I would like to briefly introduce the successful exhibition content of FPC.
◎Introducing Our Company's "Strengths" in the Processing Engineering
>> There are multiple important processing steps in FPC manufacturing.
Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development.
We have introduced the "strengths" we have cultivated over many years in each process:
<Design> Circuit design, artwork, S-parameter analysis
<Layer Connection> Build-up FPC, filled vias, small-diameter vias
<Circuit Formation> MSAP method, thin copper, thick copper
<Insulation Processing> High-precision openings ±20μm, LCP coverlay
<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.)
<Post-Processing> High-precision contour processing ±50μm, a variety of tools
<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support
◎Introducing Samples of Each Processing Step During Manufacturing
>> Normally, there are no opportunities to see anything other than the finished product,
but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing.
*Through-hole drilling, exposure/development, etching, contour processing, etc.