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Substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Aug 05, 2026～Sep 01, 2026
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Substrate Product List

91～120 item / All 208 items

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Connector for board-to-board (FPC) connection | FB35L series

Connector for board-to-board (FPC) connection | FB35L series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35L series connector is designed for board-to-FPC connections with a 0.35mm pitch, a mating height of 0.7mm, and a depth of 1.9mm. It employs a metal cap method where the metal is integrally molded at the plug end, enhancing strength against damage in case of misalignment, resulting in a robust structure. Additionally, metal is placed in the center of the receptacle connector to further improve strength. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF document or feel free to contact us.*

  • Automotive Connectors
  • Substrate

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Connector for board-to-board (FPC) connection | FB35AT6 series

Connector for board-to-board (FPC) connection | FB35AT6 series

Connector with a height of 0.6mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT6 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.6mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.6mm ■ Available core lineup: 6 cores, 8 cores, 10 cores, 18 cores ■ Adoption of a metal cap design achieves a robust structure ■ Metal is placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduction in the number of contact cores ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF materials or feel free to contact us.

  • Automotive Connectors
  • Substrate

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[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

[Example of Printed Circuit Board Manufacturing] Rigid-Flexible Board

Effective even in cases where component mounting is limited! Here are examples of rigid-flexible circuit board manufacturing.

We would like to introduce an example of our "Rigid-Flexible Printed Circuit Board" manufacturing. This board integrates rigid and flexible substrates. It is effective for use in compact spaces, such as small modules, or in cases where component placement is limited. Please feel free to contact us when you need assistance. 【Overview】 ■ 6-layer IVH structure (FPC layers L4-5) ■ 4-layer 1-2-1 build-up structure (FPC layers L2-3) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Substrate

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Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

Flexible printed circuit board "High Flex FPC" [Over 10 million bending cycles]

A flexible circuit board that achieved over 10 million bending characteristics at 70℃! It is flexible and excels in bending performance even in high-temperature environments, ensuring high reliability!

The "High Flex FPC" is a flexible printed circuit board (FPC) with bending characteristics that exceed 10 million cycles at 70°C. By using a high Tg (glass transition temperature) coverlay, it suppresses the degradation of bending characteristics at high temperatures. It is flexible and excels in bending performance even in high-temperature environments, offering high reliability. 【Features】 ■ Significantly improved bending characteristics by using rolled copper foil ■ Capable of high-speed transmission of over Gbps with low loss ■ Easy to match characteristic impedance 　・Characteristic impedance value can be matched at differential 100±15Ω *For more details, please request materials or view the PDF data from the download.

  • Printed Circuit Board
  • Substrate

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High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Substrate

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Connector for board-to-board (FPC) connections | FB35AA series

Connector for board-to-board (FPC) connections | FB35AA series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AA series connector is designed for connecting PCBs to FPCs with a 0.35mm pitch, a mating height of 0.8mm, and a depth of 1.8mm. It adopts a metal cap method where the metal is integrally molded at the plug end, providing a robust structure that enhances strength against damage in case of misalignment. 【Features】 - The adoption of the metal cap method achieves a robust structure. - The tabs can carry up to 3A as power contacts, allowing for a reduction in the number of contact pins and contributing to space-saving. - It features a highly reliable two-point contact structure. - A recess is provided in the plug contact to improve the click feel and extraction force during insertion. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Automotive Connectors
  • Substrate

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Connector for board-to-board (FPC) connection | FB35AT5 series

Connector for board-to-board (FPC) connection | FB35AT5 series

Connector with a height of 0.5mm, 0.35mm pitch, compact, ultra-low profile, and narrow pitch.

The FB35AT5 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.5mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.5mm ■ Number of contacts available: 8 contacts ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement through an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → achieving space-saving due to reduced number of contact pins ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improves the click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Connector for board-to-board (FPC) connection | FB3BA5 series

Connector for board-to-board (FPC) connection | FB3BA5 series

Height of 0.5mm, 0.3mm pitch, ultra-low profile and ultra-compact connector in the smallest class in the industry.

The FB3BA5 series connector is a board-to-board (FPC) connector with a 0.3mm pitch, a mating height of 0.5mm, and a depth of 1.55mm. 【Features】 ■ Pitch: 0.3mm, Mating height: 0.5mm, Product width: 1.55mm ■ Number of pins available: 24, 36 pins ■ Adoption of a metal cap design for a robust structure ■ The metal cap can carry up to 3.0A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength due to the inner metal armor structure ■ Reliable two-point contact structure ■ Achieves a good click feel during mating and improved extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Connector for board-to-board (FPC) connection | FB35AT8 series

Connector for board-to-board (FPC) connection | FB35AT8 series

Connector with a height of 0.8mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35AT8 series connector is a connector for board-to-board (FPC) connections with a pitch of 0.35mm, a mating height of 0.8mm, and a depth of 1.65mm. 【Features】 ■ Pitch of 0.35mm, product width of 1.65mm, mating height of 0.8mm ■ Available core counts: 12 and 16 cores ■ Adoption of a metal cap design for a robust structure ■ Metal placed in the center of the receptacle connector: further strength enhancement with an inner metal armor structure ■ The metal cap can carry up to 3A as a power contact → realization of space-saving due to reduced contact core count ■ Highly reliable two-point contact structure ■ Plug contact recess structure: improved click feel and extraction force during mating *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit boards (FPC) using liquid crystal polymer (LCP) as an insulating material. Excellent high-frequency characteristics and dimensional stability, achieving precise characteristic impedance matching in FPC. ● Achieving Gbps-level high-speed transmission By adopting LCP as the insulating substrate, it offers a flat low dielectric constant, low dielectric loss tangent, and low moisture absorption across a wide frequency range, resulting in low transmission loss and high dimensional stability. Achieving Gbps-level high-speed transmission. ● Achieving low EMI Low EMI is realized through precise characteristic impedance matching enabled by fine pattern formation technology and high dimensional stability. ● Adoption of the "Bump Build-Up Method" By using conductive bumps as interlayer connection materials in the "Bump Build-Up Method," drilling and plating processes are unnecessary, achieving cost reduction and precise characteristic impedance matching. ● Use of halogen-free materials Adoption of halogen-free materials with consideration for environmental conservation. ● Expansion into various applications Excellent flexibility allows for secondary processing such as bending and electronic component mounting. Proven performance as high-speed differential transmission standard cables such as LVDS, HDMI, and PCI Express.

  • Printed Circuit Board
  • Substrate

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Release the heat - Matsuwa's heat dissipation board

Release the heat - Matsuwa's heat dissipation board

Hot summer. Matsuwa's circuit boards are super COOL! Thick copper, metal, copper inlay boards, etc. For heat dissipation boards, please consult Matsuwa Industries.

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

  • Printed Circuit Board
  • Substrate

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Connector for board-to-board (FPC) connection | FB35S series

Connector for board-to-board (FPC) connection | FB35S series

Connector with a height of 0.7mm, 0.35mm pitch, compact, low profile, and narrow pitch.

The FB35S series connector is a connector for connecting a board to an FPC, with a short length of 2.1mm, which is 0.2mm shorter than the FB35 receptacle connector, a pitch of 0.35mm, and a mating height of 0.7mm. Like the FB35 series connector, it features power contacts capable of carrying a current of 4A through the tabs, contributing to the miniaturization and slimness of devices. 【Features】 ■ Receptacle connector short length (tail to tail) 2.1mm ■ The tabs can carry up to 4A as power contacts. When carrying high current, space-saving can be achieved by reducing the number of contact pins. ■ The receptacle tabs have an insert structure that surrounds the outer circumference, reducing damage during misalignment insertion of the connector. ■ A recessed structure has been added to the plug contacts to improve the click feel during insertion and the extraction force. *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Board-to-board (FPC) battery connection connector | FPB4 series

Board-to-board (FPC) battery connection connector | FPB4 series

Low-profile, compact connector for high-capacity batteries capable of 8.0A current with a mating height of 0.6mm.

The FPB4 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 8A, making it suitable for applications requiring high current, such as battery connections. 【Features】 ■ Power contacts capable of carrying 8A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 2 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design for a robust structure ■ Metal cap can carry up to 2.5A as a power contact ■ Metal placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and increased withdrawal force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Board-to-board (FPC) battery connection connector | FPB6 series

Board-to-board (FPC) battery connection connector | FPB6 series

Ultra-low profile and compact connector for high-capacity batteries capable of 7.0A current with a fitting height of 0.6mm.

The FPB6 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 7A, making it suitable for applications such as battery connections that require high current. 【Features】 ■ Power contacts capable of carrying 7A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 4 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design achieves a robust structure ■ The metal cap can carry up to 2.5A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Achieves a good click feel during mating and improved extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Board-to-board (FPC) battery connection connector | FPB7 series

Board-to-board (FPC) battery connection connector | FPB7 series

Ultra-low profile and compact connector for high-capacity battery capable of 7.0A current with a mating height of 0.6mm.

The FPB7 series connector is designed for board-to-board (FPC) connections with a mating height of 0.6mm. It features power contacts capable of carrying 7A, making it suitable for applications such as battery connections that require high current. 【Features】 ■ Power contacts capable of carrying 7A ■ Mating height of 0.6mm, product width of 1.95mm ■ Number of pins: 6 signal contacts, 2 power contacts, 2 metal caps ■ Adoption of a metal cap design for a robust structure ■ Metal caps can carry up to 2.5A as power contacts ■ Metal placed in the center of the receptacle connector: enhanced strength due to inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and enhanced extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Substrate

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Fine flexible circuit board

Fine flexible circuit board

Achieving fine pattern processing using methods such as etching and additive techniques!

FPC (Flexible Printed Circuit) boards are circuit boards that use polyimide film as the base material and have copper electrodes patterned on them. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards by using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction treatment on both sides is possible. For more details, please contact us or refer to the catalog.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Processing Contract
  • Substrate

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5G Electronic Materials PTFE FPC Fluororesin Substrate

5G Electronic Materials PTFE FPC Fluororesin Substrate

Sheet processing of ultra-thin resin sheets with low dielectric properties, high strength, and low elasticity.

We have over 1,000 prototypes related to 5G-related electronic materials, FPC, CASE-related, power device-related, and various others. This includes metal foils, electrode foils, insulating foils, separator foils, films, sheets, and rolls. You can rest assured with any materials, components, or processing methods. We can provide optimal proposals tailored to each customer, each development project, and each stage from prototyping to mass production in a one-stop manner. This is our greatest value, "Total Service for Punching Out." Please feel free to contact us about anything. We will respond promptly and sincerely, putting in our best effort.

  • Other electronic parts
  • Substrate

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Ground slit MSL structure flexible printed circuit board

Ground slit MSL structure flexible printed circuit board

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • High frequency/microwave parts
  • Wiring materials
  • Substrate

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Narrow pitch pad on beer flexible substrate

Narrow pitch pad on beer flexible substrate

By directly providing vias on the pitch pad, we contribute to the high-density implementation of FPC.

By incorporating non-through filled vias into extremely small pads with narrow pitch, it becomes possible to implement electronic components at a higher density. This enables the miniaturization of flexible substrates and the implementation of multi-pin SoC chips. 【High-Density Implementation Possible】 It is possible to directly create filled vias on very small pads (φ100μm) with a pitch of 150μm, allowing for higher density component implementation. 【Easy Miniaturization】 Since high-density components can be implemented, it allows for the design of miniaturized substrates.

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  • High frequency/microwave parts
  • Substrate

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Connector for board-to-board (FPC) connection | FB35AW6 series

Connector for board-to-board (FPC) connection | FB35AW6 series

Connector with a height of 0.6mm, 0.35mm pitch, capable of carrying 7.0A, ultra-low profile and compact power composite type.

The FB35AW6 series connector is a board-to-board (FPC) connector with a 0.35mm pitch, a mating height of 0.6mm, and a depth of 1.95mm. This connector features a combined terminal arrangement for signal contacts and power contacts. 【Features】 ■ Power contacts capable of carrying 7A ■ Pitch of 0.35mm, product width of 1.95mm, mating height of 0.6mm ■ Available core counts: 10, 14, 18, 20, 22 cores ■ Adoption of a metal cap design for a robust structure ■ The metal cap can carry up to 2.5A as a power contact ■ Metal is placed in the center of the receptacle connector: enhanced strength through an inner metal armor structure ■ Highly reliable two-point contact structure ■ Improved click feel during mating and increased extraction force *For more details, please refer to the PDF document or feel free to contact us.

  • Automotive Connectors
  • Substrate

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Introduction to printed circuit boards.

Introduction to printed circuit boards.

We propose highly reliable and high-performance circuit boards that support a wide range of fields, including information communication and industry!

A "printed circuit board" refers to a substrate on which a pattern (electronic circuit) called a pattern is printed on the surface of an insulating board. Our company proposes high-reliability and high-performance substrates tailored to customer requirements, supporting a wide range of fields such as "information and communication," "semiconductor-related," "aerospace," and "industrial." We offer a rich lineup of products, including flexible substrates that achieve space-saving through the reduction of supporting materials, such as "self-supporting sliding FPC," "high-flex FPC," and "high-speed transmission FPC," as well as innovative products with self-supporting and high-flex capabilities. 【Features】 - Lamination, plating, and patterning technologies that support the manufacturing of characteristic impedance-controlled substrates - In-house developed order management systems and design/manufacturing tools that accommodate single prototype and development needs, as well as small to medium volume production of various types - Highly flexible and sliding flexible substrates *For more details, please refer to the external link page or feel free to contact us.

  • Wiring materials
  • Substrate

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Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Production of ultra-long flexible circuit boards 20M sensor FPC [Board manufacturing achievements]

Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.

We would like to introduce our achievements in substrate manufacturing. We optimized each device to handle materials in roll form and produced ultra-long substrates with a product size of 20m. We perform exposure, development, and etching processes, using polyester materials to reduce costs. We achieved low-cost production through suggestions during the manufacturing method and product design stages, as well as innovations in the manufacturing process. 【Basic Specifications】 ■ Material: Polyester/0.075 Cu35/0μ ■ Processes: Etching, simple shape processing ■ Substrate Size: 20000×59 ■ Others: Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Substrate

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Rigid-flexible substrate

Rigid-flexible substrate

Supports up to 10 layers for the rigid part and 6 layers for the flexible part. For wearable camera modules.

We provide rigid-flexible substrates with a rigid part and a flexible part in an integrated structure. The rigid part can support up to 10 layers, and the flexible part can support up to 6 layers. In addition to the standard configuration, we can also accommodate special structures such as a configuration with two FPCs, a reinforced plate for the FPC part, two types of materials for the rigid part, and different thicknesses for the rigid part. We also have a track record of manufacturing high-multilayer rigid-flex (5-16-5 structure, flexible part 2 layers × 8, Isola 370HR + Dupont AP8525R materials). We have experience in applications for camera modules, wearable devices, and sensor components.

  • Circuit board design and manufacturing
  • Substrate

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If you are having difficulty realizing various aspects of printed circuit boards, please feel free to consult us.

If you are having difficulty realizing various aspects of printed circuit boards, please feel free to consult us.

We propose a manufacturing method that can fulfill our customers' requests based on our 54 years of know-how and experience!

We accept "printed circuit board manufacturing" at our company. If you are having difficulty realizing your project, please feel free to consult with us. 【Features】 - Materials that combine both flexible and rigid substrate materials - Other materials can also be ordered or supplied - Production can start from just one piece, with options for specifying delivery destinations, advancing production timelines, board specifications, partial processing, etc. - If you want to reduce costs, need specific processing, want to conduct processing tests with supplied materials, or have inquiries about specifications and manufacturing methods before production, we can assist. - We have equipment capable of handling large and long items, and we can manufacture comprehensively in-house. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Substrate

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Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts
  • Substrate

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High Current Flexible Circuit Board [*FPC Technology Catalog Available]

High Current Flexible Circuit Board [*FPC Technology Catalog Available]

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Printed Circuit Board
  • Substrate

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[Design and Production Example] Coil_FPC for Motor Field Windings

[Design and Production Example] Coil_FPC for Motor Field Windings

A circuit is formed considering the thickness of the flexible printed circuit (adjusting the L/S pitch). For the motor's field winding (for generating a high electromagnetic field) flexible printed circuit. *Source: Gunma University

We would like to introduce a case study of the design and production of field winding using flexible substrates that we conducted. To wind around the main pole piece, a circuit was formed considering the thickness of the flexible substrate so that the coil wiring overlaps at the same position (L/S pitch was corrected and adjusted). Due to the long structure, we implemented correction processing considering the shrinkage characteristics of the flexible material and the etching factor of the conductor, utilizing ultra-thin copper foil material. 【Case Overview】 ■L/S=100μ/100μ ■Specifications: Double-sided structure ■Base PI thickness: 25μ (no adhesive material) ■Cu thickness: 2μ (excluding Cu plating thickness) *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Substrate

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[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

[Design and Manufacturing Example] Stator Coil for Ultra-Small Motor_FPC

Base PI thickness is 25μ, Cu thickness is 18μ! A case study of coil flex design and manufacturing aimed at achieving a strong magnetic field formation.

We would like to introduce a case study of the design and manufacturing of coil flex aimed at achieving a very small yet powerful magnetic field formation, as requested by the manufacturer. Within an outer dimension of approximately 4.0mm x approximately 3.0mm, we configured a single-sided structure with L/S=35μ/35μ, 6 turns x 3 blocks. Additionally, within an outer dimension of approximately 4.0mm x approximately 10.0mm, we configured a double-sided structure with L/S=70μ/50μ, 4 turns x 3 blocks. The materials used for both the single-sided and double-sided structures are adhesive-free, with a base PI thickness of 25μ and a copper thickness of 18μ. 【Case Overview】 ■ Materials Used - Single-sided: Adhesive-free material - Double-sided: Adhesive-free material ■ Base PI Thickness: 25μ ■ Copper Thickness: 18μ *For more details, please refer to the PDF document or feel free to contact us.

  • Inductor Coil
  • Contract manufacturing
  • Other contract services
  • Substrate

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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Substrate

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