Cleaning agents Product List and Ranking from 428 Manufacturers, Suppliers and Companies

The Current Situation of Organic Solvent Reduction: The Potential of Water-Based Cleaning Agents [Technical Document]

Explanation of the progress in reducing organic solvents and the surrounding regulations! Examples of alternatives using MPC cleaning agents are also included.

This document introduces the key points for reducing organic solvents in the cleaning field and specific case studies of initiatives. It explains the progress of organic solvent reduction, points for substituting organic solvents, and the potential of MPC cleaning agents. Additionally, it includes examples of successful organic solvent substitutions using MPC cleaning agents. We encourage you to read it. 【Contents】 ■ Progress of organic solvent reduction ■ Regulations surrounding organic solvents ■ Points for substituting organic solvents - cost and drying properties - ■ Potential of MPC cleaning agents ■ Examples of organic solvent substitution using MPC cleaning agents ■ Summary *For more details, please refer to the PDF document or feel free to contact us.

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Zestron Japan Co., Ltd. Product Catalog

For cleaning flux on printed circuit boards! A variety of water-based and solvent-based cleaners are available.

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

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Transport chain inside the fraxer: Spray cleaner VIGON RC303

Ideal for cleaning areas that cannot be removed, thanks to its spray bottle design!

VIGON RC 303 is a spray bottle type water-based flux cleaner designed for non-removable areas (such as the fracas chain, around internal devices like transport claws, inside reflow/flow ovens (walls), and fracas boxes). By switching from a solvent to VIGON RC 303, the maintenance frequency has decreased from once a week to once a month, and the amount of maintenance work has been reduced to one-fourth. Additionally, being water-based, it is non-flammable and not subject to applicable regulations. Please feel free to consult us when needed. 【Features】 ■ High cleaning performance and long lifespan ■ Time-saving as it can be cleaned before the equipment cools down ■ Difficult to volatilize due to being water-based *For more details, please refer to the PDF document or feel free to contact us.

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Aiming for coexistence and mutual prosperity with ions: Issues and analytical methods of ion residues [Materials]

The world of electronics at a crossroads! An explanation of the challenges and analysis methods of ion residues using specific examples!

This document explains the issues and analysis methods related to ion residues. Focusing on the complex theme of "ions," it introduces the current challenges that exist. It includes factors contributing to ion residues, the significance of flux cleaning, and specific examples, along with diagrams and detailed explanations, so please feel free to download and take a look. 【Contents (partial)】 ■ Introduction ■ What are ions? ■ Factors of ion residues ■ Significance of flux cleaning ■ Specific examples ■ Cleaning primarily using organic solvents *For more details, please refer to the PDF document or feel free to contact us.

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Evolution of Joining Techniques and Cleaning - Cleaning Technologies Required for Sintered Joining - [Materials]

The evolution of power semiconductors continues! An explanation of the effects achieved through cleaning.

This document explains the relationship between sintering bonding and cleaning, as well as the effects of cleaning. It introduces "sintering," which is gaining attention as a new bonding technology in the power semiconductor field. It discusses how sintering bonding and cleaning are related and what effects can be achieved through cleaning. Please take a moment to read it. 【Contents (partial)】 ■ What is "sintering" ■ Methods of sintering bonding ■ Why "sintering" is needed ■ Challenges in sintering bonding ■ An era where new considerations for cleaning methods are necessary *For more details, please refer to the PDF document or feel free to contact us.

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New Challenges in Cleaning: Optimization of Cleaning Methods [Materials]

The evolution of flux cleaning technology is also being questioned! We will publish what issues are at stake.

This document explains flux cleaning in high-performance products. When attempting to establish a cleaning process, we will introduce the issues that arise, taking into account the historical background. We have included images, diagrams, and detailed explanations regarding the ability to handle insoluble substances and the future of soldering cleaning, so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Awareness of "Cleaning": Japan's Unique Environment ■ The Rise of Insoluble Substances ■ Ability to Handle Insoluble Substances (MPC Cleaning Agents) ■ The Future of Soldering Cleaning *For more details, please refer to the PDF document or feel free to contact us.

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What is flux residue? Diversification and analysis methods of flux residue.

Cleaning methods and post-cleaning analysis are recent challenges! We will introduce examples of issues caused by flux residues.

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

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Definition of Water-Based Cleaning Agents: The Nature and Challenges of Water-Based Cleaning Agents [Materials]

Polarization of cleaning demand and a new focus on water-based cleaning agents! Explanation of challenges, etc.

This document explains the definition of water-based cleaning agents and the technical challenges of solvent-based cleaning agents. From the perspective of the technical trends in solder and flux, it focuses on "ionic residues" and introduces the technical relevance to "water-based cleaning agents." This technical document is recommended for those who want to learn about water-based cleaning agents or the recent compositions of solder and flux. [Contents (partial)] ■ Introduction ■ Challenges during cleaning from the perspective of solder and flux composition ■ Why can water-based cleaning agents be considered effective for removing ionic residues? ■ Examples of cleaning agent classifications - Issues in Japan ■ Effects of moisture content differences and technical challenges *For more details, please refer to the PDF document or feel free to contact us.

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Flux cleaner for printed circuit boards VIGON A 200

Ideal for cleaning low standoff components! Can be introduced into immersion tanks without explosion-proof specifications.

"VIGON A 200" is a water-based cleaning agent specially designed for use in high-pressure and medium-pressure spray equipment, such as inline and batch systems. Based on MPC technology, it is capable of removing various types of flux residues from electronic substrates, ceramic substrates, power modules, and lead frames. It meets high cleanliness requirements for subsequent processes such as wire bonding and coating. 【Features】 - Maintains high cleanliness for wire bonding and coating processes - Free of surfactants and excellent rinsability, leaving no residues on surfaces - Easily filterable, extending liquid life and reducing cleaning agent costs - No flash point, allowing for introduction into immersion tanks without explosion-proof specifications - Does not foam even in high-pressure spray applications - Halogen-free and low odor *For more details, please refer to the PDF document or feel free to contact us.

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Water-based flux cleaner for power semiconductors VIGON PE215N

No ignition point! Prevents re-oxidation of copper substrates with effective rinsing! Long-term protection of activated copper substrates.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks VIGON TC 150

Water-based cleaning agent for conductive paste, also usable for removing silver sinter paste from metal masks and screen plates!

We would like to introduce our water-based cleaning agent for conductive paste, 'VIGON TC 150'. This product is specially designed to remove silicone-based and silicone-free conductive pastes, as well as silver and aluminum conductive pastes, from metal masks and screen plates. It can also be used for the removal of silver sintered paste. 【Features】 ■ Excellent cleaning performance for conductive pastes ■ Capable of removing silver sintered paste from metal masks and screen plates ■ A water-based cleaning agent that can replace traditional solvent-based cleaners ■ Improves health and safety for operators due to being water-based ■ Can be used in spray equipment without explosion-proof specifications as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for co-solvent processes ZESTRON CO 150

Combined with HFE-based cleaning agents, it becomes a process that does not use water! Achieving quick drying without residues.

"ZESTRON CO 150" is a solvent-based cleaning agent specifically designed for ultrasonic immersion processes. It can be used for pre-cleaning in combination with HFE-based cleaning agents without dilution, or as a co-solvent. It is particularly suitable for cleaning flux residues from eutectic and lead-free no-clean solder on electronic components, power modules, and lead frame-based discrete components. 【Features】 ■ Excellent cleaning performance for eutectic and lead-free solder ■ Improved quality in wire bonding and molding ■ Provides a stable cleaning process due to its composition that is less prone to boiling ■ Allows for a wide range of concentration management in process control ■ Stabilizes the cooling process and contributes to minimizing HFE consumption ■ Since it does not use water, it is possible to keep ion contamination levels low *For more details, please refer to the PDF document or feel free to contact us.

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Dispenser Nozzle Cleaning Agent ZESTRON HC

With a removable dispenser nozzle for SMT bond removal, cleaning can be done easily!

"ZESTRON HC" is an improved alcohol-based cleaning agent developed for the removal of SMT adhesive from tools such as dispenser nozzles. It can also be used for the removal of solder particles and dust from mounter nozzles. To facilitate easy use for manual cleaning, it is provided in an aerosol can. 【Features】 ■ Effectively removes SMT adhesive from dispenser nozzles and tools ■ Quick-drying and leaves no residue ■ Halogen-free organic solvent ■ Capable of removing solder particles and dust from mounter nozzles *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for metal masks ZESTRON SD 100

Low odor, usable at room temperature! Cream solder cleaning agent for metal masks and screens.

"ZESTRON SD 100" is a solvent-based cleaning agent specially designed for removing cream solder from metal masks, using an explosion-proof spray-type cleaning machine. Depending on the type of flux, it can also be used on misprinted circuit boards. Furthermore, it can be used for back wiping in printing machines and for manual wiping cleaning. Additionally, this product has been approved for use by major manufacturers worldwide in metal mask printers. 【Features】 ■ High contamination retention, leading to long life and reduced maintenance time ■ Excellent drying properties, contributing to shorter cleaning times ■ Low odor, suitable for use at room temperature ■ Suitable for manual wiping cleaning of metal masks and back wiping in printing machines *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for metal masks ZESTRON SD 301

Due to its high contamination retention capability, it has a long lifespan and reduces cleaning costs!

"ZESTRON SD 301" is a solvent-based cleaning agent for removing cream solder, SMT adhesives, and thick film pastes using explosion-proof spray cleaning machines from metal masks and screens. It has quick-drying properties, allowing for a reduction in the cleaning process time. It is also effective for cleaning printed circuit boards with printing errors. Due to its high flash point, it can be used for hand wipe cleaning and backside wiping on printing machines. 【Features】 ■ Capable of removing flux residues ■ Long lifespan and reduced cleaning costs due to high contamination retention capability ■ Very fast drying time, enabling a reduction in the cleaning process ■ Usable at room temperature *For more details, please refer to the PDF document or feel free to contact us.

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Water-based cleaning agent for metal masks - HYDRON SC 300

Since the water-based cleaning agent has no flash point, explosion-proof specifications are not required for the cleaning equipment!

The "HYDRON SC 300" is a water-based cleaning agent developed for cleaning metal masks. It reliably removes cream solder and SMT adhesives at room temperature without leaving any residue on the surface of the metal mask. Additionally, it can be used in both the cleaning and rinsing processes, dries without leaving any cleaning agent residue, and can also be used for wiping the back of printing machines. 【Features】 ■ Exhibits excellent effectiveness in cleaning cream solder and adhesives, leaving no residue ■ Usable in both cleaning and rinsing processes ■ Dries without leaving residue on the metal mask ■ Does not foam even when using a spray cleaning machine ■ Contains less than 20% VOC, implementing environmental measures ■ Excellent material compatibility with metal masks *For more details, please refer to the PDF document or feel free to contact us.

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Pitfalls of Flux Cleaning with Solvent-Based Cleaners

Are you overlooking ion residues? An explanation of the pitfalls of flux cleaning.

Organic solvents, which are used in various fields, are currently an indispensable part of the chemical industry, and it is difficult to completely stop their use. In recent years, due to technological advancements and corporate efforts in various industries, the amount of organic solvents used and their atmospheric emissions have been significantly reduced. However, in the flux cleaning of electronic devices in Japan, cleaning agents primarily based on organic solvents are widely used. However, flux cleaning has essentially transformed into "complex residue cleaning," and while solvent-based cleaning agents are very effective against organic components such as rosin, they are almost unable to dissolve ionic substances or insoluble metal salts, making removal by "dissolution" methods difficult. *For more detailed information, please refer to the related links. For further details, please check the PDF materials or feel free to contact us.*

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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.

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Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.

The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.

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Is there no cleaning agent that is non-flammable and takes safety and environmental considerations into account?

Introducing examples of project improvements regarding cleaning agents that consider safety and environmental aspects!

Organic solvents, used in various fields, are currently an indispensable part of the chemical industry, and it is difficult to completely stop their use. In the cleaning sector as well, while the amount of organic solvents used has been decreasing, they are still used extensively. However, recent legal reforms and global circumstances have accelerated the movement to reduce the use of organic solvents, making it essential to reassess their usage. *For detailed case information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

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No more failures! How to choose a flux cleaner [Materials available]

Attention those struggling with flux cleaning! The key to flux cleaning lies in "selecting the right cleaning agent"!

This document explains how to choose flux cleaning agents. It provides specific examples of key points to consider when selecting a flux cleaning agent and highlights the aspects to focus on. It also includes important considerations for water-based cleaning agents, such as controlling evaporation loss and variations in water content, as well as examples of non-cleaning type flux cleaning cases, so please take a moment to read it. [Contents (partial)] ■ Key points when choosing flux cleaning agents ■ Types of flux cleaning agents ■ Important considerations when examining water-based cleaning agents ■ Examples of non-cleaning type flux cleaning *For more details, please refer to the PDF document or feel free to contact us.

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Evaluation Methods for Flux Cleaning / Added Value [Seminar Materials]

An explanation of the latest cleanliness analysis methods and the added value of using flux cleaning agents!

This document provides a detailed explanation of evaluation methods and added value in flux cleaning. It introduces "cleanliness analysis in flux cleaning," as well as "substances to be analyzed," "the impact of residual organic matter," and "the pathways and effects of ion contamination." Additionally, it includes an introduction to Zestron and examples of analytical methods. We encourage you to read it. 【Contents (partial)】 ■ Introduction to Zestron ■ Cleanliness analysis in flux cleaning ■ Substances to be analyzed (flux residues) ■ Substances to be analyzed (residues during sintering) ■ Impact of residual organic matter *For more details, please download the PDF or feel free to contact us.

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Evaluation of cleanliness after cleaning: Analysis methods for flux residues and residues after sintering bonding.

In the cleaning of electronic devices, various factors are intertwined! An explanation of the importance of cleanliness evaluation.

In recent years, the miniaturization and high density of electronic devices have progressed, and along with this, the evolution of the bonding materials used has also coincided, making contamination more complex. In particular, in fields such as automotive, aerospace, space, and high-capacity communication, there is an increasing number of cases that require high reliability, and concurrently, there is a demand for reliable cleaning from the perspective of quality assurance. Inadequate cleaning can lead to issues such as poor wire bonding, poor adhesion of resin in molding, and the occurrence of migration, which is a well-known fact. However, in recent years, there have been many cases where defects occur in later processes despite passing inspections, and we have seen an increase in inquiries to our company regarding this issue. Why do such cases arise? This time, we will explain the importance of cleanliness evaluation after cleaning. *For more detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

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Troubles with Flux Cleaning Due to High-Density Component Mounting [Case Study]

Along with a case study on cleaning defects due to high-density implementation, we will also provide guidance on methods for restructuring the cleaning process!

We would like to introduce a case study on the investigation of factors leading to cleaning failures due to flux cleaning troubles caused by the high density of component mounting. With the increase in the density of component mounting, a change in the solder paste used was made, but there have been reports of defects believed to be caused by cleaning issues. Based on the information gathered, we inferred the current situation. We conducted an analysis and evaluation of the hypotheses and proposed both temporary and permanent measures tailored to the customer's circumstances based on the results. [Case Overview] ■ Issues - Cleaning performance of flux in low stand-off areas ■ Conclusion - Stable operation is difficult under the current cleaning conditions ■ Permanent improvement measures and proposals - Review of cleaning agents and cleaning processes suitable for the work shape and flux *For more details, please download the PDF or feel free to contact us.

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What is water-soluble flux? An explanation of water-soluble flux residues and analysis methods.

The role and applications of water-soluble flux! We will explain residues, analytical methods, and cleaning methods.

Water-soluble flux is a flux based on water, using water-soluble polymers such as polyoxyethylene alkyl ether. Currently, rosin-based flux is the mainstream for soldering in electronics assembly in Japan, but due to the increasing environmental awareness such as the SDGs, there is a movement to explore the transition to water-soluble flux, which is expected to reduce VOCs. *For more details, you can view the related links. Please feel free to contact us for more information.

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Is a cleaning agent really unnecessary? Cleaning verification of water-soluble flux / Joint research with Hiroki.

Is a cleaning agent really unnecessary? Information on the cleaning verification results of water-soluble flux.

In current electronics assembly in Japan, rosin-based flux is predominantly used for soldering. However, due to the promotion of the SDGs and the increasing interest in reducing environmental impact, there is an active evaluation of water-soluble flux, which is expected to reduce VOC emissions and cleaning burdens. This time, we will present an investigation into the actual cleaning situation of water-soluble flux, which is recognized as easier to clean than rosin-based flux. *For detailed information, please refer to the related links. For more details, you can download the PDF or feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

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Removal of sinter agent residue + tack agent, joint research with Mr. McDermid.

Explaining the cleaning effect of complex organic substances after using the currently popular sintering agent! Joint research with Mr. McDermid.

In recent years, the advancement of electronic devices has led to a demand for advanced bonding technologies that can withstand high heat, large currents, and high voltages. In particular, in power devices, there are increasing cases where conventional solder types do not provide sufficient performance. While high Pb solder and Au/Sn solder can be applied, the use of "sintered bonding" is expanding due to environmental regulations and cost considerations, as it can form a high-density bonding layer. This article examines effective cleaning methods utilizing spray cleaning and ultrasonic cleaning, and introduces the features and application examples of cleaning agents VIGON PE 305N and VIGON PE 216A for power electronics. *For detailed content of the article, please refer to the related links. For more information, you can download the PDF or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

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