We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Aug 05, 2026～Sep 01, 2026
This ranking is based on the number of page views on our site.

Substrate Product List

181～208 item / All 208 items

Displayed results
[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

How flexible printed circuit boards save space in harsh automotive and industrial environments.

We are currently offering a webinar titled "Flexible Printed Circuits (#FPC) with Japanese Subtitles." In today's continuously evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into limited spaces. As the emergence of new communication protocols increases complexity, power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges. [Learning Content] ■ Space-saving techniques ■ Addressing protocol complexity ■ Strengthening design metrics ■ Promoting efficient reuse *For more details, please feel free to contact us.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Electronic device development

Electronic device development

We provide board development solutions.

We provide planning and development solutions for electronic device development through a comprehensive technical approach from both hardware and software. With our accumulated technology and the latest electronics technology, we respond to various requests in hardware development and help realize our customers' product visions.

  • Printed Circuit Board
  • EMS
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Foresight glass print wiring board

Foresight glass print wiring board

We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.

It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.

  • Touch Panel
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Evaluation of the "56G-PAM4 Board" implementation completed.

Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

From procurement of glass materials to film processing! There are also high-performance glass cutting holes that can beautifully cut glass with protective sheets.

At DRS, we perform various glass processing operations, including cutting, beveling, polishing, printing, and AG/AR/AF processing. We handle everything from the procurement of glass materials to film formation processing, providing various manufacturers and types of glass materials. We also accept size reduction cutting processing for photomask substrates, accommodating customer requests from single prototypes to mass production. Additionally, we offer the high-performance glass cutting tool 'FINE SCRATCH', which is suitable for cutting glass for FPD applications. It achieves high-strength cutting that minimizes horizontal cracking. Stable cutting can also be performed on glass substrates with metal deposition films. 【Types of Glass Materials】 ■ Gorilla Glass ■ Dragontrail Glass ■ Soda Lime Glass ■ Non-Alkali Glass *For more details, please refer to the PDF materials or feel free to contact us.

  • image_13.png
  • image_01.png
  • image_03.png
  • Processing Contract
  • Glass
  • Other contract services
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
We will be exhibiting at the 2024 International Aerospace Exhibition!

We will be exhibiting at the 2024 International Aerospace Exhibition!

We will exhibit at the 2024 International Aerospace Exhibition and the 2024 New Technology Creation Exchange Meeting!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory, with a fully integrated production process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Since surface treatment, such as gold flash, is also handled in-house, there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even if the material has no processing track record, we are flexible in accommodating your needs! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate," why not start with a light consultation? - 2024 International Aerospace Exhibition ⇒ 10/16 (Wed) - 10/18 (Fri) @ Tokyo Big Sight Please be sure to stop by the Matsuwa Sangyo booth on the day!

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flexible printed circuit board (FPC) impedance control

Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Flexible printed circuit board (FPC) short delivery time

Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss flexible substrate for wearables

High heat-resistant, low-loss flexible substrate for wearables

A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss flexible substrate for home appliances

High heat-resistant, low-loss flexible substrate for home appliances

A flexible substrate that achieves slim, high-performance home appliances with high heat resistance and low loss.

In the home appliance industry, there is a simultaneous demand for thinner and higher-performance products. To maintain high performance within limited space, it is important to miniaturize the circuit board and reduce the loss of high-frequency signals. Our high heat-resistant, low-loss flexible circuit boards contribute to the improvement of home appliance performance by achieving thinness while providing high heat resistance and low loss characteristics. 【Application Scenarios】 - Thin televisions - Smartphones - Wearable devices 【Benefits of Implementation】 - Miniaturization of products - Reduction of high-frequency signal loss - Improvement of product reliability

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss flexible substrate for IoT devices

High heat-resistant, low-loss flexible substrate for IoT devices

Flexible substrate that contributes to power saving of IoT devices with high heat resistance and low loss.

In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss flexible substrate for robotics

High heat-resistant, low-loss flexible substrate for robotics

Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed 5G communication.

In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed communication.

In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Aerospace-grade high heat-resistant, low-loss flexible substrate

Aerospace-grade high heat-resistant, low-loss flexible substrate

Flexible substrates for aerospace applications that achieve both lightweight and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. At the same time, high safety and reliability are required, making electronic components that can perform stably even in harsh environments crucial. Our high heat-resistant, low-loss flexible circuit boards are lightweight yet equipped with high heat resistance, low loss characteristics, and chemical resistance, meeting the stringent demands of aerospace applications. 【Application Scenarios】 * Aircraft * Space probes * Satellites * Electronic devices requiring weight reduction 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Stable operation in harsh environments * High reliability * Increased design flexibility

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

A flexible substrate that achieves high reliability even in harsh automotive environments.

In the automotive industry, the miniaturization and high performance of electronic devices are advancing, while high reliability is also required. Electronic components must operate stably even in harsh environments such as engine rooms and vehicle interiors, where temperature changes, vibrations, and oil exposure occur. Conventional flexible printed circuits have faced challenges regarding heat resistance and chemical resistance. Our all-LCP flexible printed circuits address these issues and contribute to improving the reliability of automotive electronic devices. 【Application Scenarios】 - Engine control units - In-vehicle displays - Various sensors - ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Stable operation in high-temperature environments - High durability against vibrations and shocks - Suppression of degradation from oil and chemicals - Assurance of long-term product lifespan

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss flexible substrate for medical devices

High heat-resistant, low-loss flexible substrate for medical devices

Flexible substrates contributing to the miniaturization and high performance of precision medical devices.

In the medical device industry, there is a demand for miniaturization and high-density implementation of equipment to enable precise diagnosis and treatment. Particularly in medical devices that handle high-frequency signals, it is crucial to minimize signal loss and ensure stable operation. Conventional substrates may face challenges such as performance degradation and signal loss due to heat and humidity. Our high heat-resistant, low-loss flexible substrates address these issues and contribute to improving the reliability of medical devices. 【Application Scenarios】 - Medical devices such as endoscopes and catheters - Imaging diagnostic equipment such as MRI and CT scanners - Surgical robots 【Benefits of Implementation】 - Improved operability through miniaturization and lightweight design - Enhanced diagnostic accuracy through stable transmission of high-frequency signals - High reliability in harsh environments

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

[For Defense] High Heat Resistance and Low Loss All LCP Flexible Circuit Board

A highly durable flexible substrate that demonstrates stable performance even in harsh environments.

In the defense sector, the reliability of equipment and long-term operation are required. Particularly for electronic devices used in harsh environments such as temperature changes, vibrations, and shocks, the durability of the substrate is crucial. Conventional substrates may experience performance degradation in high-temperature environments and damage to joints due to vibrations. Our high-heat-resistant, low-loss all-LCP flexible substrates offer high heat resistance, low moisture absorption, and chemical resistance, providing stable performance even in harsh conditions. 【Application Scenarios】 - Military communication equipment - Aerospace equipment - Missile systems - Radar systems 【Benefits of Implementation】 - High reliability in harsh environments - Long product lifespan - Reduction in maintenance costs

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss LCP flexible substrate for data centers

High heat-resistant, low-loss LCP flexible substrate for data centers

Solving heat management and signal loss in high-density data centers.

In the data center industry, the high-density implementation of servers is advancing, and the increase in heat generation and losses due to faster signals are becoming challenges. High density is essential for processing more information in limited space, but it simultaneously causes issues such as performance degradation due to heat and signal attenuation. Our high-heat-resistant, low-loss all-LCP flexible circuit boards address these challenges. 【Usage Scenarios】 - High-density implementation servers - High-speed communication devices - High-frequency compatible circuit boards 【Benefits of Implementation】 - Improved long-term reliability due to high heat resistance - Maintenance of signal quality due to low-loss characteristics - Contribution to space-saving solutions

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss flexible substrate for displays

High heat-resistant, low-loss flexible substrate for displays

Flexible substrate with high heat resistance and low loss that contributes to high-quality displays.

In the display industry, there is a demand for high image quality, along with thinner products and high-density mounting. Particularly in displays that operate in high-temperature environments or use high-frequency signals, the heat resistance and low loss characteristics of the substrate are essential for maintaining product performance. Inappropriate substrates can lead to display malfunctions or performance degradation. Our high heat-resistant, low loss flexible substrates meet the demands of high-quality displays. 【Usage Scenarios】 - High-definition displays - Displays compatible with high-frequency signals - Displays used in high-temperature environments 【Benefits of Implementation】 - Achievement of high-quality display - Improvement in product reliability - Contribution to thinner designs and high-density mounting

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High heat-resistant, low-loss all-LCP flexible substrate for semiconductor manufacturing.

High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.

In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends

Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.

  • Printed Circuit Board
  • Adhesive tape
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Mouse Emulation System [Embedded System Development Case Study]

Mouse Emulation System [Embedded System Development Case Study]

Capture and process analog waveforms! Leave FPGA development to us.

We would like to introduce a case where we delivered a mouse emulation system to a display manufacturer. The company requested whether we could develop an FPGA program for an FPGA-equipped board and a LabVIEW program that communicates with the FPGA-equipped board via USB to execute mouse emulation on a PC. Our company has a proven track record in FPGA development, and we have a specialized partner who excels in LabVIEW programming. In this case, the client has expressed satisfaction after delivery. [Case Overview] ■ Request - Development of an FPGA program for an FPGA-equipped board and a LabVIEW program ■ Our Strengths - Proven track record in FPGA development - Specialized partner for LabVIEW programming ■ Result: The client is satisfied after delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit board design high-frequency board

Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Industrial ITX motherboard 'MIX-H810WV1' with rich I/O.

Equipped with a wide range of USB, serial, and video outputs. An ideal Mini-ITX board for embedding in industrial equipment that requires multiple input/output control.

The "MIX-H810WV1" is a Mini-ITX motherboard designed for industrial equipment that requires a variety of I/O options. It comes standard with a powerful array of interfaces that can connect directly to diverse devices, including USB3.2 Gen2×2, USB2.0×4, four serial ports (RS-232/422/485), 8-bit DIO, and HDMI/DP. The CPU can be selected from the Intel Core Ultra 200S series (LGA1851). It supports DDR5 SODIMM×2 (up to 96GB), ensuring stable operation even in control and monitoring systems that require long-term operation. Additionally, with M.2, SATA, and PCIe Gen5, adding storage or dedicated cards is easy. With a DC12-24V input and an operating range of 0-60°C, it can be safely used in a wide range of environments, including manufacturing lines, FA equipment, and embedded PCs. *CPU, memory, storage, and OS are not included.

  • Embedded Board Computers
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Mini-ITX motherboard for industrial machinery integration 'MIX-H810WV1'

Achieves high-speed computation and stability. An industrial Mini-ITX motherboard that can be smoothly integrated into NC devices, control panels, and automated processing equipment.

The industrial Mini-ITX motherboard 'MIX-H810WV1' is designed with a focus on the required "stable operation," "high-speed response," and "long-term supply" for control systems in working machinery. By adopting the latest Intel Core Ultra 200S series, it can comfortably handle complex interpolation calculations and high-speed communication with peripherals. It is equipped with specifications that support high-speed processing for control applications, including up to 96GB of DDR5 memory, PCIe Gen5 x4, and M.2 NVMe. Standard I/O includes USB3.2, 2.5GbE x2, serial x4, and DIO, ensuring connectivity with on-site PLCs, sensors, and display devices, and it serves as a central controller for NC devices and automation equipment. It supports DC 12-24V input and operates within a temperature range of 0-60°C, demonstrating robustness suitable for installation inside machinery.

  • Embedded Board Computers
  • Substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to Substrate

IPROS Services
COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.