【Substrate Analysis Service】FPC・Flexible Substrate
We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC
- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC
- Company:サーテック フレキ基板(FPC)ソフトウェア ハードウェア 成膜加工 基板設計
- Price:Other