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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
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Substrate Product List

31～60 item / All 226 items

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One-stop service for FPC production <Presentation of explanatory materials with a glossary>

One-stop service for FPC production <Presentation of explanatory materials with a glossary>

Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.

Our company handles everything from the design to manufacturing and assembly of FPC (Flexible Printed Circuit Boards) in a one-stop service. We can flexibly respond to a wide range of needs, including prototypes and development trials, one-off and irregular orders, and mass production, all with short delivery times. Since we use sheet materials, we can produce small lots without a minimum quantity requirement. The initial lead time for mass production is at least three weeks. We thoroughly manage quality using various inspection equipment, and we have a wealth of experience in fields with particularly high quality demands, such as automotive and medical applications. 【Features】 ■ Shortened lead times for product development and reduced development costs through small-lot prototyping ■ Rapid startup during mass production and flexible responses to production lot variations ■ Comprehensive support from design to board assembly (mounting support and in-house metal mask manufacturing) ■ Support for component procurement for both prototypes and mass production ■ Proposals for appropriate methods and tools (jigs) for FPC manufacturing from production planning ★ Currently, we are offering a glossary of FPC-related terms and materials about our products. Please check it out via "PDF Download." Feel free to contact us with any inquiries.

  • Contract manufacturing
  • Substrate

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Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

It is a flexible substrate that combines heat resistance and transparency. FPC

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Substrate

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Printed Circuit Board Thermal Fluid Analysis Service (Thermal Management) FPC・Flexible Boards

Printed Circuit Board Thermal Fluid Analysis Service (Thermal Management) FPC・Flexible Boards

Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC

We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Substrate

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Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!

The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Substrate

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Flexible Printed Circuit (FPC) "Transparent FPC"

Flexible Printed Circuit (FPC) "Transparent FPC"

Introducing a flexible printed circuit board (FPC) that balances transparency and solderability!

"Transparent FPC" is a flexible printed circuit board (FPC) that excels in transparency and heat resistance, using transparent polyimide film as its substrate. We have worked on developing an FPC that achieves both high heat resistance and transparency by adopting a highly heat-resistant transparent polyimide film, thereby solving the issues of warping and dimensional changes caused by heat during reflow. As a result, it can be applied to various fields such as wearable devices and medical equipment, which prioritize design. [Features] - Uses highly heat-resistant transparent polyimide film - Can utilize the existing design rules of conventional FPCs - Proposes new wiring styles in fields such as medical, lighting, and industrial equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Double Access Flexible Circuit Board (Double Access FPC)

Double Access Flexible Circuit Board (Double Access FPC)

The copper foil itself is the base without polyimide.

The copper foil itself is the base material of the FPC.

  • Printed Circuit Board
  • Substrate

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Double-sided flexible printed circuit board (double-sided FPC)

Double-sided flexible printed circuit board (double-sided FPC)

Double-sided type that allows for complex wiring.

This is an FPC with conductor patterns on both sides, allowing for complex wiring.

  • Printed Circuit Board
  • Substrate

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Rigid Flexible Circuit Board (Rigid FPC)

Rigid Flexible Circuit Board (Rigid FPC)

Rigid substrates and flexible printed circuit boards are integrated.

It is an FPC that combines a rigid substrate and a flexible printed circuit board.

  • Printed Circuit Board
  • Substrate

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High-precision multilayer substrate FPC (Red Board Co.)

High-precision multilayer substrate FPC (Red Board Co.)

We handle the "High-Precision Multi-Layer PCB FPC" manufactured by Red Board!

Red Board Electronics Ltd. was founded in 1988 and is a manufacturer of FPC and Rigid-FPC capable of supporting high-definition designs such as HDI. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • Substrate

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Blind Via (BVH) connection Flexible Printed Circuit (FPC)

Blind Via (BVH) connection Flexible Printed Circuit (FPC)

It is a flexible substrate effective for high-density wiring. FPC

Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Substrate

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Medical Development Support: Flexible Substrates, FPC, Flexible Boards

Medical Development Support: Flexible Substrates, FPC, Flexible Boards

We manufacture, sell, and support medical devices for basic research. FPC

- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Contract manufacturing
  • Substrate

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Thin FPC "Low Resilience FPC"

Thin FPC "Low Resilience FPC"

Custom softness! We offer variations to meet low-rebound needs.

"Low-Rebound FPC" is a solution that addresses the challenges of making devices thinner and smaller. We have refreshed the lineup of our flagship thin FPC brand, the "MK Series," to offer variations that meet low-rebound needs. 【Features】 ■ In-house developed products ■ Customizable softness ■ Thinner and smaller devices ■ High flexibility and low recovery rate *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other electronic parts
  • others
  • Substrate

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[Presentation of Materials] Until FPC is completed...

[Presentation of Materials] Until FPC is completed...

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

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  • Printed Circuit Board
  • Other electronic parts
  • Other cable related products
  • Substrate

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Multilayer flexible printed circuit board (multilayer FPC)

Multilayer flexible printed circuit board (multilayer FPC)

High through-hole connectivity

This is an FPC that uses polyimide in all layers with a configuration of three or more layers. It can be manufactured up to 10 layers.

  • Printed Circuit Board
  • Substrate

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【TTL_展示会レポート】JPCAShow2024出展内容

【TTL_展示会レポート】JPCAShow2024出展内容

『FPCのお困り事、一刀両断！』太洋テクノレックスは次代のニーズを敏感にキャッチし、フレキシブルな技術力でFPCを牽引！

フレキシブルプリント配線板 高周波フッ素複合材3層FPC 　誘電特性に優れたフッ素複合材FPCでノイズ対策と狭小化を両立。同軸ケーブルからの転換にも好適。 MSAP工法～超細線FPC～ 　めっきアップで高精度、かつ高密度の微細配線を実現。配線断面の矩形性に優れ、イメージ通りの配線形成が可能。 透明FPC 　優れた光透過性と耐熱性を備えチップ実装も可能なFPC。 　製品のデザインを損なうことなく配線の引き回しが可能。 6層スタックビアFPC 　ビアフィリング技術によるスタックビア構造で、さらなる高密度配線化を実現。配線スペースの有効活用により、設計自由度の向上に貢献。 基板検査システム【最終外観検査】 　パッケージ・モジュール系基板に好適な光学分解能2.5µm仕様機が遂にラインナップ！　 　虚報低減AIシステム『ザイス』と欠陥検出AIシステムの採用で最終外観検査工程の効率化を大幅にアップしました。 マテハン・協働ロボット活用で自動化・効率化を提案 協働ロボット・産業用ロボットのシステムインテグレートや周辺機器など、お客様の業種や業態に適したFAシステムをご提案致します。

  • Printed Circuit Board
  • Substrate

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【For Automotive Use】High Current FPC - Capable of Supporting Up to 200A

【For Automotive Use】High Current FPC - Capable of Supporting Up to 200A

Supports up to 200A, softer than busbars and allows bending at necessary points. The insulation thickness has been reduced, achieving low inductance.

The integration of high-current FPC allows for the reduction of two busbars to one FPC, resulting in decreased assembly labor. Additionally, the narrow distance between conductor layers leads to low inductance, enabling the reduction of power supply noise. Conventional busbars, being made of metal plates or rods, pose challenges in flexible routing and wiring freedom. The "high-current FPC" offers flexibility, allowing connections to be made by bending at necessary points. Compared to traditional metal busbars, it provides greater wiring freedom, making it ideal for use in tight spaces and areas with height differences. ■ Features - Integration of high-current FPC (low inductance, power supply noise reduction) - Capable of manufacturing copper foil in 105μm and 200μm specifications - Component mounting is also possible - Easy to manufacture in various shapes - Lighter compared to busbars and harnesses - Optimal for stress relief (vibration absorption) - Flexible and capable of maintaining bent shapes - Single-sided / double-sided

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  • Wiring materials
  • Substrate

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FPC (Flexible Printed Circuit)

FPC (Flexible Printed Circuit)

Leave it to us for anything related to FPC, including small quantities, a variety of products, short delivery times, prototypes, and mass production!

We would like to introduce our domestic factory's response to FPC (Flexible Printed Circuit Board). Our factory features a fully integrated production line for rapid manufacturing. In "Pattern Design," professionals in implementation technology provide pattern designs suitable for the required specifications, while in "Manufacturing Design," we verify all design data before production. Additionally, in our "Manufacturing Line," we produce all types of flexible, rigid boards, and rigid-flex boards in-house. We also provide assembly services for printed boards in-house. 【Features】 ■ Super-fast delivery with an in-house integrated line ■ Supports small lots and a variety of products, accepting orders from a single repeat ■ Cost reduction through efficient manufacturing processes for small lots ■ High reliability achieved with over 20 years of manufacturing know-how ■ Flexibility and responsiveness made possible by a small, elite team *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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FPC forming (bending) delivery

FPC forming (bending) delivery

Bend and deliver, ready to use. Achieve labor savings and space-saving design with FPC processing!

The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.

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  • Other electronic parts
  • Substrate

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Flexible printed circuit (FPC) low cost

Flexible printed circuit (FPC) low cost

We have a wealth of experience in custom and OEM projects.

■Features Flexible printed circuit boards (FPC boards) excel in flexibility and thinness, maintaining their electrical properties even when bent. The materials used for flexible printed circuit boards (FPC boards) include polyimide, known as coverlay, as an insulator, solder resist, and copper as the conductor. The basic structure of flexible printed circuit boards (FPC boards) consists of a film-like insulator with an adhesive layer formed on top, followed by a layer of conductor foil. The insulator covers and protects all areas except for the terminal and soldering sections. Produced in China, they are low-cost and ideal for value-added proposals. ■Specifications Base material thickness, copper foil thickness, copper foil type, coverlay color, resist color, and surface treatment will be manufactured according to customer specifications.

  • Other industrial robots
  • Notebook PC
  • Substrate

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[Exhibition Report] We exhibited at NEPCON Japan 2026!

[Exhibition Report] We exhibited at NEPCON Japan 2026!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆ 　　~Touch, Compare, Experience FPC!~ 　　　●Comparison of weight between rigid boards and FPC 　　　●Reduction of board area through high-density wiring 　　　●Improved work efficiency with transparent FPC 　　　●Introduction of black coverlay, etc. 　　~Technical Topics~ 　　　●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results 　　　●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via 　　　●6-layer stack via FPC... High-density wiring with stack via structure 　　~Our Initiatives~ 　　　●Introduction of "Space" related business 　　　●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment 　　 (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆ 　　　Proposal for utilizing FA and collaborative robots 　　 (Appearance inspection system + ASSISTA = Efficiency) Live demonstration

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  • Printed Circuit Board
  • Cosmetic containers and packaging
  • Pharmaceutical containers and packaging
  • Substrate

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High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #Flexible substrate #Flexible printed wiring board #Circuit board #Printed circuit board #High frequency #Impedance #Short delivery time #Mass production

  • FPC高周波解析サービス_R.png
  • Other electronic parts
  • Substrate

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FPC『RIGID FPCB』

FPC『RIGID FPCB』

FPC with a structure that has both Rigid and Flexible properties!

"RIGID FPCB" is a type of FPC that combines the characteristics of Rigid (hard) and Flexible (soft), making it easy to implement SMD (Surface Mount Device) components. It is suitable for applications requiring high connection reliability between circuit boards. Additionally, we offer two types of lineups to suit different applications. Please feel free to contact us. 【Features】 ■ Combines Rigid (hard) and Flexible (soft) characteristics ■ Ideal for inter-board connection applications *For more details, please contact us or download the catalog.

  • Other electronic components and modules
  • Electronic Components
  • Substrate

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[Exhibition Report] We exhibited at NEPCON Japan 2025!

[Exhibition Report] We exhibited at NEPCON Japan 2025!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

  • Printed Circuit Board
  • Visual Inspection Equipment
  • Transport and handling robots
  • Substrate

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Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

We propose an extremely thin and highly flexible FPC.

It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis
  • Substrate

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Button-plated flexible printed circuit board (FPC)

Button-plated flexible printed circuit board (FPC)

Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.

Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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FPC "Double-sided FPC"

FPC "Double-sided FPC"

It is possible to achieve conductivity on both sides through through-hole plating!

"Double-sided FPC" is a printed circuit board with a base film (insulating substrate) at its center and conductor patterns on both sides. It is mainly used in products such as cameras and mobile LCDs, and it is possible to achieve conductivity on both sides through through-hole plating. [Features] - Conductor patterns on both sides - Capability for conductivity on both sides *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Other Machine Parts
  • Substrate

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High-frequency compatible FPC (fluoropolymer composite material specification) flexible printed circuit board

High-frequency compatible FPC (fluoropolymer composite material specification) flexible printed circuit board

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (Fluoropolymer Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluoropolymer composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss for stable high-speed, high-capacity communication. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

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  • Other electronic parts
  • Substrate

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[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

FA and automation systems, introduction of operational examples. "Future co-creation" between humans and robots.

〇 Introduction of Use Cases We have introduced our proposed automation system in the customer's PR video. We have received consent for its publication on this site, so please view it via the video link. Our automation system: 13-23 seconds, 38-49 seconds *Only the input and output of materials using a dual-arm robot transport system. Elephantech Inc. https://www.elephantech.co.jp/ Elephantech "Elephantech - A startup leading the world in FPC printing" With the mission of "creating a sustainable world through the power of new manufacturing," we manufacture and sell FPC (Flexible Printed Circuit) using environmentally friendly unique methods with inkjet printing and copper plating.

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  • SCARA Robot
  • Substrate

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FPC "Single-sided FPC"

FPC "Single-sided FPC"

Ideal for flexible bending and effective use of embedded space!

"Single-sided FPC" is a printed circuit board that has a conductor pattern on only one side. Due to its thinness, it allows for flexible bending and effective use of assembly space, and we also offer fine-pitch specifications in addition to standard specifications. This product is mainly used in backlights and motors. 【Features】 ■ Conductor pattern on one side only ■ Allows for flexible bending and effective use of assembly space *For more details, please refer to the catalog or feel free to contact us.

  • Electronic Components
  • Other Machine Parts
  • Substrate

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Flexible printed circuit board

Flexible printed circuit board

We respond to any customer requests with flexibility. We accommodate small and medium lots as well as prototypes.

We manufacture flexible printed circuit boards (FPC) tailored to our customers' needs with a diverse range of materials, configurations, and lineups. We are happy to accept orders for just one piece or a single process, and we also provide fine-pitch FPCs with a mass production base for small to medium lots, such as L/S = 50/50μm. Leveraging the surface treatment technology we have built over many years, we respond to our customers' diverse requests under thorough process management. 【Four Reasons to Choose Us】 ■ Years of expertise ■ Support for small and medium lots and prototypes ■ Proven track record of safety and reliability ■ Planning and proposal services available *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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