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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
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Substrate Product List

181～210 item / All 220 items

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Circuit board "Arm Frogs BLUE"

Circuit board "Arm Frogs BLUE"

Space-saving, high reliability, high precision! A board that is also optimal for industrial applications and evaluation boards.

Gofeltec's "Arm Frogs BLUE" is a space-saving, highly reliable, and high-precision circuit board that combines a CPU and FPGA into a single chip. It supports ECC, making it ideal for industrial applications. It can also be used as a PCIe card and is perfect as an evaluation board. The SoC part is on a separate board, allowing for direct mass production of the SoC after evaluation. 【Features】 ■ CPU and FPGA in one chip ■ Supports ECC, making it ideal for industrial applications ■ Can be used as a PCIe card, perfect for evaluation boards ■ SoC part on a separate board ■ Space-saving, highly reliable, and high-precision circuit board *For more details, please refer to the PDF materials or feel free to contact us.

  • Evaluation Board
  • Printed Circuit Board
  • Memory
  • Substrate

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M.2-FMC conversion adapter board

M.2-FMC conversion adapter board

M.2-FMC conversion adapter board compatible with Intel/Xilinx FPGA evaluation boards. Supports connection of up to 2 M.2 NVMe SSDs.

The 【AB17-M2FMC】 is an adapter board that converts 8 channels of high-speed differential signals (DP0-DP7) from the FMC expansion interface into two 4-lane PCI standard M.2 interfaces. It can be applied to various evaluation boards from Intel/Xilinx that implement the FMC interface. Additionally, this adapter is required when evaluating the NVMe-IP core from DesignGateway.

  • ASIC
  • Board to Board Connectors
  • Substrate

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We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition! Printed Circuit Boards [SHOWA]

Anyway, it's fast! Leave the printed circuit boards to 【SHOWA】!

Our company is one of Japan's leading ultra-fast printed circuit board manufacturers. We possess top-level equipment and specialize in the production of high-difficulty circuit boards. With over 30 years of industry experience, we currently have business dealings with more than 2,200 companies in Japan. Of course, in addition to circuit board manufacturing, we can also accommodate customer requests for AW design and component mounting. 【Build-up Boards】⇒ We can handle narrow pitch BGA mounting, multi-layer builds, and any layer configurations. 【Heat Dissipation】⇒ We can accommodate aluminum base boards, high thermal conductivity CEM-3, and copper inlay boards. 【Thick Copper Boards】⇒ We can handle high current boards, thicker plating in through holes, and automotive boards. 【Flexible Boards】⇒ We can accommodate FPC, multi-layer FPC, rigid FPC, and transparent polyimide FPC. 【High Frequency】⇒ We have standard stock of Megtron 6 (manufactured by Panasonic) and have processing experience with many low dielectric constant materials. 【Special Processing】⇒ We can also accommodate bump formation and back drilling. ↓ Please also visit our website https://www.showanet.jp/ We look forward to hearing from you.

  • Printed Circuit Board
  • Substrate

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Development Board Example: "High-Speed Optical Data Processing Board"

Development Board Example: "High-Speed Optical Data Processing Board"

Introducing examples of development boards created using advanced embedded technology!

At Toyo Electric Co., Ltd., which engages in engineering business, we handle various development boards. The "High-Speed Optical Data Processing Board" samples large amounts of data from the upper layer at high speed and converts and transmits it into optical data according to requirements. Our company supports everything from circuit design to embedded software development, providing development tailored to customer needs. 【Features】 ■ External Interface - Optical Input/Output SFP (3.125Gbps) × 3 channels - PCI Express Gen1 × 4 ■ Equipped with FPGA *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • Circuit board design and manufacturing
  • Embedded Board Computers
  • Substrate

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Simulation-based substrate design

Simulation-based substrate design

If you provide the required specifications, we will propose suitable board specifications and designs.

We will solve various issues related to printed circuit boards through simulation. We provide one-stop solutions for printed circuit boards that balance performance and cost. If you provide us with your required specifications, we can propose suitable board specifications and designs, leveraging our extensive background data and manufacturing technology unique to PCB manufacturers to suggest optimal characteristics. [Issues] - Non-functional, distorted waveforms, do not meet standards - Unstable operation under high load - Time-consuming cause investigation and countermeasures - Do not meet EMC standards *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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[Space Station] FPC for the Space Industry - Lightweight and Highly Reliable Flexible Circuit Board

[Space Station] FPC for the Space Industry - Lightweight and Highly Reliable Flexible Circuit Board

High-reliability FPC contributing to the life support system of the space station.

In the life support systems of space stations, high reliability capable of withstanding long-term operation in extreme environments and efficient wiring in limited spaces are required. Equipment related to life support is difficult to repair or replace once installed, making reliable performance and durability at the initial stage essential. Our FPC for the space industry has been developed to meet these stringent demands. 【Application Scenarios】 - Wiring within life support devices - Environmental control systems - Connections for sensors - Emergency response equipment 【Benefits of Implementation】 - Space-saving through miniaturization and lightweight design of equipment - Flexible wiring solutions for complex structures - Assurance of long-term reliability

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  • Printed Circuit Board
  • connector
  • Substrate

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Delivery record: Platform substrate

Delivery record: Platform substrate

Systematizing measurement and mechatronics! Introducing the delivery achievements of Applied Electric.

At Applied Electric, we specialize in non-standard small-lot production and are constantly handling and delivering a wide variety of products, numbering in the thousands. In response to customer requests, we develop and design controllers that serve as the core of inspection and control devices, using suitable CPUs and FPGAs. [Development Examples] ■ CPU: H8, SH-2, SH-2A, SH-3, SH-4, SH-4A, RX, i.MX3x, ARM, DSP ■ Communication: USB2.0, USB3.0, 1G/100/10baseT, RocketIO, MIPI ■ Bus: VME, CompactPCI, PCI, PCIExpress *For more details, please refer to the PDF materials or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Other inspection equipment and devices
  • Circuit board design and manufacturing
  • Substrate

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Printed circuit board assembly fine pitch board

Printed circuit board assembly fine pitch board

We provide support for everything from the design and development of various microcontroller controllers to printed circuit board assembly and controller assembly.

We will strive for further "evolution and development" under the theme of "Creative, Evolving, Developing Enterprises."

  • Circuit board design and manufacturing
  • Substrate

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[For Space Medicine] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

[For Space Medicine] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

High-reliability FPC contributing to the miniaturization and lightweighting of space medical devices.

In the field of space medicine, there is a demand for miniaturization, lightweight design, and high reliability in devices such as biometric measurement instruments. Particularly for devices that are worn on the human body or intended for use in limited spaces, these factors are directly linked to the performance and safety of the products. Inappropriate design or materials can lead to device failures, malfunctions, and even impact on patients. Our FPC for the space industry provides solutions that leverage thinness, lightness, and flexibility to address these challenges, supporting the further development of biometric measurement devices. 【Usage Scenarios】 - Compact and lightweight biometric sensors - Wearable medical devices - Medical devices for use in space - Medical devices with complex shapes 【Benefits of Implementation】 - Improved wearability through miniaturization and lightweight design - Flexible wiring solutions for complex structures - Ensured safety through high reliability - Increased design freedom due to space-saving features

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  • Printed Circuit Board
  • connector
  • Substrate

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[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

[Web Seminar Now Available] Flexible Printed Circuits with Japanese Subtitles

How flexible printed circuit boards save space in harsh automotive and industrial environments.

We are currently offering a webinar titled "Flexible Printed Circuits (#FPC) with Japanese Subtitles." In today's continuously evolving environment, it is crucial for engineers in both the automotive and industrial sectors to incorporate more functionality into limited spaces. As the emergence of new communication protocols increases complexity, power density and signal integrity are becoming more critical design elements. Significant investments are made in custom designs, making reuse essential. In this webinar, a senior manager from Molex's FPC division will share insights based on 14 years of design expertise, exploring how flexible printed circuits (FPC) address these modern challenges. [Learning Content] ■ Space-saving techniques ■ Addressing protocol complexity ■ Strengthening design metrics ■ Promoting efficient reuse *For more details, please feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Electronic device development

Electronic device development

We provide board development solutions.

We provide planning and development solutions for electronic device development through a comprehensive technical approach from both hardware and software. With our accumulated technology and the latest electronics technology, we respond to various requests in hardware development and help realize our customers' product visions.

  • Printed Circuit Board
  • EMS
  • Substrate

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Foresight glass print wiring board

Foresight glass print wiring board

We will form circuit patterns of thick copper on glass using the subtractive method and semi-additive method.

It has a high transmittance and can be used for substrates of optical passive components. It has a low coefficient of thermal expansion, excellent dimensional stability, and mounting reliability. It has minimal warping, excellent flatness, and is easy to mount.

  • Touch Panel
  • Substrate

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Evaluation of the "56G-PAM4 Board" implementation completed.

Evaluation of the "56G-PAM4 Board" implementation completed.

We will support the upcoming high-speed communication standards with PAM4 signal communication boards!

To Matsudo Co., Ltd. and RITA Electronics, the main FPGA board for the '56G-PAM4 communication board' created during the technical study session aimed at solving customer challenges has been completed! After completing the basic checks, we will proceed with waveform verification using this board and continue to verify the operation in combination with the evaluation boards that will be successively completed thereafter. In an increasingly high-speed communication environment, we aim to accumulate high-speed technologies leading to PCIe Gen6.0, DDR, and 400G Ethernet, and provide solutions to our customers.

  • Communications
  • Circuit board design and manufacturing
  • Substrate

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Lightweight and Highly Reliable Flexible Circuit Board for Space Probes

Lightweight and Highly Reliable Flexible Circuit Board for Space Probes

High-reliability FPC contributing to sensor connections of space exploration vehicles.

In space probes and related equipment, lightweight design, high-density wiring, and extremely high reliability are required to achieve advanced functionality in limited space. Particularly in sensor connections, it is essential to accurately transmit weak signals and maintain stable operation even in harsh space environments. Improper wiring design or unreliable components can directly impact the success of a mission. Our FPCs for the space industry address these challenges and support the performance enhancement of probes and the success of missions. 【Usage Scenarios】 - Connection with sensors of the probe body - Internal wiring of observation equipment - Wiring for devices requiring miniaturization and lightweight design 【Benefits of Implementation】 - Contribution to increased payload capacity through miniaturization and lightweight design of equipment - Improved design flexibility through flexible wiring for complex structures - Maintenance of mission execution capability due to high reliability

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  • Printed Circuit Board
  • connector
  • Substrate

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FPC for Satellite Communication: Lightweight and Highly Reliable Flexible Circuit Board for the Space Industry

FPC for Satellite Communication: Lightweight and Highly Reliable Flexible Circuit Board for the Space Industry

High-reliability FPC contributing to the miniaturization and lightweighting of satellites and space equipment.

In the satellite communication industry, the reliability of equipment in space and miniaturization and lightweight design are essential. In particular, maintaining stable communication performance over long periods is crucial for signal transmission. Equipment failures or performance degradation directly impact the success of missions, necessitating high reliability. Our FPC for the space industry addresses these challenges and supports further miniaturization, lightweight design, and high reliability of space equipment. 【Usage Scenarios】 - Internal wiring of satellites - Signal transmission for probes - Areas requiring miniaturization and lightweight design of space equipment 【Benefits of Implementation】 - Reduction in launch costs due to lightweight equipment - Increased number of onboard devices due to space-saving design - Flexible wiring solutions for complex structures

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  • Printed Circuit Board
  • connector
  • Substrate

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[Space Antenna] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

[Space Antenna] Lightweight and Highly Reliable Flexible Printed Circuit Board for the Space Industry

High-reliability FPC contributing to the miniaturization and lightweighting of space antennas.

In the field of space antennas, it is essential to maintain high signal reception performance within limited space and weight. Particularly in the harsh environment of outer space, the reliability of equipment becomes extremely important. Since repair or replacement in the event of a malfunction is difficult, ensuring high reliability at the initial stage is crucial. Our FPC for the space industry addresses these challenges and supports the miniaturization, lightweight design, and high reliability of antenna equipment. 【Usage Scenarios】 - Antennas mounted on satellites and probes - Space equipment requiring miniaturization and lightweight design - Wiring for complex shapes or confined spaces 【Benefits of Implementation】 - Overall weight reduction and miniaturization of antenna equipment - Reduction of wiring space - Performance improvement through high-density wiring - Assurance of high reliability in outer space

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  • 宇宙向けFPC　パネル.png
  • Printed Circuit Board
  • connector
  • Substrate

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Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

Trends in the development of high-functionality, compact, and lightweight materials for automotive control devices, components, and electrical materials.

~Technologies for ensuring high reliability, wiring, and miniaturization of inverters centered around metal substitute resin components~

★Development status of new plastic materials for electrification and weight reduction! Development of PBT resin with high reliability! ★What characteristics are required for automotive FPC (Flexible Printed Circuit)? Which components can contribute to weight reduction? ★What are the needs for thermal conductivity and material strength? Are there parts that cannot be replaced by metals? ★What technological innovations are most important for achieving miniaturization of inverters and automotive electronic products? 【Speakers】 Part 1: Representative from Japan Mectron Co., Ltd. AI Business Division, Automotive FPC Planning Department Part 2: Representative from Polyplastics Co., Ltd. Technical Solution Center Part 3: Mr. Hideo Shikano, Director of Lintec Engineering Office Part 4: Mr. Yoshihiro Kamiya, Hardware Development Department, Electrical and Electronic Technology Development Division, Denso Corporation 【Venue】 Tekuno Kawasaki, 4th Floor Conference Room [Kanagawa, Kawasaki] 【Date and Time】November 26, 2013 (Tuesday) 10:30-16:35

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Substrate

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Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

Various glass substrates and processing *Capable of handling everything from a single prototype to mass production.

From procurement of glass materials to film processing! There are also high-performance glass cutting holes that can beautifully cut glass with protective sheets.

At DRS, we perform various glass processing operations, including cutting, beveling, polishing, printing, and AG/AR/AF processing. We handle everything from the procurement of glass materials to film formation processing, providing various manufacturers and types of glass materials. We also accept size reduction cutting processing for photomask substrates, accommodating customer requests from single prototypes to mass production. Additionally, we offer the high-performance glass cutting tool 'FINE SCRATCH', which is suitable for cutting glass for FPD applications. It achieves high-strength cutting that minimizes horizontal cracking. Stable cutting can also be performed on glass substrates with metal deposition films. 【Types of Glass Materials】 ■ Gorilla Glass ■ Dragontrail Glass ■ Soda Lime Glass ■ Non-Alkali Glass *For more details, please refer to the PDF materials or feel free to contact us.

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  • Processing Contract
  • Glass
  • Other contract services
  • Substrate

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We will be exhibiting at the 2024 International Aerospace Exhibition!

We will be exhibiting at the 2024 International Aerospace Exhibition!

We will exhibit at the 2024 International Aerospace Exhibition and the 2024 New Technology Creation Exchange Meeting!

Build-up substrates, high-frequency substrates, FPC and rigid FPC substrates... All of these are manufactured in-house at our own factory, with a fully integrated production process! The ultra-short delivery times achieved by eliminating outsourcing are astonishingly fast! Since surface treatment, such as gold flash, is also handled in-house, there are no fluctuations in delivery times! Not only the delivery times but also the wide range of materials we handle is one of the attractions of Matsuwa Sangyo. Even if the material has no processing track record, we are flexible in accommodating your needs! We accept orders for any type of substrate, even in small quantities, so if you have even a slight desire to "want to make a substrate," why not start with a light consultation? - 2024 International Aerospace Exhibition ⇒ 10/16 (Wed) - 10/18 (Fri) @ Tokyo Big Sight Please be sure to stop by the Matsuwa Sangyo booth on the day!

  • Printed Circuit Board
  • Substrate

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Flexible printed circuit board (FPC) impedance control

Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services
  • Substrate

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Flexible printed circuit board (FPC) short delivery time

Flexible printed circuit board (FPC) short delivery time

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We will respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we will manufacture high-performance flexible circuit boards with impedance control during artwork design. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Substrate

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for wearables

High heat-resistant, low-loss flexible substrate for wearables

A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.

As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics

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  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for home appliances

High heat-resistant, low-loss flexible substrate for home appliances

A flexible substrate that achieves slim, high-performance home appliances with high heat resistance and low loss.

In the home appliance industry, there is a simultaneous demand for thinner and higher-performance products. To maintain high performance within limited space, it is important to miniaturize the circuit board and reduce the loss of high-frequency signals. Our high heat-resistant, low-loss flexible circuit boards contribute to the improvement of home appliance performance by achieving thinness while providing high heat resistance and low loss characteristics. 【Application Scenarios】 - Thin televisions - Smartphones - Wearable devices 【Benefits of Implementation】 - Miniaturization of products - Reduction of high-frequency signal loss - Improvement of product reliability

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  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for IoT devices

High heat-resistant, low-loss flexible substrate for IoT devices

Flexible substrate that contributes to power saving of IoT devices with high heat resistance and low loss.

In the IoT device industry, there is a demand for miniaturization while simultaneously extending battery life. Particularly in devices that operate in high-temperature environments or use high-frequency signals, the performance of the substrate significantly impacts the overall power efficiency of the device. Conventional substrates have sometimes hindered power saving due to issues with high-frequency signal loss and heat resistance. Our high-heat-resistant, low-loss flexible substrate contributes to the power efficiency of IoT devices with its low-loss characteristics and high heat resistance. 【Usage Scenarios】 - Wearable devices - Smart sensors - Industrial IoT equipment 【Benefits of Implementation】 - Extended battery life - Miniaturization of devices - Stable transmission of high-frequency signals

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  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss flexible substrate for robotics

High heat-resistant, low-loss flexible substrate for robotics

Ideal for movable parts such as robotic arms. Achieves stable operation even in harsh environments.

In the robotics industry, devices with many movable parts, such as robotic arms and sensors, require high flexibility and durability. In particular, reliability that can withstand wiring in tight spaces and repetitive motions is crucial. Conventional circuit boards may face issues such as disconnection of movable parts or performance degradation in high-temperature environments. Our high heat-resistant, low-loss flexible circuit boards address these challenges. 【Application Scenarios】 - Movable parts of robotic arms - Sensor devices - Wiring in confined spaces 【Benefits of Implementation】 - High flexibility and durability - Stable operation in harsh environments - Space-saving design

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed 5G communication.

In the 5G communication industry, substrates with excellent high-frequency characteristics are required to ensure stable high-speed data transmission. It is particularly important to minimize signal loss and maintain performance even in high-temperature environments. Conventional substrates may lead to issues with high-frequency signal loss and heat resistance, potentially resulting in decreased communication speeds and equipment failures. Our high-heat-resistant, low-loss flexible substrates achieve both low-loss characteristics and high heat resistance, contributing to the acceleration of 5G communication. 【Usage Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Reduction of high-frequency signal loss - Stable operation in high-temperature environments - Improvement in communication speed

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

High Heat Resistance and Low Loss All-LCP Flexible Substrate for 5G Communication

Flexible substrates with high heat resistance and low loss that support high-speed communication.

In the 5G communication industry, components with excellent high-frequency characteristics are required to achieve high-speed data transmission. It is particularly important to minimize signal transmission loss and ensure stable communication quality. Conventional substrates may face challenges with losses in the high-frequency range. Our high-heat-resistant, low-loss all-LCP flexible substrates utilize low dielectric constant materials to reduce losses of high-frequency signals, contributing to the acceleration of 5G communication. 【Application Scenarios】 - Base stations - High-speed data communication devices - High-frequency circuits 【Benefits of Implementation】 - Stabilization of high-speed data communication - Reduction of signal loss - Improvement of communication quality

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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Aerospace-grade high heat-resistant, low-loss flexible substrate

Aerospace-grade high heat-resistant, low-loss flexible substrate

Flexible substrates for aerospace applications that achieve both lightweight and high performance.

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. At the same time, high safety and reliability are required, making electronic components that can perform stably even in harsh environments crucial. Our high heat-resistant, low-loss flexible circuit boards are lightweight yet equipped with high heat resistance, low loss characteristics, and chemical resistance, meeting the stringent demands of aerospace applications. 【Application Scenarios】 * Aircraft * Space probes * Satellites * Electronic devices requiring weight reduction 【Benefits of Implementation】 * Improved fuel efficiency through weight reduction * Stable operation in harsh environments * High reliability * Increased design flexibility

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

High heat-resistant, low-loss all-LCP flexible substrate for automotive applications.

A flexible substrate that achieves high reliability even in harsh automotive environments.

In the automotive industry, the miniaturization and high performance of electronic devices are advancing, while high reliability is also required. Electronic components must operate stably even in harsh environments such as engine rooms and vehicle interiors, where temperature changes, vibrations, and oil exposure occur. Conventional flexible printed circuits have faced challenges regarding heat resistance and chemical resistance. Our all-LCP flexible printed circuits address these issues and contribute to improving the reliability of automotive electronic devices. 【Application Scenarios】 - Engine control units - In-vehicle displays - Various sensors - ADAS (Advanced Driver Assistance Systems) 【Benefits of Implementation】 - Stable operation in high-temperature environments - High durability against vibrations and shocks - Suppression of degradation from oil and chemicals - Assurance of long-term product lifespan

  • スクリーンショット 2025-02-19 085503.jpg
  • Printed Circuit Board
  • Substrate

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