Excellent solder wetting properties, with no worries about whisker formation! ~The appeal of this product revealed through comparisons with tin plating and tin alloy plating~
If you want to apply plating to soldered components or printed circuit boards, "tin plating," which has high solder wettability and excellent corrosion resistance, has been utilized as a very effective means. However, tin plating has the issue of whisker formation.
Therefore, we would like to introduce our uniquely developed "solderable nickel plating." This plating has solder wettability equivalent to that of tin plating, but since it is an electroless nickel plating, there is no risk of whisker formation.
In terms of whisker countermeasures, there are many tin alloy platings that add other metals to tin, which also have excellent solder wettability.
*Examples: Tin-lead alloy plating, tin-silver alloy plating, tin-copper alloy plating, etc.
Compared to those platings, our product has many appealing points such as "compliance with RoHS directives," "low cost," and "ease of plating."
Although it is a new technology, it has received high evaluations in terms of performance and price, and we have numerous adoption records.
If you have any concerns or requests, please feel free to contact us.