Methods - Oven Drive Tests - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.
We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!
At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.
We will narrow down the defective areas through lighting confirmation, panel disassembly, and optical microscope observation!
We provide a defect diagnosis menu for LCD panels, from confirming defects to identifying causes and conducting detailed failure analysis. In the initial analysis, we perform a status check (lighting test), panel disassembly, and optical microscope observation, tailored to the defect symptoms. In the detailed analysis, based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis. It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects. 【Analysis Content】 ■ Initial Analysis - Status check (lighting test), panel disassembly, optical microscope observation, conducted according to defect symptoms - Narrowing down from general areas such as cell panels and peripheral circuits to finer details ■ Detailed Analysis (additional analysis fees apply) - Based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis - It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects *For more details, please refer to the PDF document or feel free to contact us.
We will suggest appropriate analysis methods based on the condition of polymer materials and samples!
At AITES Co., Ltd., we conduct material degradation analysis. We propose appropriate analytical methods based on the condition of polymer materials and samples. By analyzing the degradation process that the material has undergone and optimizing the polymer materials and usage environment, it is possible to extend the product's lifespan. *For more details, please refer to the PDF document or feel free to contact us.
Examples of degradation analysis of panel polarizers are published! We conducted degradation analysis through reliability testing and outgassing analysis using HS-GCMS.
The polarizers used in LCD panels are made of multilayer films laminated with materials such as triacetyl cellulose, polyvinyl alcohol, and polyethylene terephthalate. This document presents a case study of the degradation analysis of panel polarizers after reliability testing, conducted through HS-GCMS analysis and thermal desorption GCMS analysis. Even invisible degradation might be detected with this analysis?! Please take a moment to read it. [Contents] ■ Reliability Testing ■ Outgassing Analysis via HS-GCMS ■ Low Boiling Point Component Analysis via Thermal Desorption GCMS *For more details, please refer to the PDF document or feel free to contact us.
Investigating how the light transmittance of blue light cut film changes using a spectrophotometer!
Blue light cut film has the effect of suppressing the transmission of visible light, particularly light with a wavelength of 500nm or less, compared to regular PET film. Using a spectrophotometer, we examined how the light transmission of the blue light cut film changes under UV irradiation. The transmission of light in the wavelength range of 350 to 400nm decreased further due to UV irradiation. Additionally, we conducted an analysis of the reactions occurring within the film using GC-MS. [Analysis Content] ■ Light transmission characteristics of regular PET film and blue light cut film ■ UV irradiation on blue light cut film ■ GC-MS analysis of components within the film *For more details, please refer to the PDF document or feel free to contact us.
If any issues arise, detailed analysis will also be provided! A simplified analysis for customers considering the introduction of overseas LCDs.
We will introduce the analysis of good products for liquid crystal displays by Aites Co., Ltd. First, we conduct optical microscope observations focusing on the FPC, FOG, COG, and sealing materials in the state of the cell panel as part of the appearance observation. Next, we dismantle the cell panel to check the sealing materials, PI film, and TFT shape. If any defects are found during the good product analysis, we will propose additional analyses such as cross-sectional observation of wiring and foreign matter analysis to investigate the cause. Please feel free to consult us when needed. [Contents of Appearance Observation] ■ Are there any corrosion or foreign matter on the FPC wiring? ■ Is there any issue with the FOG bonding? ■ Is there any issue with the COG bonding? ■ Are there any breaks or defects in the sealing material? *For more details, please refer to the PDF document or feel free to contact us.
Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!
Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.
