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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
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Substrate Product List

121～150 item / All 226 items

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Board-to-board (FPC) battery connection connector | FPB4 series

Board-to-board (FPC) battery connection connector | FPB4 series

Low-profile, compact connector for high-capacity batteries capable of 8.0A current with a mating height of 0.6mm.

The FPB4 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 8A, making it suitable for applications requiring high current, such as battery connections. 【Features】 ■ Power contacts capable of carrying 8A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 2 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design for a robust structure ■ Metal cap can carry up to 2.5A as a power contact ■ Metal placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and increased withdrawal force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Board-to-board (FPC) battery connection connector | FPB6 series

Board-to-board (FPC) battery connection connector | FPB6 series

Ultra-low profile and compact connector for high-capacity batteries capable of 7.0A current with a fitting height of 0.6mm.

The FPB6 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 7A, making it suitable for applications such as battery connections that require high current. 【Features】 ■ Power contacts capable of carrying 7A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 4 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design achieves a robust structure ■ The metal cap can carry up to 2.5A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Achieves a good click feel during mating and improved extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Board-to-board (FPC) battery connection connector | FPB7 series

Board-to-board (FPC) battery connection connector | FPB7 series

Ultra-low profile and compact connector for high-capacity battery capable of 7.0A current with a mating height of 0.6mm.

The FPB7 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 7A, making it suitable for applications such as battery connections that require high current. 【Features】 ■ Power contacts capable of carrying 7A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 6 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design for a robust structure ■ Metal caps can carry up to 2.5A as power contacts ■ Metal placed in the center of the receptacle connector: enhanced strength due to inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and enhanced extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Fine flexible circuit board

Fine flexible circuit board

Achieving fine pattern processing using methods such as etching and additive techniques!

FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Processing Contract
  • Substrate

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5G Electronic Materials PTFE FPC Fluororesin Substrate

5G Electronic Materials PTFE FPC Fluororesin Substrate

Sheet processing of ultra-thin resin sheets with low dielectric properties, high strength, and low elasticity.

We have over 1,000 prototypes related to 5G-related electronic materials, FPC, CASE-related, power device-related, and various others. This includes metal foils, electrode foils, insulating foils, separator foils, films, sheets, and rolls. You can rest assured with any materials, components, or processing methods. We can provide optimal proposals tailored to each customer, each development project, and each stage from prototyping to mass production in a one-stop manner. This is our greatest value, "Total Service for Punching Out." Please feel free to contact us about anything. We will respond promptly and sincerely, putting in our best effort.

  • Other electronic parts
  • Substrate

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Ground slit MSL structure flexible printed circuit board

Ground slit MSL structure flexible printed circuit board

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

  • キャプチャ2.JPG
  • Printed Circuit Board
  • High frequency/microwave parts
  • Wiring materials
  • Substrate

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Narrow pitch pad on beer flexible substrate

Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

  • padonvia_002.png
  • padonvia_003.png
  • High frequency/microwave parts
  • Substrate

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Connector for board-to-board (FPC) connection | FB35AW6 series

Connector for board-to-board (FPC) connection | FB35AW6 series

Connector with a height of 0.6mm, 0.35mm pitch, capable of carrying 7.0A, ultra-low profile and compact power composite type.

The FB35AW6 series connector is a board-to-board (FPC) connector with a 0.35mm pitch, a mating height of 0.6mm, and a depth of 1.95mm. This connector features a combined terminal arrangement for signal contacts and power contacts. 【Features】 ■ Power contacts capable of carrying 7A ■ Pitch of 0.35mm, product width of 1.95mm, mating height of 0.6mm ■ Available core counts: 10, 14, 18, 20, 22 cores ■ Adoption of a metal cap design for a robust structure ■ The metal cap can carry up to 2.5A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and increased extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.

We would like to introduce our achievements in substrate manufacturing. We optimized each device to handle materials in roll form and produced ultra-long substrates with a product size of 20m. We perform exposure, development, and etching processes, using polyester materials to reduce costs. We achieved low-cost production through suggestions during the manufacturing method and product design stages, as well as innovations in the manufacturing process. 【Basic Specifications】 ■ Material: Polyester/0.075 Cu35/0μ ■ Processes: Etching, simple shape processing ■ Substrate Size: 20000×59 ■ Others: Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Introduction to printed circuit boards.

Introduction to printed circuit boards.

We propose highly reliable and high-performance circuit boards that support a wide range of fields, including information communication and industry!

A "printed circuit board" refers to a substrate on which a pattern (electronic circuit) called a pattern is printed on the surface of an insulating board. Our company proposes high-reliability and high-performance substrates tailored to customer requirements, supporting a wide range of fields such as "information and communication," "semiconductor-related," "aerospace," and "industrial." We offer a rich lineup of products, including flexible substrates that achieve space-saving through the reduction of supporting materials, such as "self-supporting sliding FPC," "high-flex FPC," and "high-speed transmission FPC," as well as innovative products with self-supporting and high-flex capabilities. 【Features】 - Lamination, plating, and patterning technologies that support the manufacturing of characteristic impedance-controlled substrates - In-house developed order management systems and design/manufacturing tools that accommodate single prototype and development needs, as well as small to medium volume production of various types - Highly flexible and sliding flexible substrates *For more details, please refer to the external link page or feel free to contact us.

  • Wiring materials
  • Substrate

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If you are having difficulty realizing various aspects of printed circuit boards, please feel free to consult us.

If you are having difficulty realizing various aspects of printed circuit boards, please feel free to consult us.

We propose a manufacturing method that can fulfill our customers' requests based on our 54 years of know-how and experience!

We accept "printed circuit board manufacturing" at our company. If you are having difficulty realizing your project, please feel free to consult with us. 【Features】 - Materials that combine both flexible and rigid substrate materials - Other materials can also be ordered or supplied - Production can start from just one piece, with options for specifying delivery destinations, advancing production timelines, board specifications, partial processing, etc. - If you want to reduce costs, need specific processing, want to conduct processing tests with supplied materials, or have inquiries about specifications and manufacturing methods before production, we can assist. - We have equipment capable of handling large and long items, and we can manufacture comprehensively in-house. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts
  • Substrate

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High Current Flexible Circuit Board [*FPC Technology Catalog Available]

High Current Flexible Circuit Board [*FPC Technology Catalog Available]

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Printed Circuit Board
  • Substrate

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[Design and Production Example] Coil_FPC for Motor Field Windings

[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Substrate

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[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

Base PI thickness is 25μ, Cu thickness is 18μ! A case study of coil flex design and manufacturing aimed at achieving a strong magnetic field formation.

We would like to introduce a case study of the design and manufacturing of coil flex aimed at achieving a very small yet powerful magnetic field formation, as requested by the manufacturer. Within an outer dimension of approximately 4.0mm x approximately 3.0mm, we configured a single-sided structure with L/S=35μ/35μ, 6 turns x 3 blocks. Additionally, within an outer dimension of approximately 4.0mm x approximately 10.0mm, we configured a double-sided structure with L/S=70μ/50μ, 4 turns x 3 blocks. The materials used for both the single-sided and double-sided structures are adhesive-free, with a base PI thickness of 25μ and a copper thickness of 18μ. 【Case Overview】 ■ Materials Used - Single-sided: Adhesive-free material - Double-sided: Adhesive-free material ■ Base PI Thickness: 25μ ■ Copper Thickness: 18μ *For more details, please refer to the PDF document or feel free to contact us.

  • Inductor Coil
  • Contract manufacturing
  • Other contract services
  • Substrate

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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Substrate

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Prototype circuit board support

Prototype circuit board support

We will respond to prototype production, handle each process individually, and accommodate all aspects of a single prototype with a short delivery time.

Our company offers support for prototype circuit boards, with individual responses for each process, and we handle all aspects of a single prototype with a short lead time. 【Features】 ■ Support starting from one prototype ■ Quick response and short lead time ■ Comprehensive support from design to implementation, with individual process handling *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Image Analysis Using a Microscope / Flexible Substrate Mock Production

Image Analysis Using a Microscope / Flexible Substrate Mock Production

It is possible to create a simple mock-up of the base for those who want to analyze the internal structure of FPC products, troubleshoot issues, or pre-verify complex product shapes.

We would like to introduce the services provided by Stay Electronics Co., Ltd. The "Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter" is a service that creates simple mock-ups of flexible circuit boards using polyimide film for those who have never handled flexible circuit boards before or wish to pre-validate complex product shapes. Additionally, the "Image Analysis using a Super Depth Multi-Angle Lens Microscope" can be utilized for internal structure analysis and defect analysis of FPC products. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi [Service Operations] ■ Image Analysis using a Super Depth Multi-Angle Lens Microscope ■ Flexible Circuit Board Mock Production using a High-Performance Cutting Plotter *For more details, please refer to the PDF document or feel free to contact us.

  • Microscope
  • Substrate

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Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Space-saving can be achieved! A multilayer flexible substrate that can reduce manufacturing costs.

Multilayer flexible circuit boards help save space! When wiring in tight spaces, it can become densely packed. By using multilayer flexible circuit boards, it is possible to arrange components while maintaining a certain degree of flexibility and thinness. We are available for consultation even from the decision-making stage, so please feel free to contact us★ 【Features】 ○ Reduction in soldering points ○ Elimination of wiring errors ○ Improved reliability ○ Labor-saving in processing and assembly ○ Reduction in manufacturing costs For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Substrate

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【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

【Ultra-Short Delivery Response】For last-minute requests during the New Year holidays, contact Matsuwa Sangyo!

With the "Breakthrough Course," you can ship printed circuit boards in as little as 12 hours! Let's make circuit boards this year and welcome a refreshing New Year!

The year 2024 is about to come to an end in the blink of an eye. Are there any circuit boards you are about to give up on arranging for delivery by the end of the year? If you consult with Matsuwa Sangyo, known for its ultra-short delivery times, we can accommodate your desired schedule even with tight timelines. Common year-end and New Year’s issues can be resolved with Matsuwa, making us a strong ally for your company! - Through-hole boards ⇒ as fast as 1.05 days! - Through-hole resin-filled boards ⇒ as fast as 2.1 days! - 1-2-1 build-up boards ⇒ as fast as 3 days! - FPC boards ⇒ as fast as 2 days! - 4-layer rigid FPC boards ⇒ as fast as 5 days! Furthermore… with our unbeatable <Limit Break Course>, - 4-layer through-hole boards ⇒ 17 hours - 6-layer through-hole resin-filled boards ⇒ 24 hours - 1-2-1 build-up ⇒ 48 hours - 6-layer 2-2-2 build-up ⇒ 72 hours to complete the boards! Our impressive delivery capabilities are made possible by Matsuwa Sangyo’s fully in-house manufacturing and 24-hour factory operations. Additionally, our compliance rate of 99.94% is another attractive feature. We guarantee delivery by the promised deadline. For more details, please refer to our catalog or feel free to contact us through our website.

  • Printed Circuit Board
  • Substrate

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Printed Circuit Board Business Products and Services

Printed Circuit Board Business Products and Services

Improved performance in heat dissipation, dust resistance, and water resistance! Ensures the reliability of the mounted circuit board.

At Yoho Electronics, we achieve high product quality and reduced lead times through a consistent production system, unique manufacturing technology, and a quality control framework. The supported substrates include double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), and ceramic boards. By molding (resin encapsulation) the assembled boards, we enhance performance in heat dissipation, dust resistance, and drip resistance, ensuring the reliability of the assembled boards. In addition to molding, we can also accommodate substrate coating. 【Products and Services】 <Supported Substrates> ■ Double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), ceramic boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Circuit board processing machine
  • Substrate

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

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  • ビアフィリングマンガ.png
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Ultra-small, high-precision flexible substrate

Ultra-small, high-precision flexible substrate

Custom-made high-definition and ultra-high-definition substrates with narrow pitch! Leave it to us for flexible substrates (high-definition FPC)!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We cater to customer needs with features such as staggered layout narrow pitch, single-sided narrow pitch BGA, and sensor coils with both sides pitch, as well as single-sided, double-sided, and multilayer options. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Single-sided 20μ pitch ■ Subtractive method ■ Staggered layout narrow pitch ■ Semi-additive method *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • Substrate

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Interposer flexible substrate

Interposer flexible substrate

Are you having trouble procuring build-up substrates for the main board?

By adopting it for the IC substrate of the locally high-density part of the main board, it achieves a reduction in the specifications of the main board, which can be used for semiconductor packages and lead frames.

  • Other semiconductors
  • Substrate

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Substrate manufacturing, substrate materials, special processing achievements

Substrate manufacturing, substrate materials, special processing achievements

We handle various types of substrates. We also accept inquiries regarding base materials and substrate processing.

Substrate materials FR-4, EL230T, HL950SK, MCL-FX-II, MEGTRON6, MCF-5000I, FPC, and others.

  • others
  • Substrate

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Ultra-small, high-precision flexible substrate

Ultra-small, high-precision flexible substrate

Custom-made support for narrow pitch high-definition and ultra-high-definition substrates! Leave flexible substrates (high-definition FPC) to us!

Our company is a specialized manufacturer of circuit boards, celebrating approximately 50 years this year. With our extensive experience and track record in solving various challenges in flexible circuit boards, we can produce high-resolution FPC prototypes in a short lead time, covering everything from cost considerations to prototype manufacturing and mass production. We utilize advanced techniques such as micro-hole processing using chemical etching, BVH connections, and polyimide micro-hole processing technology that allows for simultaneous hole drilling to meet our customers' needs. Please feel free to contact us with your requests. 【Features】 ■ Custom-made high-resolution and ultra-high-resolution boards with narrow pitch ■ Micro-hole processing and BVH connections using chemical etching ■ Introduction of polyimide micro-hole processing technology that allows for simultaneous hole drilling *For more details, please download the PDF or contact us.

  • Board to FPC connector
  • Substrate

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Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Are you facing any issues with flexible substrates? We have extensive experience in various fields, including medical devices and automotive control systems.

This is an introduction to our "Flexible Circuit Board Manufacturing." "Flexible Printed Circuit Boards" are used in applications such as communication devices and measurement instruments, and we handle various types including "Single-Sided FPC," "Double-Sided FPC," and "Rigid-Flex." Materials used include polyimide and polyester. For "Multilayer Flex" and "Rigid-Flex," we collaborate with partner companies for production. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi 【Product Achievements (Excerpt)】 ■ Flexible for ultrasound diagnostic probes ■ Flexible for motor field winding (for high electromagnetic field generation) ・Source: Gunma University ■ Flexible for superconducting devices operating at -269℃ (for superconducting circuit evaluation) ・Main Source: Yokohama National University *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • Substrate

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Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

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  • Wiring materials
  • Substrate

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Low transmission loss substrate "xCH3008H" and "xCCF-500"

Low transmission loss substrate "xCH3008H" and "xCCF-500"

A substrate for millimeter-wave radar that suppresses transmission loss and prevents collisions.

■ "xCH3008H" This is a glass cloth reinforced substrate that uses ultra-low roughness copper foil, suppressing the dielectric loss tangent and linear expansion coefficient compared to conventional fluoroplastic substrates (CGP-500A). Generally, fluoroplastic substrates are considered difficult to laminate, but it is also possible to laminate with dissimilar substrates such as FR-4. 【Charateristics】 DK3, DF0.0011, CTE (X:11, Y:11, Z:54) ■ "xCCF-500" This is a glass cloth-free substrate that uses a special fluoroplastic film as a dielectric and ultra-low roughness foil. 【Characteristics】 DK3, DF0.0013, CTE (X:28, Y:29, Z:29) *For more details, please refer to the PDF materials or feel free to contact us.

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  • High frequency/microwave parts
  • Substrate

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